JP3272816B2 - Coaxial beads - Google Patents
Coaxial beadsInfo
- Publication number
- JP3272816B2 JP3272816B2 JP12880493A JP12880493A JP3272816B2 JP 3272816 B2 JP3272816 B2 JP 3272816B2 JP 12880493 A JP12880493 A JP 12880493A JP 12880493 A JP12880493 A JP 12880493A JP 3272816 B2 JP3272816 B2 JP 3272816B2
- Authority
- JP
- Japan
- Prior art keywords
- dielectric
- coaxial
- outer conductor
- conductor
- filled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、マイクロ波やミリ波回
路などに用いられる同軸ビーズに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coaxial bead used for a microwave or millimeter wave circuit.
【０００２】[0002]
【従来の技術】マイクロ波やミリ波回路などで用いられ
る増幅器や発振器は、例えばモジュールケースの内部に
構成される。そして、モジュールケース内部の増幅器や
発振器に対する信号の入出力のために、モジュールケー
スの壁面に入出力端子が形成される。このとき、モジュ
ールケースに形成される入出力端子が気密構造となるよ
うに、ビーズと呼ばれる同軸線路構造の部品、いわゆる
同軸ビーズが用いられる。 ここで、従来の同軸ビーズ
について、図４を参照して説明する。2. Description of the Related Art Amplifiers and oscillators used in microwave and millimeter wave circuits are formed, for example, inside a module case. Input / output terminals are formed on the wall surface of the module case for inputting / outputting signals to / from an amplifier and an oscillator inside the module case. At this time, a component having a coaxial line structure called a bead, that is, a so-called coaxial bead is used so that an input / output terminal formed in the module case has an airtight structure. Here, a conventional coaxial bead will be described with reference to FIG.
【０００３】４１は中心導体で、中心導体４１を囲むよ
うに外導体４２が設けられる。そして、中心導体４１と
外導体４２との間にはガラス等の誘電体４３が充填され
る。なお、中心導体４１は外導体４２より長く形成さ
れ、その両端は中心導体４１と外導体４２で構成される
同軸部分から突出する構造になっている。[0003] Reference numeral 41 denotes a center conductor, and an outer conductor 42 is provided so as to surround the center conductor 41. The space between the center conductor 41 and the outer conductor 42 is filled with a dielectric 43 such as glass. The center conductor 41 is formed to be longer than the outer conductor 42, and both ends of the center conductor 41 project from a coaxial portion formed by the center conductor 41 and the outer conductor 42.
【０００４】上記した構造の同軸ビーズを、増幅器や発
振器を収納するモジュールケースの例えば壁面に穴を設
け、その穴の内面に、同軸ビーズの外導体の外周面を半
田づけなどで固定し、気密構造の入出力端子を形成して
いる。[0004] A coaxial bead having the above structure is provided with a hole in, for example, a wall surface of a module case accommodating an amplifier or an oscillator, and an outer peripheral surface of an outer conductor of the coaxial bead is fixed to an inner surface of the hole by soldering or the like. The input / output terminals of the structure are formed.
【０００５】[0005]
【発明が解決しようとする課題】ところで、モジュール
ケースの壁面に設けられた気密構造の入出力端子を通し
て信号を伝送する場合、入出力端子を構成する同軸ビー
ズの中心導体や外導体、あるいは誘電体の各部分におい
て、マイクロ波の伝送損失が生じる。このうち誘電体で
の損失が特に大きい。When a signal is transmitted through an airtight input / output terminal provided on the wall of the module case, the center conductor, outer conductor, or dielectric of the coaxial bead constituting the input / output terminal is required. , A transmission loss of microwave occurs. Among them, the loss in the dielectric is particularly large.
【０００６】入出力端子部分でのマイクロ波の伝送損失
を少なくする方法として、例えば同軸ビーズ全体の長さ
を短くすることが考えられる。しかし、同軸ビーズの長
さを短くすると外導体の長さも短くなる。このため、モ
ジュールケースなどに半田づけされる外導体の外周面積
が小さくなり、気密もれが起こりやすくなる。また、同
軸ビーズの寸法が変わるので、市販の同軸ビーズに合わ
せて加工されたモジュールケースをそのまま使用できな
いという問題もある。As a method of reducing the microwave transmission loss at the input / output terminal, for example, it is conceivable to shorten the entire length of the coaxial bead. However, when the length of the coaxial bead is reduced, the length of the outer conductor is also reduced. For this reason, the outer peripheral area of the outer conductor to be soldered to the module case or the like is reduced, and airtight leakage is likely to occur. In addition, since the dimensions of the coaxial beads change, there is also a problem that a module case processed according to commercially available coaxial beads cannot be used as it is.
【０００７】本発明は、マイクロ波の伝送損失が少な
く、かつ、気密性が確保できる同軸ビーズを提供するこ
とを目的とする。An object of the present invention is to provide a coaxial bead having a small microwave transmission loss and ensuring airtightness.
【０００８】[0008]
【課題を解決するための手段】本発明は、中心導体とこ
の中心導体を囲む外導体との間に、誘電体を充填して構
成される同軸ビーズにおいて、前記誘電体を充填する領
域を部分的にし、かつ、前記誘電体が充填される部分と
前記誘電体が充填されない部分とで、前記外導体の内径
を相違させている。According to the present invention, there is provided a coaxial bead formed by filling a dielectric between a center conductor and an outer conductor surrounding the center conductor. In addition, the inner diameter of the outer conductor is different between a portion filled with the dielectric and a portion not filled with the dielectric.
【０００９】[0009]
【作用】上記の構成によれば、誘電体が充填された領域
が同軸ビーズ全体でなく部分的になるため、誘電体が充
填された領域が少なくなった分、マイクロ波の伝送損失
が少なくなる。また、外形寸法は従来のものと変わらな
いので、モジュールケースなどに半田づけされる外導体
の外周面積も、これまで通り維持でき、気密性を確保で
きる。According to the above construction, since the region filled with the dielectric material is not the whole coaxial bead but a part thereof, the transmission loss of the microwave is reduced by the reduced region filled with the dielectric material. . Further, since the outer dimensions are the same as those of the conventional case, the outer peripheral area of the outer conductor to be soldered to the module case or the like can be maintained as before, and airtightness can be secured.
【００１０】[0010]
【実施例】本発明の一実施例について、図１を参照して
説明する。An embodiment of the present invention will be described with reference to FIG.
【００１１】１は中心導体で、この中心導体１を囲むよ
うに外導体２が設けられている。なお、外導体２の内径
は、その延長方向で相違しており、一部区間Ａで大き
く、そして、一部区間Ｂで小さく構成される。また、中
心導体１と外導体２との間の間隙のうち、内径が大きい
区間Ａにガラス等の誘電体３が充填されている。Reference numeral 1 denotes a center conductor, and an outer conductor 2 is provided so as to surround the center conductor 1. Note that the inner diameter of the outer conductor 2 is different in the extension direction, and is larger in some sections A and smaller in some sections B. In the gap between the center conductor 1 and the outer conductor 2, a section A having a large inner diameter is filled with a dielectric 3 such as glass.
【００１２】上記した構成の同軸ビーズによれば、誘電
体３が同軸ビーズの一部にしか充填されていないため、
誘電体３部分の長さが短くなり、誘電体３部分での損失
を少なくできる。According to the coaxial bead having the above structure, the dielectric 3 is filled only in a part of the coaxial bead.
The length of the dielectric 3 is reduced, and the loss at the dielectric 3 can be reduced.
【００１３】また、長さ等外形寸法は従来のものと同一
に構成できるので、モジュールケース等に半田づけする
場合でも、気密性は保たれる。また、市販の同軸ビーズ
に合わせて加工されたモジュールケースをそのまま使用
することもできる。また、外導体２の内径を、誘電体３
が充填された部分Ａと充填されていない部分Ｂとで相違
させている。したがって、外導体２の内径が大きい部分
の長さや小さい部分の長さを適宜選ぶことによって、同
軸ビーズを同軸線路とみた場合にその特性インピーダン
スを位置によって変化させることができる。このような
特性を利用すれば、例えばマイクロストリップ線路と導
波管との変換部に同軸ビーズを使用する場合など、変換
部での整合をとることができる。Further, since the external dimensions such as the length can be configured the same as the conventional one, airtightness can be maintained even when soldering to a module case or the like. Further, a module case processed according to commercially available coaxial beads can be used as it is. The inner diameter of the outer conductor 2 is
Is different between the portion A filled with the portion A and the portion B not filled with the portion A. Therefore, by appropriately selecting the length of the portion where the inner diameter of the outer conductor 2 is large or the length of the portion where the inner diameter is small, when the coaxial bead is regarded as a coaxial line, its characteristic impedance can be changed depending on the position. By utilizing such characteristics, for example, when a coaxial bead is used in the conversion section between the microstrip line and the waveguide, it is possible to achieve matching in the conversion section.
【００１４】ここで、上記した構造の同軸ビーズをモジ
ュールケースの入出力端子に用いた例について、図２を
参照して説明する。なお、図２は主要部のみを抜き出し
て示した断面図である。Here, an example in which the coaxial beads having the above structure are used for the input / output terminals of the module case will be described with reference to FIG. FIG. 2 is a sectional view showing only the main part.
【００１５】２１はモジュールケースの一部で、モジュ
ールケース２１内部には導波管２２が形成されている。
そして、モジュールケース２１内部の導波管２２に隣接
した部分に空間が設けられ、その空間部分に同軸ビーズ
２３の外周部が半田２４などで固定される。この同軸ビ
ーズ２３は、図１と同じ構造のもので中心導体２５や外
導体２６、誘電体２７から構成されている。したがっ
て、外導体２６の内径は部分的に相違しており、また、
誘電体２７の充填も部分的である。そして、中心導体２
５の一端は導波管２２の内部に挿入されている。また、
モジュールケース２１の外部には、絶縁基板２８が設け
られその上にマイクロストリップ線路２９が形成されて
いる。そして、中心導体２５の他端はマイクロストリッ
プ線路２９に接続されている。この場合、同軸ビーズ
は、導波管−マイクロストリップ線路変換部を構成して
いる。Reference numeral 21 denotes a part of the module case, in which a waveguide 22 is formed.
Then, a space is provided in a portion adjacent to the waveguide 22 inside the module case 21, and the outer peripheral portion of the coaxial bead 23 is fixed to the space portion with solder 24 or the like. The coaxial bead 23 has the same structure as that of FIG. 1 and includes a center conductor 25, an outer conductor 26, and a dielectric 27. Therefore, the inner diameter of the outer conductor 26 is partially different, and
The filling of the dielectric 27 is also partial. And the center conductor 2
One end of 5 is inserted inside the waveguide 22. Also,
An insulating substrate 28 is provided outside the module case 21, and a microstrip line 29 is formed thereon. The other end of the center conductor 25 is connected to the microstrip line 29. In this case, the coaxial beads constitute a waveguide-microstrip line converter.
【００１６】次に、本発明の他の実施例について、図３
を参照して説明する。なお、図３では図１と同一部分に
は同一符号を付し、重複する説明は省略する。Next, another embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. In FIG. 3, the same parts as those in FIG. 1 are denoted by the same reference numerals, and overlapping description will be omitted.
【００１７】図１の実施例では、外導体２の外径が一様
に形成されているが、この実施例では、外導体２の外径
が階段状に変化している。この場合、外導体２外周の表
面積が広くなるので、その分、モジュールケースなどと
の半田づけの面積が広くなり、気密度をより向上でき
る。このとき、モジュールケースの半田づけ部分は、外
導体２の外周に合わせた形状に形成される。In the embodiment of FIG. 1, the outer diameter of the outer conductor 2 is uniform, but in this embodiment, the outer diameter of the outer conductor 2 changes stepwise. In this case, the surface area of the outer periphery of the outer conductor 2 is increased, and accordingly, the area for soldering with the module case or the like is increased, so that the airtightness can be further improved. At this time, the soldered portion of the module case is formed in a shape corresponding to the outer periphery of the outer conductor 2.
【００１８】[0018]
【発明の効果】本発明によれば、マイクロ波の伝送損失
を少なくでき、しかも気密性が確保できる同軸ビーズが
提供できる。According to the present invention, it is possible to provide a coaxial bead capable of reducing the microwave transmission loss and ensuring airtightness.
【図１】本発明の一実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the present invention.
【図２】本発明の使用例を示す断面図である。FIG. 2 is a sectional view showing an example of use of the present invention.
【図３】本発明の他の実施例を示す断面図である。FIG. 3 is a sectional view showing another embodiment of the present invention.
【図４】従来例を示す断面図である。FIG. 4 is a sectional view showing a conventional example.
【符号の説明】 １…中心導体 ２…外導体 ３…誘電体[Description of Signs] 1 ... Center conductor 2 ... Outer conductor 3 ... Dielectric
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 実開 平３−90504（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01P 3/06 H01P 1/04 H01P 5/107 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-U 3-90504 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) H01P 3/06 H01P 1/04 H01P 5 / 107
Claims (2)
の間に、誘電体を充填して構成される同軸ビーズにおい
て、前記誘電体を充填する領域を部分的にし、かつ、前
記誘電体が充填される部分と前記誘電体が充填されない
部分とで、前記外導体の内径を相違させたことを特徴と
する同軸ビーズ。In a coaxial bead formed by filling a dielectric between a central conductor and an outer conductor surrounding the central conductor, a region filled with the dielectric is partially formed, and the dielectric is filled with the dielectric. A coaxial bead wherein the inner diameter of the outer conductor is made different between a portion where the dielectric is filled and a portion where the dielectric is not filled.
求項１記載の同軸ビーズ。 2. The method according to claim 1, wherein the outer diameter of the outer conductor changes stepwise.
The coaxial bead according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12880493A JP3272816B2 (en) | 1993-05-31 | 1993-05-31 | Coaxial beads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12880493A JP3272816B2 (en) | 1993-05-31 | 1993-05-31 | Coaxial beads |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06338709A JPH06338709A (en) | 1994-12-06 |
| JP3272816B2 true JP3272816B2 (en) | 2002-04-08 |
Family
ID=14993842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12880493A Expired - Fee Related JP3272816B2 (en) | 1993-05-31 | 1993-05-31 | Coaxial beads |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3272816B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100626652B1 (en) * | 2004-06-18 | 2006-09-25 | 한국전자통신연구원 | Straight Mode Transducer of Active Phase Array Antenna System and Fabrication Method Thereof |
| US7855612B2 (en) | 2007-10-18 | 2010-12-21 | Viasat, Inc. | Direct coaxial interface for circuits |
| EP2151007A1 (en) * | 2007-05-02 | 2010-02-10 | ViaSat, Inc. | Low-loss impedance coaxial interface for integrated circuits |
| US7625131B2 (en) | 2007-05-02 | 2009-12-01 | Viasat, Inc. | Interface for waveguide pin launch |
| US7812686B2 (en) | 2008-02-28 | 2010-10-12 | Viasat, Inc. | Adjustable low-loss interface |
| WO2009114731A2 (en) | 2008-03-13 | 2009-09-17 | Viasat, Inc. | Multi-level power amplification system |
| CN108711665A (en) * | 2018-05-25 | 2018-10-26 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Rectangular waveguide micro-strip hermetic seal transition circuit |
-
1993
- 1993-05-31 JP JP12880493A patent/JP3272816B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06338709A (en) | 1994-12-06 |
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