JP2001148439A - Electronic circuit package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve a problem such that a high-frequency circuit mounting region must be extremely limited to a region when the width of a connection terminal is subtracted while the inner space of a package for accommodating a high-frequency circuit needs to be narrow to increase a cut-off frequency. SOLUTION: A small space region for accommodating a connection terminal is provided adjacent to a space region corresponding to a high-frequency circuit in a package. Specifically, an annular plate is provided between a header and a cap, or the peripheral part of a header surface is set to a projecting shape, or a recess corresponding to the connection terminal is formed at the cap to form a space region.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit package, and more particularly to a structure of a high frequency integrated circuit package.

[0002]

2. Description of the Related Art Conventionally, in a metal package for accommodating a high frequency circuit, an attempt has been made to increase the cutoff frequency by reducing the dimension between the walls as much as possible. For example, in the high-frequency circuit package disclosed in Japanese Utility Model Application Laid-Open No. 1-060585, the screw mounting portion is arranged at a position higher than the upper surface of the circuit accommodating portion, and the distance between the screws is reduced, so that the outer metal package is reduced in size. I have.

FIG. 5 is a plan view showing a configuration example of a package used for a conventional millimeter wave band integrated circuit. In FIG. 2, the high-frequency circuit 4 has a mountable area 8 on the header 1.
, And connection terminals 5 are arranged on both sides thereof. The high-frequency circuit 4 and the connection terminal 5 are connected by a connection wire 6.

FIGS. 6A and 6B are cross-sectional views taken along broken lines C and D in FIG. A cap 3 is bonded to the high-frequency circuit mounting surface of the header 1 so as to cover the high-frequency circuit 4 and the connection terminal 5. The package space 7 sandwiched between the cap 3 and the header 1 forms a rectangular waveguide, and the mountable area 8 of the high-frequency circuit 4 is obtained by subtracting the width occupied by the connection terminals from the width of the rectangular waveguide. Range.

[0005]

In the package used for the above-mentioned integrated circuit in the millimeter wave band, for example, if the cut-off frequency in the package is to be 30 GHz or more, the cross section of the space 7 in the package is 5 mm × 2. 5
mm or less is required. On the other hand, the external connection terminal 5 is required to have a width of at least about 1 mm in diameter due to manufacturing restrictions.

For this reason, in the package having the conventional structure, the area where the high-frequency circuit can be mounted has to be narrowed by the terminal width. Further, in order to increase the cutoff frequency as the band frequency increases, it is necessary to further reduce the space in the package in inverse proportion thereto, but the terminal width has a lower limit in the above-mentioned manufacturing. Therefore, there is a problem that the area where the high-frequency circuit can be mounted decreases as the operating frequency band of the package increases.

An object of the present invention is to provide a package in which the area where a high-frequency circuit can be mounted does not decrease so much even if the cutoff frequency is increased.

[0008]

An electronic circuit package for achieving the above object comprises a header and a cap joined to one surface of the header, and when these are joined, an electronic circuit is provided between the center of the header and the cap. The first corresponding to the circuit
Is formed, and accommodates the connection terminal arranged on the header surface, and the height from the header surface is the first.
A second spatial region lower than the spatial region is formed.

[0009] The second space region is arranged adjacent to the first space region. The second space region can be formed for each connection terminal. The header portion and the cap can be joined via a conductive member having a predetermined thickness. The conductive member is disposed on an outer edge portion on the header surface or on a surface portion of the header surface except for portions corresponding to the first and second spatial regions. It is desirable that the height of the connection terminal on the header surface is lower than the connection wire mounting position on the high-frequency circuit mounted on the header surface.

[0010] As another example, a configuration in which a header surface portion to be joined to the cap is more convex than a header surface central portion is possible. In this case, the convex portion is formed on an outer edge portion on the header surface or on a surface portion of the header surface excluding portions corresponding to the first and second spatial regions.

As another structure, a surface to be joined to the header, a concave portion corresponding to the first space region, and a concave portion corresponding to the second space region are formed in the cap, and the surface to be joined to the header is Joins the outer edge on the surface. The surface to be joined to the header may be formed to be joined to a surface portion of the header surface other than the surfaces corresponding to the first and second spatial regions.

According to the above configuration, the connection terminal portion can be eliminated from the first space region corresponding to the rectangular waveguide in the package. Therefore, even if the cutoff frequency is increased, the area where the high frequency circuit can be mounted is widened. be able to.

[0013]

FIG. 1 shows a first configuration example of the present invention. FIG. 1 is a plan view of the header without the cap.
Here, a high-frequency circuit mounting area 8 is set in the center of the surface of the header made of a metal flat plate to which the cap is attached, and the ends (wire connection portions) of four connection terminals 5 are arranged on both sides thereof. I have. The high-frequency circuit 4 is installed at the center of the mounting area 8 and is connected to connection terminals 5 on both sides by connection wires 6. The connection terminal 5 is installed substantially perpendicular to the main surface of the header, penetrates from the surface on which the high-frequency circuit 4 is installed to the other surface, and protrudes.

A conductive ring-shaped plate 2 is provided on an outer edge portion (hatched portion in FIG. 1) on the header surface in FIG. FIG.
In this example, the outer peripheral shape of the conductive ring-shaped plate 2 is set to the same rectangle as the outer shape of the header.

FIG. 2 is a sectional view taken along broken lines A and B in FIG.
2 (a) and FIG. 2 (b).

In FIG. 2A, a space region formed between the cap 3 and the header 1 includes a first region corresponding to the high-frequency circuit 4 and a second region around the end of the connection terminal 5. I know. The first spatial region corresponds to a rectangular waveguide, and its cross-sectional size defines the cutoff frequency as described above. On the other hand, in the configuration shown in FIGS. 1 and 2A, the connection terminal 5 is not arranged on the surface of the header 1 corresponding to the first space area. In this configuration, since the cap 3 and the header 1 are joined with the conductive ring-shaped plate 2 interposed therebetween, a second space region corresponding to the thickness of the ring-shaped plate 2 is formed. The connection terminal 5 is arranged in the second space area. This second space region is desirably formed adjacent to the first space region for each connection terminal 5 as shown in FIG. However, one second space region may be provided on each side of the first space region, and a plurality of connection terminals 5 may be arranged there. As described above, in the above configuration, since the connection terminal 5 is not provided in the high-frequency circuit mounting area 8 on the surface of the header 1, the area where the high-frequency circuit can be installed can be widened without lowering the cutoff frequency.

FIG. 3 is a sectional view showing another embodiment of the present invention. Here, the conductive ring-shaped plate 2 as described above is not used. A peripheral surface portion (for example, a portion corresponding to the ring-shaped plate 2 in FIG. 1) on the surface of the header 1 that is joined to the cap 3 is more convex than the central portion of the header 1 corresponding to the first space region. I have. Therefore, when the header 1 and the cap 3 are joined, it is possible to form a second space area in which the connection terminal can be arranged adjacent to the high-frequency circuit mounting area 8.

FIG. 4 is a sectional view showing another embodiment of the present invention. Here, as in FIG. 3, the conductive ring-shaped plate 2 is not used. Here, the cap 3 comprises a recess forming a first spatial region as shown in FIGS.
Further, a second terminal in which the connection terminal is disposed adjacent to the concave portion.
Another concave portion is formed which forms the spatial region of FIG. For this reason, when it is joined to the flat plate-shaped header 1, first and second space regions are formed as shown in FIGS.

In the above configuration, the height of the end of the connection terminal 5 protruding above the surface of the header 1 is about several hundred μm (for example, about 100 to 300 μm). A connection wire 6 having a diameter of about 25 μm is connected to the terminal 5. Since the height of the second space region is preferably as low as possible, in the configuration of FIG. 1, the thickness of the ring-shaped plate 2 is slightly different depending on various design conditions, but is set within several hundred μm. This size is the height of the convex portion in FIG. 3 and the second height in FIG.
Corresponds to the depth of the concave portion corresponding to the spatial region.

It is desirable that the height of the terminal 5 from the header surface be lower than the height of the connection portion of the wire 6 on the high frequency circuit. In this case, when forming the wire by the wire bonder, the wire 6 can be made almost straight without being mountain-shaped.

When the cutoff frequency is about 30 GHz, for example, the plane shape of the header 1 is 6.0 mm × 18.
In the case of 0 mm, the conventional high-frequency circuit mountable area 8 is 2.6 mm × 15.2 mm. On the other hand, when the present invention is applied, the high-frequency circuit mounting area 8 is approximately 4.0.
mm × 15.2 mm.

In the case of manufacturing the above structure, the header 1,
Joining between each of the ring-shaped plate 2 and the cap 3 is performed by known means, for example, seam welding, laser welding, soldering,
A conductive adhesive or the like can be used. In order to form the convex portion (that is, the concave portion) on the header 1, known means such as cutting or casting can be used. In order to form the concave portion in the cap 3, known means such as press working with a mold can be used.

The connection terminal 5 has a glass terminal structure, and the terminal is insulated from the conductive header 1 via a glass portion.

[0024]

As described above, in the electronic circuit package of the present invention, the connection terminal is not arranged in the area corresponding to the high-frequency circuit in the package, but another area adjacent to this area is formed. Since the connection terminals are arranged, the mounting area of the semiconductor, the thin film substrate, and the like forming the high-frequency circuit can be increased without lowering the cutoff frequency.

[Brief description of the drawings]

FIG. 1 is a plan view of a header portion of an electronic circuit package showing a configuration example of the present invention.

FIGS. 2A and 2B are cross-sectional views of different portions of the electronic circuit package of FIG. 1;

FIG. 3 is a sectional view showing another configuration of the present invention.

FIG. 4 is a sectional view showing another configuration of the present invention.

FIG. 5 is a plan view showing a conventional electronic circuit package.

6A and 6B are cross-sectional views of different portions of the electronic circuit package of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Header 2 Ring-shaped plate 3 Cap 4 High frequency circuit 5 Connection terminal 8 Area where high frequency circuit can be mounted

Claims (13)

[Claims] An electronic device comprising a header and a cap joined to one surface of the header, wherein a first space region corresponding to an electronic circuit is formed between the header center portion and the cap when they are joined. An electronic circuit package, comprising: a circuit package having a second space region that accommodates connection terminals arranged on the header surface and that is lower in height from the header surface than the first space region. 2. The electronic circuit package according to claim 1, wherein the second space region is disposed adjacent to the first space region. 3. The electronic circuit package according to claim 1, wherein the second space region is formed for each connection terminal. 4. The electronic circuit package according to claim 1, wherein the header and the cap are joined via a conductive member having a predetermined thickness. 5. The electronic circuit package according to claim 1, wherein the conductive member is disposed at an outer edge on the header surface. 6. The header according to claim 1, wherein the conductive member is provided on a first surface of the header surface.
4. The electronic circuit package according to claim 1, wherein the electronic circuit package is arranged on a surface portion excluding a surface corresponding to the second spatial region. 7. The electronic circuit package according to claim 1, wherein the first space region has a planar shape and a rectangular cross section. 8. The electronic circuit package according to claim 1, wherein a height of the connection terminal on the header surface is lower than a connection wire mounting position on an electronic circuit mounted on the header surface. 9. The electronic circuit package according to claim 1, wherein a header surface portion to be joined to the cap is more convex than a central portion of the header surface. 10. The electronic circuit package according to claim 9, wherein the convex portion is formed at an outer edge of the header surface. 11. The electronic circuit package according to claim 9, wherein the convex portion is a surface portion excluding a surface corresponding to the first and second spatial regions of the header surface. 12. The cap has a surface joined to the header, a concave portion corresponding to the first space region and a concave portion corresponding to the second space region, and the surface joined to the header is 3. The electronic circuit package according to claim 1, wherein the electronic circuit package is joined to an outer edge of the header surface. 13. The cap has a surface joined to the header, a concave portion corresponding to the first space region, and a concave portion corresponding to the second space region, wherein the surface joined to the header is The electronic circuit package according to claim 1, 2 or 3, wherein the electronic circuit package is joined to a surface portion of the header surface excluding a surface corresponding to the first and second spatial regions.