CN113517251A

CN113517251A - Multi-chip packaging structure for microwave communication

Info

Publication number: CN113517251A
Application number: CN202110498131.7A
Authority: CN
Inventors: 王静辉; 崔健; 黎荣林; 段磊; 郭跃伟
Original assignee: Bowei Integrated Circuits Co ltd
Current assignee: Bowei Integrated Circuits Co ltd
Priority date: 2021-05-08
Filing date: 2021-05-08
Publication date: 2021-10-19

Abstract

The invention discloses a multi-chip packaging structure for microwave communication, and relates to the technical field of microwave communication. The utility model provides a multi-chip packaging structure for microwave communication, includes the heat dissipation base plate, heat dissipation base plate top is equipped with the chip, heat dissipation base plate top fixedly connected with encapsulation shell, the spacing frame of heat dissipation base plate top fixedly connected with, the chip is located spacing frame inboard, heat dissipation base plate top fixedly connected with bottom plate, bottom plate and spacing frame looks adaptation, a plurality of second through-grooves have all been seted up to bottom plate top both sides, second through-groove equidistance distributes. According to the invention, through the mutual matching of the limiting frame, the bottom plate, the first through groove and the second through groove, the heat dissipation glue can be tightly attached to the bottom plate, the contact area of the heat dissipation glue is increased, so that the heat dissipation glue and the chip are difficult to be layered, the coverage rate of the heat dissipation glue on the chip is improved, and the heat conduction performance of the product is further enhanced.

Description

Multi-chip packaging structure for microwave communication

Technical Field

The invention relates to the technical field of microwave communication, in particular to a multi-chip packaging structure for microwave communication.

Background

With the development of technology, the operation speed of the chip is greatly increased, the functions are becoming more and more abundant, and the heat generated by the operation of the chip in the chip is also increased, so the heat dissipation problem of the chip package is urgently needed to be solved.

Paste dress heat dissipation lid is the effective method of solving the chip heat dissipation problem at present, but traditional packaging structure carries out the plane stack through the heat dissipation glue with heat dissipation lid and chip, this kind of simple plane stack leads to the heat dissipation glue very "fragile" in the bonding between chip and heat dissipation lid, because the heat dissipation glue itself does not possess stronger adhesive force, and in the follow-up heat treatment process of chip package, the material is heated deformation frequently, so the heat dissipation glue is very easily appeared layering in the region around the chip, this kind of layering greatly reduced the coverage rate of heat dissipation glue on the chip, thereby the heat conductivility of product has seriously been influenced.

Disclosure of Invention

The present invention is directed to a multi-chip package structure for microwave communication, so as to solve the problems mentioned in the background art.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a multi-chip packaging structure for microwave communication, includes the heat dissipation base plate, heat dissipation base plate top is equipped with the chip, heat dissipation base plate top fixedly connected with encapsulation shell, the spacing frame of heat dissipation base plate top fixedly connected with, the chip is located spacing frame inboard, heat dissipation base plate top fixedly connected with bottom plate, bottom plate and spacing frame looks adaptation, a plurality of second through-grooves have all been seted up to bottom plate top both sides, second through-groove equidistance distributes, the bottom plate openly all opens a plurality of first logical grooves that are equipped with the back, first logical groove equidistance distributes, bottom plate top both sides all are provided with a plurality of fixed plates, the fixed plate all is located the second and leads to the inslot, a plurality of connective bars of outside fixedly connected with of fixed plate, connective bar one end all with bottom plate fixed connection, a plurality of through-holes have evenly been seted up at the bottom plate top.

Preferably, a plurality of fixed blocks of the equal fixedly connected with in spacing frame top both sides, the equal fixedly connected with heat dissipation foot in fixed block top, a plurality of sliding tray have all been seted up to encapsulation shell top both sides, sliding tray and heat dissipation foot looks adaptation.

Preferably, the two sides of the bottom of the packaging shell are both provided with strip-shaped grooves, and the strip-shaped grooves are matched with the radiating fins.

Preferably, the bottom of the chip is fixedly connected with a plurality of pins, and the pins are matched with the through holes.

Preferably, a plurality of pin holes are uniformly formed in the bottom of the heat dissipation substrate, and a plurality of wiring balls are fixedly connected to the bottom of the heat dissipation substrate.

Compared with the prior art, the invention has the beneficial effects that:

(1) this multi-chip package structure for microwave communication through spacing frame, bottom plate, first logical groove and the second that sets up mutually supporting in groove, can make the heat dissipation glue closely laminate with the bottom plate, and increased the area of contact that the heat dissipation was glued and then make the heat dissipation glue be difficult to the layering with the chip to appear, has improved the heat dissipation and has glued the coverage rate on the chip, and then has strengthened the heat conductivility of product.

(2) This multi-chip packaging structure for microwave communication through spacing frame, heat dissipation foot and the fin that sets up, can strengthen heat dispersion, improves the radiating efficiency.

Drawings

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is a schematic side view of the present invention;

FIG. 3 is a schematic structural view of a disassembled front surface of the present invention after the heat dissipation substrate is removed;

FIG. 4 is a schematic axial side view of the FIG. 3 embodiment of the present invention;

FIG. 5 is a schematic axial side view of the position-limiting frame of the present invention;

FIG. 6 is a schematic axial side view of the base plate of the present invention;

fig. 7 is an enlarged view of part a of the present invention.

In the figure: 1. a heat-dissipating substrate; 101. a wiring ball; 2. a package housing; 3. a chip; 4. a limiting frame; 401. a heat sink; 402. a fixed block; 403. a heat dissipation foot; 5. a base plate; 501. a first through groove; 502. a second through groove; 503. a through hole; 504. a fixing plate; 505. and (4) connecting the rods.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that in the description of the present invention, the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of description and simplification of description, and do not indicate or imply that the referred device or element must have a specific orientation, be configured in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

Further, it will be appreciated that the dimensions of the various elements shown in the figures are not drawn to scale, for ease of description, and that the thickness or width of some layers may be exaggerated relative to other layers, for example.

It should be noted that like reference numerals and letters refer to like items in the following figures, and thus, once an item is defined or illustrated in one figure, it will not need to be further discussed or illustrated in detail in the description of the following figure.

As shown in fig. 1 to 7, the present invention provides a technical solution: a multi-chip packaging structure for microwave communication comprises a heat dissipation substrate 1, wherein a chip 3 is arranged on the top of the heat dissipation substrate 1, the chip 3 is a microwave radio frequency chip, the microwave radio frequency chip is a component of a microwave radio frequency integrated circuit and is a core technology in the field of wireless communication, a packaging shell 2 is fixedly connected to the top of the heat dissipation substrate 1, a limiting frame 4 is fixedly connected to the top of the heat dissipation substrate 1, the limiting frame 4 is made of a heat dissipation material, the chip 3 is positioned on the inner side of the limiting frame 4, a bottom plate 5 is fixedly connected to the top of the heat dissipation substrate 1, the bottom plate 5 is matched with the limiting frame 4, a plurality of second through grooves 502 are respectively arranged on two sides of the top of the bottom plate 5, the number of the second through grooves 502 is 6, the second through grooves 502 are semicircular, the second through grooves 502 are equidistantly distributed, a plurality of first through grooves 501 are respectively arranged on the front surface and the back surface of the bottom plate 5, the first through grooves 501 are distributed, and the number of the first through grooves 501 is 11, first logical groove 501 is half notch form, and 5 top both sides of bottom plate all are provided with a plurality of fixed plates 504, and fixed plate 504 all is located second logical groove 502, a plurality of connective bars 505 of the outside fixedly connected with of fixed plate 504, connective bar 505 one end all with 5 fixed connection of bottom plate, and a plurality of through-holes 503 have evenly been seted up at 5 tops of bottom plate, and the pin of 3 bottoms of chip can pass through-hole 503, and then conveniently carry out the operation of working a telephone switchboard.

Wherein, both sides of the top of the limit frame 4 are fixedly connected with a plurality of fixed blocks 402, both sides of the top of the fixed blocks 402 are fixedly connected with radiating pins 403, which can improve the radiating effect, so that heat can be conducted to the radiating substrate 1 as fast as possible, thereby enabling the chip 3 to run highly, both sides of the top of the packaging shell 2 are respectively provided with a plurality of sliding grooves, the sliding grooves are matched with the radiating pins 403, both sides of the bottom of the packaging shell 2 are respectively provided with a bar-shaped groove, the bar-shaped grooves are matched with the radiating fins 401, so that the packaging shell 2 can be tightly attached to the radiating substrate 1 and can not be blocked by the radiating fins 401, the bottom of the chip 3 is fixedly connected with a plurality of pins, the pins are matched with the through holes 503, the bottom of the radiating substrate 1 is uniformly provided with a plurality of pin holes, the pin holes are matched with the pins at the bottom of the chip 3, thereby facilitating the wiring operation, the bottom of the radiating substrate 1 is fixedly connected with a plurality of wiring balls 101, the wire ball 101 is a solder ball, and can be directly soldered to a circuit board, and is fixed firmly and also can be operated easily.

When encapsulating chip 3 and heat dissipation base plate 1, at first spout the heat dissipation and glue between spacing frame 4 and chip 3, further heat dissipation glues and flows to bottom plate 5, owing to the first logical groove 501 that sets up, make the heat dissipation glue flow to first logical groove 501 in, further heat dissipation glue flows to second logical groove 502 in, make the heat dissipation glue cover in the gap between first logical groove 502 and the connective bar 505, and then increase the coverage area that the heat dissipation was glued, and the maintenance ability that the heat dissipation was glued has been improved, make the heat dissipation glue be difficult for droing, and then make the heat dissipation glue be difficult to appear the layering between 3 with the chip, spacing frame 4 of setting, heat dissipation foot and fin 403, can strengthen heat dissipation performance, and the heat dissipation efficiency is improved.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a multi-chip package structure for microwave communication, includes heat dissipation base plate (1), heat dissipation base plate (1) top is equipped with chip (3), heat dissipation base plate (1) top fixedly connected with encapsulation shell (2), its characterized in that: the top of the heat dissipation substrate (1) is fixedly connected with a limiting frame (4), the chip (3) is positioned at the inner side of the limiting frame (4), the top of the heat dissipation substrate (1) is fixedly connected with a bottom plate (5), the bottom plate (5) is matched with the limit frame (4), a plurality of second through grooves (502) are respectively arranged on the two sides of the top of the bottom plate (5), the second through grooves (502) are distributed at equal intervals, the front surface and the back surface of the bottom plate (5) are both provided with a plurality of first through grooves (501), the first through grooves (501) are distributed at equal intervals, a plurality of fixing plates (504) are arranged on both sides of the top of the bottom plate (5), the fixing plates (504) are all positioned in the second through grooves (502), a plurality of connecting rods (505) are fixedly connected to the outer parts of the fixing plates (504), one end of the connecting rod (505) is fixedly connected with the bottom plate (5), and a plurality of through holes (503) are uniformly formed in the top of the bottom plate (5).

2. The multi-chip package structure for microwave communication according to claim 1, wherein: the utility model discloses a spacing frame (4) top both sides equal fixedly connected with a plurality of fixed blocks (402), the equal fixedly connected with heat dissipation foot (403) in fixed block (402) top, a plurality of sliding trays have all been seted up to encapsulation shell (2) top both sides, sliding tray and heat dissipation foot (403) looks adaptation.

3. The multi-chip package structure for microwave communication according to claim 1, wherein: a strip-shaped groove is formed in each of two sides of the bottom of the packaging shell (2), and the strip-shaped grooves are matched with the radiating fins (401).

4. The multi-chip package structure for microwave communication according to claim 1, wherein: the bottom of the chip (3) is fixedly connected with a plurality of pins, and the pins are matched with the through holes (503).

5. The multi-chip package structure for microwave communication according to claim 1, wherein: a plurality of pin holes are uniformly formed in the bottom of the heat dissipation substrate (1), and a plurality of wiring balls (101) are fixedly connected to the bottom of the heat dissipation substrate (1).