JP2000114410A - Microwave integrated circuit device and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a microwave integrated circuit device which can easily obtain a desired cut-off frequency without changing the external size of the whole device. SOLUTION: In a microwave integrated circuit device, a cap 3 fixed to a packaging stem 2 mounted with a microwave integrated circuit 1 has an outer peripheral section 3a which becomes a fixing section and a recess 3b provided inside the outer peripheral section 3a, and a projecting section 3c is provided in the recess 3b. Since the space 4 in the recess 3b is narrowed by the projecting section 3c, the cut-off frequency at which microwaves are propagated in a package rises. When the size of the projecting section 3c is changed, the cut-off frequency can be changed arbitrarily without changing the other section.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a microwave integrated circuit device and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, in a device such as an amplifier module using a microwave integrated circuit, a hollow cap is fixed to a packaging stem on which the microwave integrated circuit is mounted, and the microwave integrated circuit is placed in a concave portion of the cap. A sealed configuration is generally employed. In this configuration,
The space in the concave portion of the cap in which the microwave integrated circuit is sealed functions as a waveguide that is a transmission line through which microwaves propagate.

It is necessary to use such an integrated circuit device having a cutoff frequency corresponding to the operating frequency. For example,
With the integration of functions for miniaturization of electric and electronic equipment, it is necessary to increase the cut-off frequency in the concave part that acts as a waveguide in order to construct a high-gain, high-output amplifier module in the microwave band. is there. In general, in order to obtain a high cut-off frequency such as a microwave band, the cap must be extremely small, so that the work of fixing the cap to the packaging stem is required to be precise, or the microwave integrated circuit is formed with a minute recess. For example, it is necessary to perform high-precision alignment so that the semiconductor device is sealed in the inside, and thus the workability is reduced, and there is a problem in terms of production efficiency and production cost.

In order to increase the cutoff frequency without reducing the size of the cap itself, it has been considered to provide a partition in the space inside the concave portion of the cap and to make this space substantially smaller. Therefore, as shown in FIG. 5, a metal plate 13 is provided between the packaging stem 11 and the cap 12.
There is a configuration in which the space 14 in the recess 12a of the cap 12 is divided by using the metal plate 13 as a partition to narrow the space acting as a waveguide.

[0005]

However, in the above-described conventional configuration, the contact pressure between the metal plate 13 and the packaging stem 11 and the cap 12 varies due to a manufacturing error or the like, and a sufficient contact pressure can be obtained. If not, the holding of the metal plate 13 is incomplete and the function as a partition of the space 14 is insufficient, so that a desired cutoff frequency may not be obtained. Thus, the yield is low and the production efficiency is low.

As shown in FIG. 6, there is a configuration in which a resistor 16 is disposed on the inner surface of the cap 15 to adjust the frequency. However, the loss is large and is not suitable for a high-output amplifier.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a microwave integrated circuit device which has a simple structure, can be manufactured easily and with high efficiency, and can easily obtain a desired cutoff frequency, and a method of manufacturing the same.

[0008]

The microwave integrated circuit device according to the present invention is characterized in that the microwave integrated circuit, a packaging stem on which the microwave integrated circuit is mounted, and a cover for covering the microwave integrated circuit. A hollow cap secured to the packaging stem, wherein the cap has an outer edge secured to the packaging stem, a recess inside the outer edge, and a space within the recess protruding into the recess. And a convex portion that substantially narrows the distance. Then, the space is narrowed by the protruding portion to a size at which a desired cutoff frequency can be obtained.

Further, it is preferable that the projecting portion is formed integrally with the cap.

The method of manufacturing a microwave integrated circuit according to the present invention is characterized in that an outer edge portion, a concave portion inside the outer edge portion,
Forming a hollow cap having a convex portion projecting into the concave portion and substantially narrowing the space in the concave portion, mounting the microwave integrated circuit on a packaging stem, and Fixing the outer edge of the cap to the packaging stem so as to cover the package stem, wherein in the step of forming the cap, the convex portion is formed so that a space in the concave portion has a size capable of obtaining a desired cutoff frequency. Where the dimensions of the shape are set.

The method may further include a step of changing the cutoff frequency by changing a size of the convex portion.

It is preferable that the convex portion is formed integrally with the cap.

According to such a configuration, in the microwave integrated circuit device, the projecting portion is provided so that the space in the concave portion of the hollow cap has a size corresponding to a desired cutoff frequency, so that the operating frequency can be reduced. Accordingly, the cut-off frequency in the package can be arbitrarily set without changing the package stem. Further, since the outer shape of the cap is not changed, metal fittings and the like for mounting and fixing the integrated circuit device can be shared. In particular, when the convex portion is formed integrally with the cap, the production is easy and the stability is high.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

The embodiment of the present invention shown in FIGS. 1 and 2 has a configuration in which a radiation shielding cap 3 is fixed to a packaging stem 2 on which a microwave integrated circuit 1 is mounted. The cap 3 has an outer edge 3a serving as a fixing portion to the packaging stem 2 and a concave portion 3b provided inside the outer edge 3a, and further, a convex portion 3c is provided in the concave portion 3b. ing. The concave portion 3b is formed by the convex portion 3c.
The space 4 inside is narrowed. Then, the microwave integrated circuit 1 is sealed in the narrowed space 4,
The packaging stem 2 and the cap 3 are aligned and fixed. In addition, the microwave integrated circuit 1
This includes both a chip-shaped integrated circuit and a substrate on which the integrated circuit is provided.

By the way, the cutoff frequency f _c of the integrated circuit device common packaging as shown in FIGS. 3 and 4, the integrated circuit 5 is sealed, the recess 7 of the cap 7
Because regarded space 6 in a rectangular waveguide and the inner diameter width of space 6 a, the speed of light in the medium (air) is is c, it is found to be f _c = _c / 2a.

Therefore, if the width of the concave portion 3b is a ₁ and the width of the convex portion 3c is a ₂ when the convex portion 3c is absent in FIGS. cutoff frequency f _c1 is f _c1 = c / 2a _1, contrast, cut-off frequency f _c2 in the case where there is a convex portion 3c (the present embodiment) _{is, f c2 = c / 2 (} a 1 -a ₂ ) and _fc1 < _fc2 . The cutoff frequency is increased by providing the convex portion 3c. That is, the convex portion 3c functions in the same manner as the metal plate 13 as the partition in the conventional example shown in FIG. 5, and substantially narrows the space 4 in the concave portion 3b. As a result, the cutoff frequency at which microwaves propagate inside the package can be increased equivalently. Since the convex portion 3c is formed integrally with the cap 3, the function as a partition of the space in the concave portion 3b is reliable, and the yield is good.

[0018] Moreover, (including width a ₁₎ cap 3 outer shape of itself by changing the width a ₂ of the convex portion 3c without changing, can be varied cutoff frequency.
Of course, it is possible to use the formula for _{f c2 = c / 2 (a} 1 -a 2), to easily calculate the width a ₂ of the convex portion 3c necessary to obtain the desired cut-off frequency.

Therefore, according to the present embodiment, the width a ₂ of the convex portion 3c is calculated so as to obtain a desired cutoff frequency,
A cap 3 having a convex portion 3c formed so as to have the calculated width is manufactured in advance, and is fixed to a package stem 2 on which a microwave integrated circuit 1 is mounted. The circuit device can be easily manufactured. When manufacturing microwave integrated circuit devices having different cutoff frequencies, caps 3 having convex portions 3c having different widths may be manufactured and fixed to the package stem 2. In this case, there is no need to change the shape of the cap 3 other than the protruding portion 3c, and in particular, since the outer shape of the cap 3 can be kept constant, the cap 3 manufacturing apparatus does not need to be significantly changed. Further, since the semiconductor integrated circuit device can have the same outer shape even when the cutoff frequency is different, the same mounting bracket, fixing bracket and the like are used in common.

[0020]

According to the present invention, the space in the concave portion of the cap of the microwave integrated circuit device can be narrowed by the convex portion, a high cutoff frequency can be easily obtained, and the external shape of the whole device needs to be changed. There is no. A desired cutoff frequency can be easily obtained by arbitrarily changing the width of the convex portion.

Since the convex portion can be formed integrally with the cap, it acts stably as a space partition in the concave portion, resulting in a good yield and excellent productivity. In particular, in the case of a high gain amplifier, it is necessary to ensure sufficient spatial isolation in the package for its stable operation, and the effect of the present invention is remarkable.

In addition, since the microwave integrated circuit devices having various cutoff frequencies can all be made to have the same outer shape, the package stem and the mounting bracket can be used in common without any change, so that there is an advantage in cost. Is big.

[Brief description of the drawings]

FIG. 1 is a front sectional view showing a microwave integrated circuit device according to one embodiment of the present invention.

FIG. 2 is a plan sectional view of the microwave integrated circuit device shown in FIG. 1;

FIG. 3 is a front sectional view of a conventional general microwave integrated circuit device.

FIG. 4 is a plan sectional view of the conventional microwave integrated circuit device shown in FIG.

FIG. 5 is a front sectional view of an example of a conventional microwave integrated circuit device.

FIG. 6 is a front sectional view of another example of the conventional microwave integrated circuit device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Microwave integrated circuit device 2 Packaging stem 3 Cap 3a Outer edge 3b Depression 3c Projection 4 Space 5 Integrated circuit 6 Space 7 Cap 7a Depression 11 Packaging stem 12 Cap 13 Metal plate 14 Space 15 Cap 16 Resistor

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[Procedure amendment]

[Submission date] September 8, 1999 (1999.9.8)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0008

[Correction method] Change

[Correction contents]

[0008]

The microwave integrated circuit device according to the present invention is characterized in that the microwave integrated circuit, a packaging stem on which the microwave integrated circuit is mounted, and a cover for covering the microwave integrated circuit. and a hollow cap which is fixed to the packaging stem, said cap, and the outer edge portion which is fixed to the packaging stem, and inner recess of the outer edge, before projecting into said recess
A convex portion that substantially narrows the space in the concave portion in a non-contact state with the package stem . The convex portion narrows the space to a size at which a desired cutoff frequency can be obtained.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Change

[Correction contents]

Further, it is preferable that the convex portion is formed integrally with the cap.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Change

[Correction contents]

The method of manufacturing a microwave integrated circuit according to the present invention is characterized in that an outer edge portion, a concave portion inside the outer edge portion,
Forming a hollow cap having a convex portion projecting into the concave portion and substantially narrowing the space in the concave portion, mounting the microwave integrated circuit on a packaging stem, and in the and a step of fixing the outer edge of the cap to the packaging system, the step of forming the cap to cover the Pas
The dimension of the convex portion is set so that it is not in contact with the package stem and the space in the concave portion has a size that can obtain a desired cutoff frequency.

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0013

[Correction method] Change

[Correction contents]

According to such a configuration, in the microwave integrated circuit device, the convex portion is provided so that the space in the concave portion of the hollow cap has a size corresponding to a desired cutoff frequency. The cut-off frequency in the package can be arbitrarily set without changing the package stem according to the operating frequency. Further, since the outer shape of the cap is not changed, metal fittings and the like for mounting and fixing the integrated circuit device can be shared. In particular, when the convex portion is formed integrally with the cap, the production is easy and the stability is high.

[Procedure amendment 6]

[Document name to be amended] Statement

[Correction target item name] Explanation of sign

[Correction method] Change

[Correction contents]

DESCRIPTION OF SYMBOLS 1 Microwave integrated circuit device 2 Packaging stem 3 Cap 3a Outer edge 3b Depression 3c Convex portion 4 Space 5 Integrated circuit 6 Space 7 Cap 7a Depression 11 Packaging stem 12 Cap 13 Metal plate 14 Space 15 Cap 16 Resistor

Claims (6)

[Claims] A microwave integrated circuit; a packaging stem on which the microwave integrated circuit is mounted; and a hollow cap fixed to the packaging stem so as to cover the microwave integrated circuit. A cap having an outer edge fixed to the packaging stem, a concave portion inside the outer edge, and a convex portion projecting into the concave portion and substantially narrowing a space in the concave portion. Integrated circuit device. 2. The projecting portion narrows the space to a size at which a desired cutoff frequency can be obtained.
3. The microwave integrated circuit device according to claim 1. 3. The microwave integrated circuit device according to claim 1, wherein the protrusion is formed integrally with the cap. 4. An outer edge portion, a concave portion inside the outer edge portion,
Forming a hollow cap having a convex portion projecting into the concave portion and substantially narrowing the space in the concave portion, mounting the microwave integrated circuit on a packaging stem, and Fixing the outer edge of the cap to the packaging stem so as to cover the space, wherein in the step of forming the cap, the protrusion is formed so that a space in the concave portion has a size capable of obtaining a desired cutoff frequency. The manufacturing method of the microwave integrated circuit device in which the size of the shape is set. 5. The method of manufacturing a microwave integrated circuit device according to claim 4, further comprising the step of changing the cutoff frequency by changing the size of the convex portion. 6. The method of manufacturing a microwave integrated circuit device according to claim 4, wherein said convex portion is formed integrally with said cap.