JPH118332A - Package for microwave device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a microwave device package with good heat-radiation characteristics, while being difficult to be oscillated and easy to be miniaturized. SOLUTION: A heat-radiation metal plate 12 is disposed on the surface of a ceramic base 1, a semiconductor chip 10 and input and output matching circuit boards 8 and 9 are attached on the heat-radiation metal plate 12, and a metallic film is provided on the front and rear surfaces of the ceramic base. Further, the ceramic base is filled with a metal to provide a through-hole 11 contacting to a metal film, so that the metallic films on the front and rear surfaces of the ceramic base make electrical and thermal continuity for raised heat- radiation, while a metallic film is provided on the inner side surface of first and second layer ceramic frames 2 and 3, so that oscillations due to the feedback of an in-band signal inside a package is prevented from occurring.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave device package for housing microwave devices such as amplifiers, mixers, and oscillators used for satellite communication, terrestrial microwave communication, mobile communication, and the like.

[0002]

2. Description of the Related Art Conventionally, there has been a microwave device package as shown in FIG. FIG. 6 shows “Microwave Module Packaging” (IEEE MTT-S DI
FIG. 3 is an exploded perspective view showing the basic configuration of the microwave device package shown in GEST 1992 P1503). In FIG.
31 is a ceramic base, 32 is a first layer ceramic frame, 33 is a second layer ceramic frame, 34 is a lid,
35 is an input terminal, 36 is an output terminal, 37 is a bias terminal, 38 is an input matching circuit board, 39 is an output matching circuit board, and 40 is a semiconductor chip.

An input terminal 35, an output terminal 36, and a bias terminal 37 are formed on the first ceramic frame 32 by forming a metal film, and the front and back surfaces of the first ceramic frame 32 and the second ceramic frame 33 are formed. A connection line is formed of a metal film at a predetermined portion of the substrate, and these are integrally formed by simultaneous firing. The input matching circuit board 38, the output matching circuit board 39, and the semiconductor chip 40 are inserted into the first-layer ceramic frame 32 and the second-layer ceramic frame 33, and are attached to the ceramic base 31. Ceramic frame 33
It is hermetically sealed by being put on it and attached by a sealing means such as soldering or welding.

Next, the operation of the above-mentioned conventional microwave device package will be described with reference to FIG. The signal input from the input terminal 5 is amplified by an amplifier including the input matching circuit board 8, the output matching circuit board 9, and the semiconductor chip 10, and extracted from the output terminal 6. The bias terminal 7 is used for applying a bias voltage to the semiconductor chip. The heat generated from the semiconductor chip propagates through the ceramic base 1 and is radiated from the housing. When a side metal film is provided outside the package of the first-layer ceramic frame 2 and the second-layer ceramic frame 3, the cut-off frequency of the package is determined by the outer dimensions of the package.

[0005]

As shown in FIG. 6, the conventional microwave device package has a problem that the heat radiation characteristics are poor due to the use of a ceramic base. And when providing a side metal film on the outside of the package of the second layer ceramic frame, the cutoff frequency of the package is low,
There is a problem that the feedback of the in-band signal occurs in the package and oscillation is easily caused. In addition, since the input matching circuit board 8, the output matching circuit board 9, and the first-layer ceramic frame 2 are constituted by individual components, the manufacturing cost is reduced. And it becomes difficult to reduce the size as well.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to provide a microwave device package which has good heat radiation characteristics, hardly oscillates, and can be easily miniaturized.

[0007]

According to a first aspect of the present invention, there is provided a microwave device package comprising: a ceramic base; a first-layer ceramic frame disposed on the ceramic base; A second-layer ceramic frame disposed on a single-layer ceramic frame, and a semiconductor chip and an input and output matching circuit board in an inner region of the first and second-layer ceramic frames on the ceramic base. In the microwave device package to be housed, a heat dissipation metal plate is arranged on the surface of the ceramic base, and the semiconductor chip and the input and output matching circuit boards are mounted on the heat dissipation metal plate. A metal film is provided at predetermined locations on the front and back surfaces of the base, and the ceramic base is provided. The by providing a through hole in contact with the metal film by filling a metal, in which so as to electrically and thermally conductive the front and back surfaces of the metal film.

A microwave device package according to a second aspect of the present invention is provided on a surface of the ceramic base with respect to a side surface of the first layer ceramic frame and the second layer ceramic frame facing the inside of the package. A metal film arranged to be electrically connected to the metal film is provided.

In a microwave device package according to a third aspect of the present invention, a projection is provided on the inside of the package of the first-layer ceramic frame and the second-layer ceramic frame. A metal film is provided so as to be electrically connected to the metal film provided on the surface of the base.

According to a fourth aspect of the present invention, there is provided a microwave device package provided on a surface of the ceramic base with respect to a portion of the inside of the first layer ceramic frame facing the second layer ceramic frame. And a metal-filled through hole arranged to be electrically connected to the metal film.

According to a fifth aspect of the present invention, there is provided a microwave device package, wherein a tip formed of a microstrip line is provided in a region formed on the first layer ceramic frame inside the second layer ceramic frame. It consists of distributed constant type circuit elements such as open line, short-circuited line, radial stub, DC element circuit using line-to-line coupling, or lumped constant type circuit elements such as thin film resistors, opposed parallel plate type capacitors and spiral inductors. An input matching circuit and an output matching circuit composed of microwave circuit elements are configured.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1 First, the configuration of the microwave device package according to the first embodiment of the present invention will be described with reference to FIG. FIG. 1 is an exploded perspective view showing a configuration of a microwave device package according to Embodiment 1 of the present invention. In FIG. 1, 1 is a ceramic base having a through hole 11, 2 is a first-layer ceramic frame, and 3 is a second-layer ceramic frame.

4 is a cover, 5 is an input terminal, 6 is an output terminal, 7 is a bias terminal, 8 is an input matching circuit board, 9 is an output matching circuit board, 10 is a semiconductor chip, and 11 is a ceramic base 1. Through holes filled with metal provided, 1
Reference numeral 2 denotes a heat-dissipating metal plate to which the semiconductor chip 10 is attached. Although the semiconductor chip 10 is attached to the metal plate 12 for heat radiation, the input matching circuit board 8 and the output matching circuit board 9 may be attached.

Next, the operation of the microwave device package according to the present embodiment will be described. A metal film (not shown) is provided on the front and back surfaces of the ceramic base 1.
These metal films are electrically and thermally conductive through through holes 11 filled with metal. The heat generated from the semiconductor chip 10 is diffused over a large area by the heat-dissipating metal plate 12, propagates through the metal-filled through-holes 11 and the metal film, and is dissipated to the housing (not shown). As described above, according to this embodiment, a microwave device package having good heat radiation characteristics can be obtained.

Embodiment 2 Hereinafter, the configuration of the microwave device package according to the second embodiment of the present invention will be described with reference to FIG. FIG. 2 is an exploded perspective view showing a configuration of a microwave device package according to Embodiment 2 of the present invention. In FIG. 2, reference numeral 13 denotes a side metal film provided on the inner surface of the first-layer ceramic frame 22, and reference numeral 14 denotes a side metal film provided on the inner surface of the second-layer ceramic frame 23.

Reference numeral 22 denotes a first-layer ceramic frame having a side surface metal film 13 provided on a portion facing the inside of the package, and 23 denotes a second layer having a side metal film 14 provided on a portion facing the inside of the package. Ceramic frame,
Each side metal film 13 and side metal film 14 are configured to be electrically connected to the metal film and the cover 4 provided on the surface of the ceramic base 1. In FIG. 2, components having the same reference numerals as those shown in FIG. 1 are the same as those in FIG.

Next, the operation of the microwave device package according to the present embodiment will be described. The side metal films 13 and 14 provided on each side surface of the first-layer ceramic frame 22 and the second-layer ceramic frame 23, the metal film (not shown) provided on the surface of the ceramic base 1, and the lid are simulated. A waveguide is formed. And the cut-off frequency of the package is the first layer and the second layer ceramic frame 2.
Since the distance between the side metal films 13 and 14 is determined by the distance between the side metal films 2 and 23, the case where the side metal film is provided on the inner side surface of the package and the case where the side metal film is provided on the outer side surface as in the above-described conventional example are compared. Then, the gap (lateral dimension) between the side metal films of the ceramic frame facing each other is smaller in the former, and the cutoff frequency is higher. As described above, according to this embodiment, the cutoff frequency of the package can be increased, and oscillation due to feedback of in-band signals inside the microwave device package can be prevented.

Embodiment 3 Hereinafter, the configuration of the microwave device package according to the third embodiment of the present invention will be described with reference to FIG. FIG. 3 is an exploded perspective view showing the configuration of the microwave device package according to Embodiment 3 of the present invention. In FIG. 3, reference numeral 15 denotes a projection provided on the inner side of the package of the first-layer ceramic frame 24, and 19 denotes a projection provided on the inner side of the package of the second-layer ceramic frame 25. Is provided with a metal film.

Reference numeral 24 denotes a protrusion 15 on the package inner side.
Is a second-layer ceramic frame provided with projections 19 inside the package, and a metal film provided on the side surface of each of the projections 15 and 19 is a surface of the ceramic base 1. And the lid 4 is electrically connected to the metal film provided on the substrate. In FIG. 3,
Components having the same reference numerals as those shown in FIG. 1 are the same as those in FIG.

Next, the operation of the microwave device package according to the present embodiment will be described. Also in the present embodiment, as described in the second embodiment, the cut-off frequency of the package is determined by the metal film provided on the facing side surface of each of the projections 15 and 19 forming the pseudo waveguide. Since the distance between the metal films is determined by the distance between the metal films, the distance between the metal films facing each other by the protrusion is further reduced, and the cutoff frequency is further increased. As described above, according to this embodiment, the cutoff frequency of the package is increased, and oscillation due to feedback of an in-band signal inside the package can be prevented.

Embodiment 4 FIG. Hereinafter, the configuration of the microwave device package according to the fourth embodiment of the present invention will be described with reference to FIG. FIG. 4 is an exploded perspective view showing a configuration of a microwave device package according to Embodiment 4 of the present invention. In FIG. 4, reference numeral 16 denotes a through hole provided in the first-layer ceramic frame 26;
Reference numeral 6 denotes a first-layer ceramic frame, and reference numeral 27 denotes a second-layer ceramic frame facing the through hole 16.

The through hole 16 is provided in a portion corresponding to the inside of the package component facing the second layer ceramic frame 27 on the first layer ceramic frame 26, and the inside of the through hole 16 is filled with metal or A metal film is provided on the side surface. It is assumed that the metal filled in the through hole or the metal film provided on the inner side surface is electrically connected to the metal film on the surface of the ceramic base 1. In FIG. 4, components having the same reference numerals as those shown in FIG. 1 are the same as those in FIG.

Next, the operation of the microwave device package according to the present embodiment will be described. Also in the present embodiment, as described in the second embodiment, the cut-off frequency of the package is determined by the opposing through-holes provided on the first-layer ceramic frame 26 so as to form a pseudo waveguide. The distance between the metal or the metal film filled in the hole is determined, and the distance between the metal film or the filled metal in the through hole is smaller than the distance between the side metal films provided on the outer side surface as in the above conventional example. Therefore, the cutoff frequency of the package is increased. As described above, according to this embodiment, the cutoff frequency of the package is increased, and oscillation due to feedback of an in-band signal inside the package can be prevented.

Embodiment 5 Hereinafter, the configuration of the microwave device package according to the fifth embodiment of the present invention will be described with reference to FIG. FIG. 5 is an exploded perspective view showing a configuration of a microwave device package according to Embodiment 5 of the present invention. In FIG. 5, reference numeral 17 denotes an input matching circuit formed on a first-layer ceramic frame 28, reference numeral 18 denotes an output matching circuit formed on the first-layer ceramic frame 28, and reference numeral 28 denotes an input matching circuit 17 and an output matching circuit 18 thereon. Is a first-layer ceramic frame, and 29 is a second-layer ceramic frame on which the lid 4 is covered.

The input matching circuit 17 formed on the first-layer ceramic frame 28 and the first-layer ceramic frame 28
The output matching circuit 18 configured above is a distributed constant type circuit element such as an open-ended line, a short-circuited line, a radial stub, a DC blocking circuit using line-to-line coupling, or a thin-film resistor, a microstrip line. It is configured to include a microwave circuit element composed of a lumped constant type circuit element such as a parallel plate type capacitor and a spiral inductor.
In FIG. 5, components having the same reference numerals as those shown in FIG. 1 are the same as those in FIG.

Next, the operation of the microwave device package according to the present embodiment will be described. In the present embodiment, the input matching circuit 17 and the output matching circuit 18 are integrally formed on the first-layer ceramic frame 28, and their operations are not changed. Therefore, all of the first to fourth embodiments can be applied to the microwave device package according to the present embodiment, and the operation of the microwave device package according to each embodiment is the same as that of each of the above embodiments. Since it is the same as the embodiment, further detailed description is omitted. As described above, according to this embodiment, cost reduction and size reduction can be achieved by reducing the number of components.

[0027]

According to the first invention of the present invention, the heat radiation metal plate is provided on the ceramic base, and the semiconductor chip is arranged thereon, particularly,
Microwave device with good heat dissipation characteristics by dispersing heat generated from semiconductor chip to a large area by providing through holes filled with metal on ceramic base, and further conducting to the package housing through through holes In addition, even when the height of the first-layer ceramic frame is different from that of the semiconductor chip, the input matching circuit board, and the output matching circuit board, the height can be adjusted by the metal plate for heat radiation.

[0028] The second invention of the present invention is constructed as described above, and in particular, by providing a metal film on the inner side surface of the package of the first-layer ceramic frame and the second-layer ceramic frame, the inside of the package is provided. The lateral dimension of the formed pseudo waveguide is reduced, the cutoff frequency of the package is increased, and oscillation due to feedback of in-band signals inside the microwave device package can be prevented.

According to a third aspect of the present invention, a projection is provided on the package inner side of the first-layer ceramic frame and the second-layer ceramic frame, and a metal film is provided on a side surface of the projection. As a result, the lateral dimension of the pseudo waveguide formed in the package is reduced by the metal film on the side of the protrusion, the cutoff frequency of the package is increased, and oscillation due to feedback of in-band signals inside the package is prevented. can do.

The fourth invention of the present invention is configured as described above, and in particular, the second invention in which a portion corresponding to the inside of the package facing the second-layer ceramic frame of the first-layer ceramic frame is filled with metal. By providing the through hole, the lateral dimension of the pseudo waveguide formed in the package is reduced by the through hole, the cutoff frequency of the package is increased, and the oscillation due to the feedback of the in-band signal inside the package. Can be prevented.

According to a fifth aspect of the present invention, the microwave circuit element configured on the input matching circuit board or the output matching circuit board is formed on the first-layer ceramic frame. By doing so, it is possible to achieve cost reduction and size reduction by reducing the number of parts.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a configuration of a microwave device package according to a first embodiment of the present invention.

FIG. 2 is an exploded perspective view showing a configuration of a microwave device package according to a second embodiment of the present invention.

FIG. 3 is an exploded perspective view showing a configuration of a microwave device package according to a third embodiment of the present invention.

FIG. 4 is an exploded perspective view showing a configuration of a microwave device package according to a fourth embodiment of the present invention.

FIG. 5 is an exploded perspective view showing a configuration of a microwave device package according to a fifth embodiment of the present invention.

FIG. 6 is an exploded perspective view showing a basic configuration of a conventional microwave device package.

[Explanation of symbols]

1 ceramic base, 2, 22, 24, 26, 2
8 First layer ceramic frame, 3, 23, 25, 2
7, 29 Second layer ceramic frame, 4 lid, 5
Input terminal, 6 output terminal, 7 bias terminal,
8 input matching circuit board, 9 output matching circuit board, 1
0 semiconductor chip, 11 through hole provided in ceramic base, 12 metal plate for heat radiation, 1
3. Side metal film of the first layer ceramic frame, 14
Side metal film of the second layer ceramic frame, 15 protrusions, 16 through holes provided in the first layer ceramic frame, 17 input matching circuit formed on the first layer ceramic frame, 18 output formed on the first layer ceramic frame Matching circuit, 19 protrusions, 31 ceramic base.

 ────────────────────────────────────────────────── ─── Continued on front page (72) Inventor Kazuhisa Yamauchi 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsubishi Electric Corporation

Claims (5)

[Claims] 1. A ceramic base, comprising: a first-layer ceramic frame disposed on the ceramic base; a second-layer ceramic frame disposed on the first-layer ceramic frame; In a microwave device package accommodating a semiconductor chip and an input and output matching circuit board in an inner region of the first layer and the second layer ceramic frame on the ceramic base, a metal plate for heat dissipation is provided on a surface of the ceramic base. The semiconductor chip and the input and output matching circuit boards are mounted on the heat-dissipating metal plate, and a metal film is provided at predetermined locations on the front and back surfaces of the ceramic base. By providing a through hole in contact with the metal film and filling the metal on the base, A package for a microwave device, wherein the metal films on the front and rear surfaces are electrically and thermally conductive. 2. A metal film arranged to electrically connect a metal film provided on a surface of the ceramic base to a side surface of the first and second ceramic frames facing the inside of the package. The package for a microwave device according to claim 1, further comprising: 3. A protrusion is provided on the inside of the package of the first and second ceramic frames, and a side surface of the protrusion is electrically connected to a metal film provided on a surface of the ceramic base. 2. The microwave device package according to claim 1, further comprising a metal film arranged as described above. 4. A metal arranged on a portion of the inside of the package of the first ceramic frame facing the second ceramic frame so as to be electrically connected to a metal film provided on a surface of the ceramic base. 2. The microwave device package according to claim 1, further comprising a through hole filled with a. 5. A region formed on the first layer ceramic frame inside the second layer ceramic frame,
Distributed-constant circuit elements such as open-ended lines, short-circuited lines, radial stubs, DC blocking circuits using line-to-line coupling composed of microstrip lines, or concentrated thin-film resistors, opposed parallel-plate capacitors, spiral inductors, etc. 2. The microwave device package according to claim 1, wherein an input matching circuit and an output matching circuit including a microwave circuit element formed of a constant circuit element are formed.