CN100388475C - Lead carriage and packing structure using same - Google Patents
Lead carriage and packing structure using same Download PDFInfo
- Publication number
- CN100388475C CN100388475C CNB2005100663335A CN200510066333A CN100388475C CN 100388475 C CN100388475 C CN 100388475C CN B2005100663335 A CNB2005100663335 A CN B2005100663335A CN 200510066333 A CN200510066333 A CN 200510066333A CN 100388475 C CN100388475 C CN 100388475C
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- Prior art keywords
- lead frame
- encapsulating structure
- chip
- radiating wing
- chip carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
The present invention relates to a lead frame and a packaging structure using the lead frame. The lead frame comprises a chip holder, a heat radiation wing and a plurality of pins, wherein the chip holder loads at least one semiconductor chip; the heat radiation wing outwards extends from two sides of the chip holder; the pins which are distributed at the periphery of the chip holder extend to the two sides of the chip holder. The pins and the heat radiation wing are regularly arrayed; the pins which extend to the two sides of the chip holder are respectively connected with each other by connecting rods connected with the heat radiation wing; opening sets which are regularly arrayed on the heat radiation wing corresponding to the periphery of paths; the connecting rods pass through the paths when the connecting rods extend. The present invention has the advantages that the pins are divided by fixing moulds, the cost for replacing the moulds can be avoided, the time and the labor cost for replacing the moulds can be saved, the contact area of the heat radiation wing and packing glue bodies can be reduced by that openings are formed in the heat radiation wing, the packing structure is strengthened, and the possibility of delamination caused by that moisture enters and the possibility that the chip is polluted can be reduced.
Description
Technical field
The present invention is the encapsulating structure that closes a kind of lead frame and use this lead frame, particularly about a kind of encapsulating structure that has the lead frame of high cooling efficiency and use this lead frame.
Background technology
The conventional semiconductors chip forms semiconductor package part with lead frame (Lead Frame) as chip bearing member.This lead frame comprises chip carrier and is formed on this chip carrier many pins on every side, after treating that semiconductor chip is bonded on the chip carrier and electrically connects this chip and pin with bonding wire, coat the inner segment of this chip, chip carrier, bonding wire and pin again via potting resin, form the semiconductor package part that this has lead frame.
With lead frame as the kenel of the semiconductor sealing of chip bearing member and of a great variety, as QFP semiconductor package part (Quad Flat Package), QFN (Quad-Flat Non-leaded) semiconductor package part, little external form packaging part (Small Outline Package, SOP) semiconductor package part (Small Out line Package), the little external form packaging part of heat dissipation type (Heat-sink Small Out linePackage, HSOP) or dual in-line package part (Dual-In-Line Package, DIP) semiconductor package part etc.Wherein, along with the semiconductor process technology is constantly progressive, the processing speed of chip and functional requirement also promote thereupon, and the heat how effectively incident problem produces when being loss chip operation is to keep the reliability of semiconductor device.Be changed to example with dual in-line package part (DIP) or little external form packaging part semiconductor devices such as (SOP), because chip is to be coated by the not good adhesive material of heat-conducting effect, the heat that this chip produces in the high-speed cruising process can't be smoothly, discharge effectively, can have a strong impact on the effective utilization of these devices, cause using the electronic component of these chips to lose efficacy.
Prior art is for solving the heat dissipation problem of this type of packaging part, often be as the heat radiation approach with the pin that exposes outside these packaging part both sides, spill on the printed circuit board (PCB) by the heat of these pins chip, and being diffused into the external world by this printed circuit board (PCB), the little external form packaging part of for example existing heat dissipation type (HSOP) promptly is by dispelling the heat from the extended radiating wing in chip carrier both sides.As United States Patent (USP) the 5th, 877, No. 937 and Japan Patent JP01217386 disclose, and are to set up radiating wing (Wing Tab) in lead frame, promote the radiating efficiency of this packaging part, so often be applied on the electronic product of high power, high electric current.Please refer to Figure 1A and Figure 1B, this is 10A, the 10B floor map of lead frame of the HSOP34 encapsulating structure of the HSOP28 (28 pins) of height heat radiation encapsulation kenel of industry widespread usage and derive of the same type thereof but more pin.
The conducting wire frame structure of these types has the external form and the lead pin pitch of same size, and not being both by the size of heat-dissipating fin area of its number of pins decided; It comprises chip carrier 11A and 11B, from this chip carrier 11A and extended two radiating wings (Wing Tab) 13A and the 13B in 11B both sides and be laid in this chip carrier 11A and 11B around many pin one 2A and 12B, these many pin one 2A and 12B and this two radiating wing 13A and 13B proper alignment be at homonymy, and use a connecting rod 14A and 14B (Dam-Bar) to interconnect respectively.Put semiconductor chip and electrically connecting with bonding wire respectively and between each pin one 2A and the 12B for follow-up connecing on this chip carrier 11A and the 11B, by the heat of these two radiating wing 13A and the generation of 13B loss chip.
Because this HSOP28 and derive more pin of the same type HSOP34 both under the external form of same size and identical pin spacer conditions, because of radiating wing length, number of pins difference, therefore in packaging process, to carry out die-cut connecting rod when separating respectively this pin, the connecting rod quantity of required excision is also different, also must adopt different production moulds in addition, in like manner, as processing HSOP36, HSOP38 ... Deng the time, also need adopt specific separately mould.
So, product at different pins all has the connecting rod of specific quantity to excise, therefore need the different production mould of collocation, thus except increasing die cost, also cause time and cost of labor on the mold exchange more, even because the mold exchange frequency increase risk that can cause cutting wrong pin number more.
In addition; when the little external form packaging part of this heat dissipation type (HSOP) carries out packaging process; chip is connect the chip carrier of putting at lead frame; and make this chip be electrically connected to the pin of lead frame by bonding wire; form the packing colloid that coats this lead frame and chip afterwards again; and make radiating wing and pin be exposed at outside this packing colloid outward, avoid being subjected to external pollution by the chip that this packing colloid protection coats wherein.When coating this lead frame because of this packing colloid, the radiating wing of packing colloid and lead frame belongs to unlike material, and then area is excessive each other, external moisture easily enters in the packaging part by the large contact surface between radiating wing and packing colloid is long-pending, not only cause this faying face generation delamination easily, easilier make chip contaminated useful life that influences packaging part.
Therefore, developing a kind of conducting wire frame structure and can avoid changing the problem that production mould causes cost increase and operation reliability to reduce, reduce simultaneously between radiating wing and packing colloid delamination takes place, is present problem demanding prompt solution.
Summary of the invention
For overcoming the shortcoming of above-mentioned prior art, main purpose of the present invention provides a kind of lead frame and uses the encapsulating structure of this lead frame, can effectively avoid the cost that uses multiple production mould spent.
A further object of the present invention provides a kind of encapsulating structure that can increase the lead frame of prouctiveness and use this lead frame.
An also purpose of the present invention provides a kind of lead frame of the risk that can reduce production and uses the encapsulating structure of this lead frame.
Another purpose of the present invention provides a kind of lead frame and uses the encapsulating structure of this lead frame, avoids moisture to enter encapsulating structure and causes packing colloid and lead frame generation delamination, makes chip avoid polluting.
Another object of the present invention provides a kind of lead frame of the thermal diffusivity of strengthening encapsulating structure and uses the encapsulating structure of this lead frame.
For reaching above-mentioned and other purpose, lead frame of the present invention comprises: chip carrier, carry at least one semiconductor chip; Radiating wing stretches out from these chip carrier both sides; And many pins, be laid in around this chip carrier and extend to this chip carrier both sides, with this radiating wing proper alignment, many pins that wherein extend to these chip carrier both sides are connected by the connecting rod that links to each other with this radiating wing respectively, and be formed with regularly arranged groups of openings on this radiating wing around should connecting rod extending through the path, this aperture widths is identical with this lead foot spacing.Wherein this groups of openings position can be arranged on the left and right sides of this connecting rod by the path, and this connecting rod is arranged on this radiating wing continuously, and this groups of openings position also can extend through on the path over against being arranged on this connecting rod in addition.
Lead frame of the present invention is on the fixing lead frame of overall dimensions and lead pin pitch, when the die-cut connecting rod (Dam bar) during corresponding follow-up encapsulation separates respectively this pin, allow that with maximum number of pins is a benchmark in advance, on radiating wing, be formed with groups of openings around the corresponding connecting rod extension path, on the same set of production mould, can be applicable to and carry out die-cut connecting rod (Dam bar) on the lead frame of different number of pins and separate respectively this pin, need not substitute Die cutting tool, improve the utilance of mould, avoid producing error and take place, can reduce die cost and improve prouctiveness.
In addition, the present invention also provides a kind of encapsulating structure that above-mentioned lead frame carries out packaging process of using, this encapsulating structure comprises: a lead frame has chip carrier, from this outward extending radiating wing in chip carrier both sides and be laid in around this chip carrier and extend to many pins of these chip carrier both sides and this radiating wing proper alignment; At least one semiconductor chip connects and puts on this chip carrier and be electrically connected to this many pins; An and packing colloid, coat this lead frame and chip, and make this radiating wing and many pins be exposed at outside this packing colloid outward, wherein at this radiating wing to should the packing colloid wrapped position being formed with a plurality of regularly arranged perforates, this aperture widths is identical with this lead foot spacing.
The width of this perforate is rough identical with this lead pin pitch.In addition, at least one heat sink that is provided with fastener can be fastened on by its fastener in the perforate of the radiating wing that exposes outside this packing colloid in this encapsulating structure, can not change under former encapsulation operation and the structure, increase area of dissipation and heat dissipation path, promote heat dissipation.
Another kind of encapsulating structure of the present invention comprises: a lead frame, and it has the tool chip carrier, from this outward extending radiating wing in chip carrier both sides and be laid in around this chip carrier and extend to many pins of these chip carrier both sides and this radiating wing proper alignment; At least one semiconductor chip connects and puts on this chip carrier and be electrically connected to this many pins; One packing colloid, coat this lead frame and chip, and make this radiating wing and many pins be exposed at outside this packing colloid outward, wherein at this radiating wing to should the packing colloid wrapped position being formed with a plurality of regularly arranged perforates, this aperture widths is identical with this lead foot spacing; And at least one heat sink, connect and put on this packing colloid, and be formed with at least one fastener on this heat sink, this heat sink correspondence is fastened in the perforate that exposes outside this packing colloid on this radiating wing.
Therefore, lead frame of the present invention and the encapsulating structure of using this lead frame can adopt fixed mould to cut apart pin, avoid when producing the encapsulating structure of varying number pin, need using the spent cost of different production moulds, lead-time and cost of labor have been saved, and then removed because of placing wrong mould generation mistake, in addition, in radiating wing, be formed with contact area that perforate can reduce radiating wing and packing colloid, strengthened encapsulating structure, reduced moisture and entered and cause delamination and the contaminated possibility of chip.
Description of drawings
Figure 1A and Figure 1B are existing conducting wire frame structures with different number of pins;
Fig. 2 A is a lead frame floor map of the present invention;
Fig. 2 B and Fig. 2 C are the schematic diagrames of wire-frame type encapsulating structure of the present invention;
Fig. 3 is the floor map of lead frame embodiment 2 of the present invention;
Fig. 4 A to Fig. 4 C is the schematic diagram of lead frame encapsulation structure embodiment 3 of the present invention;
Fig. 5 is the schematic diagram of wire-frame type encapsulating structure embodiment 4 of the present invention; And
Fig. 6 is the schematic diagram of wire-frame type encapsulating structure embodiment 5 of the present invention.
Embodiment
Now with the lead frame explanation specific embodiments of the invention of heat radiating type small size semiconductor package part (HSOP) and application thereof, lead frame of the present invention is not limited thereto, also can be the conducting wire frame structure of other class shape.
Embodiment 1
Fig. 2 A to Fig. 2 C is embodiment 1 schematic diagram of lead frame of the present invention and the encapsulating structure of using this lead frame.
Fig. 2 A is the conducting wire frame structure floor map that each pin connects with connecting rod before encapsulation that is applied in heat radiating type small size semiconductor package part (HSOP).This lead frame 200 comprises: can for connect the chip carrier 201 of putting semiconductor chip, from this outward extending radiating wing 204 in chip carrier 201 both sides and be laid in around this chip carrier 201 and extend to many pin twos 02 of these chip carrier 201 both sides and this radiating wing 204 proper alignment.Many the pin twos 02 that wherein extend to these chip carrier 201 both sides are connected by the connecting rod 203 that links to each other with this radiating wing 204 respectively, and are formed with regularly arranged groups of openings 205 on every side to should connecting rod 203 extending through the path in this radiating wing 204.In the present embodiment, the position of opening in this radiating wing 204 is arranged on the left and right sides of this connecting rod 203 by the path, and this connecting rod 203 is arranged on this radiating wing 204 continuously.
The icon of present embodiment is to be that example describes with the lead frame that is applied in HSOP28, just it respectively is laid with 14 pins (totally 28 pins) in the lead frame both sides, corresponding general industry is used the situation that maximum pin is 42 (the lead frame both sides respectively are laid with 21 pins), can on each radiating wing 204 of these chip carrier 201 both sides, provide connecting rod 203 to be provided with on it continuously in advance, regularly arrangedly in these connecting rod 203 both sides be formed with 6 groups of perforates 205, and the width of this perforate 205 is the rough respectively spacing of this pin two 02 that equals, make that the mould be used for 42 number of pins can die-cut this connecting rod 203, separate respectively this pin two 02, also can enough Die cutting tools cut off connecting rod 203 parts on this radiating wing 204, can not influence number of pins and the operation of this HSOP28, need not adopt different moulds according to different number of pins, can fully promote production capacity and reduce die cost and the risk that reduces human error.
Fig. 2 B and Fig. 2 C are isogonism and the generalized sections that the lead frame shown in Fig. 2 A is applied in heat radiating type small size semiconductor package (HSOP28).。
This encapsulating structure comprises: a lead frame 200 has chip carrier 201, from this outward extending radiating wing 204 in chip carrier 201 both sides and be the pin two 02 that is laid in around this chip carrier 201 and extends to these chip carrier 201 both sides and this radiating wing 204 proper alignment; At least one semiconductor chip 21 is to connect to put on this chip carrier 201, and electrically connects this pin two 02; One packing colloid 23, coat this lead frame 200 and chip 21, and make this radiating wing 204 and many pin twos 02 be exposed at outside this packing colloid 23 outward, wherein should packing colloid 23 wrapped position be formed with regularly arranged perforate 205 204 pairs of this radiating wings, the rough spacing with this pin two 02 of the width of this perforate 205 is identical.
The present invention connects semiconductor chip 21 to put on this chip carrier 201, and utilize many bonding wires 22 that this chip 21 and pin around the chip carrier 202 are electrically connected, carry out sealing, die-cut step and bending respectively this pin two 02 and radiating wing 204 afterwards, constitute this encapsulating structure.Wherein carrying out die-cut this connecting rod 203 when separating respectively this pin two 02, this Die cutting tool promptly can cut off connecting rod 203 parts on this radiating wing 204 simultaneously, be formed with regularly arranged continuous perforate 205, so can reduce the contact area of packing colloid 22 and radiating wing 204, reduce external moisture and enter in the encapsulating structure, avoid the generation of problems such as delamination and chip pollution along the faying face of this packing colloid 22 with radiating wing 204.
This bonding wire 22 can comprise signal bond wires and ground connection bonding wire in addition, connecing the chip of putting at this chip carrier 201 21 can utilize signal bond wires to be electrically connected to pin two 02, utilize the ground connection bonding wire to be electrically connected to this chip carrier 201, be electrically connected to ground plane in the printed circuit board (PCB) by this radiating wing again.
Embodiment 2
Fig. 3 is the floor map of the embodiment 2 of lead frame of the present invention.
The lead frame 300 of present embodiment 2 is roughly the same with the foregoing description, and the groups of openings 305 that the main distinction is formed on the radiating wing 304 promptly extends through on the path over against being arranged on this connecting rod 303.When carrying out this connecting rod 303 of die-cut connection pin 302, Die cutting tool can be cut sky simultaneously and be formed on groups of openings 305 on this radiating wing 304, can utilize single mold to be suitable on the encapsulating structure of different number of pins equally.Relatively, promptly be similar to the described encapsulating structure of the foregoing description utilizing this lead frame to carry out the encapsulating structure that forms after the steps such as crystalline substance, routing, sealing, die-cut and bending of putting of packaging process.
Embodiment 3
Fig. 4 A to Fig. 4 C is isogonism and the generalized section of the encapsulating structure embodiment 3 of application lead frame of the present invention.
Encapsulating structure and the above embodiments of present embodiment 3 are roughly the same, the main distinction is additionally to connect to put a heat sink 45 on the packing colloid 43 above this semiconductor chip 41 of coating, this heat sink 45 can be the plate shaped heat sink of high-termal conductivity such as aluminium or copper, have enough big area, can extraordinary radiating effect when connecing the packing colloid 43 that can fully cover on the chip 41 when putting at encapsulating structure.
On the edge on these 45 two long limits of heat sink, be respectively equipped with at least one fastener 450 as shown in the figure at its place, two long limits, to may be selected to be each limit one or more for the quantity that is provided with of this fastener 450, Fig. 4 A shows that each limit has a fastener 450, Fig. 4 B shows that each limit has three fasteners 450, these fastener 450 correspondences being fastened on the radiating wing 404 of this encapsulating structure exposing outside in the perforate 405 of this packing colloid 43, is that encapsulating structure improves preferable radiating effect by this heat sink 45.Between this packing colloid 43 and heat sink 45, can be coated with one deck heat-conducting glue (not marking) in addition, to promote radiating efficiency.
Above-mentioned fastener 450 is not necessarily to be formed on the edge of this heat sink 45, as long as this fastener 450 is formed on the position of this heat sink 45 corresponding to perforate 405 positions that expose outside packing colloid 43 on this radiating wing 404, in addition the structural form of this fastener 450 is not to exceed with shown in the accompanying drawing, and other can be all applicable for the structure that this heat sink 45 effectively is connected in radiating wing 404 perforates 405 of this encapsulating structure.And the radiating requirements of looking encapsulating structure can freely change the length and width size and shape of this heat sink 45.
Therefore by the setting of this heat sink 45, the heat dissipation path that covers chip 41 in the packing colloid 43 can be loose to heat to printed circuit board (PCB) with radiating wing 404 rows via chip carrier 401, two heat dissipation path have been increased again, i.e. " chip-packing colloid-heat-conducting glue-heat sink-external world " and " chip-chip carrier-radiating wing-fastener-heat sink-external world ", can satisfy the radiating requirements of semiconductor chip by the large tracts of land heat sink of the present invention's design.
Embodiment 4
Fig. 5 is the generalized section of the encapsulating structure embodiment 4 of application lead frame of the present invention.
Encapsulating structure and the foregoing description of present embodiment are roughly the same, the main distinction is the heat sink 55 on the packing colloid 53 that is coated on above the semiconductor chip 51, can have in its surface design and be a plurality of pin fins 551 (Pin Fin) that array is arranged, increase the contact area of this heat sink 55 and outside air, can further promote radiating efficiency.
Embodiment 5
Fig. 6 is the generalized section of the encapsulating structure embodiment 5 of application lead frame of the present invention.The encapsulating structure of present embodiment 5 and the foregoing description roughly the same, the main distinction is in the perforate 605 of the lead frame radiating wing 604 that correspondence exposes outside packing colloid 63 in this encapsulating structure, be filled with Heat Conduction Material 66 (for example heat-conducting cream etc.) in addition, increase the heat dissipation path and the area of this encapsulating structure, promote radiating efficiency.
Certainly in the present embodiment 5 in the radiating wing perforate that exposes outside packing colloid the characteristic of filling Heat Conduction Material, also can be combined with the above-mentioned embodiment that is equipped with heat sink that on packing colloid, connects, can be in the radiating wing perforate that exposes outside packing colloid, supply the interior Heat Conduction Material of filling of perforate of the fastener engaging of heat sink, so can increase the radiating efficiency of this encapsulating structure.
Though mainly be as an illustration in the accompanying drawing of the present invention with HSOP28 structure with 28 pins, but the present invention can be applicable to HSOP32, HSOP34 too ... in encapsulating structure with multitube pin more, realize that multiple pin counts the purpose that product is produced at same set of production mould, increase prouctiveness, reduce die cost and produce wrong risk.Therefore lead frame of the present invention and use the encapsulating structure of this lead frame, mainly be on the fixing lead frame of overall dimensions and lead pin pitch, when separating respectively this pin corresponding to the die-cut connecting rod (Dam bar) in follow-up when encapsulation, allow that with maximum number of pins is a benchmark in advance, on radiating wing, be formed with groups of openings around the corresponding connecting rod extension path, can be on same set of production mould, can be applicable to and carry out die-cut connecting rod (Dam bar) on the lead frame of different number of pins to separate respectively this pin, need not substitute Die cutting tool, the utilance of mould is provided, avoid producing the generation of error, and then can reduce die cost and improve prouctiveness.The present invention just adopts fixing mould to cut apart pin, avoid when producing the encapsulating structure of varying number pin, need using the spent cost of different production moulds, lead-time and cost of labor have also been saved, and then removed because of placing the wrong wrong possibility of mould generation, in addition, in radiating wing, form the contact area that perforate can reduce radiating wing and packing colloid, also reduced delamination and the chip that moisture causes and be subjected to contamination of heavy.
In addition, the present invention can be fastened at least one heat sink that is provided with fastener in the perforate of the radiating wing that exposes outside this packing colloid in this encapsulating structure by its fastener, and then can not change under former encapsulation operation and the structure, increase area of dissipation and heat dissipation path, promote heat dissipation.
Claims (14)
1. a lead frame is characterized in that, this lead frame comprises:
Chip carrier carries at least one semiconductor chip;
Radiating wing stretches out from these chip carrier both sides; And
Many pins, be laid in around this chip carrier and extend to this chip carrier both sides, with this radiating wing proper alignment, many pins that wherein extend to these chip carrier both sides are connected by the connecting rod that links to each other with this radiating wing respectively, and be formed with regularly arranged groups of openings on this radiating wing around should connecting rod extending through the path, this aperture widths is identical with this lead foot spacing.
2. lead frame as claimed in claim 1 is characterized in that, this lead frame is a lead frame of strengthening the heat radiating type small size semiconductor package part of radiating effect.
3. lead frame as claimed in claim 1 is characterized in that, the position of opening in this radiating wing is to be positioned at the left and right sides that this connecting rod extends through the path.
4. lead frame as claimed in claim 1 is characterized in that this connecting rod is arranged on this radiating wing continuously.
5. lead frame as claimed in claim 1 is characterized in that, the perforate in this radiating wing is to extend through on the path over against being arranged on this connecting rod.
6. an encapsulating structure of using lead frame is characterized in that, this encapsulating structure comprises:
One lead frame has chip carrier, from this outward extending radiating wing in chip carrier both sides and be laid in around this chip carrier and extend to many pins of these chip carrier both sides and this radiating wing proper alignment;
At least one semiconductor chip connects and puts on this chip carrier and be electrically connected to this many pins; And
One packing colloid, coat this lead frame and chip, and make this radiating wing and many pins be exposed at outside this packing colloid outward, wherein at this radiating wing to should the packing colloid wrapped position being formed with a plurality of regularly arranged perforates, this aperture widths is identical with this lead foot spacing.
7. encapsulating structure as claimed in claim 6 is characterized in that, this chip is to utilize many bonding wires to be electrically connected to this lead frame.
8. encapsulating structure as claimed in claim 6 is characterized in that this encapsulating structure includes Heat Conduction Material, and it is to be filled in the radiating wing perforate that exposes outside this packing colloid.
9. an encapsulating structure of using lead frame is characterized in that, this encapsulating structure comprises:
One lead frame, it has the tool chip carrier, from this outward extending radiating wing in chip carrier both sides and be laid in around this chip carrier and extend to many pins of these chip carrier both sides and this radiating wing proper alignment;
At least one semiconductor chip connects and puts on this chip carrier and be electrically connected to this many pins;
One packing colloid, coat this lead frame and chip, and make this radiating wing and many pins be exposed at outside this packing colloid outward, wherein at this radiating wing to should the packing colloid wrapped position being formed with a plurality of regularly arranged perforates, this aperture widths is identical with this lead foot spacing; And
At least one heat sink connects and puts on this packing colloid, and is formed with at least one fastener on this heat sink, and this heat sink correspondence is sticked in the perforate that exposes outside this packing colloid on this radiating wing.
10. encapsulating structure as claimed in claim 9 is characterized in that, this heat sink is the plate shaped radiator structure of a thermal conductivity.
11. encapsulating structure as claimed in claim 9 is characterized in that, this heat sink surface design has a plurality of pin fins.
12. encapsulating structure as claimed in claim 9 is characterized in that, this encapsulating structure also includes Heat Conduction Material, and it is to be filled in the part of not using for the fastener engaging of this heat sink in the radiating wing perforate that exposes outside this packing colloid.
13. encapsulating structure as claimed in claim 9 is characterized in that, this encapsulating structure also includes heat-conducting glue, and it is to be coated between this packing colloid and the heat sink.
14. encapsulating structure as claimed in claim 9 is characterized in that, this chip is to utilize many bonding wires to be electrically connected to this lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100663335A CN100388475C (en) | 2005-04-22 | 2005-04-22 | Lead carriage and packing structure using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100663335A CN100388475C (en) | 2005-04-22 | 2005-04-22 | Lead carriage and packing structure using same |
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| Publication Number | Publication Date |
|---|---|
| CN1851913A CN1851913A (en) | 2006-10-25 |
| CN100388475C true CN100388475C (en) | 2008-05-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2005100663335A Expired - Fee Related CN100388475C (en) | 2005-04-22 | 2005-04-22 | Lead carriage and packing structure using same |
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| CN103531551A (en) * | 2013-09-26 | 2014-01-22 | 杰群电子科技（东莞）有限公司 | Semiconductor packaging structure and forming method thereof |
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| US5877937A (en) * | 1995-12-28 | 1999-03-02 | Rohm Co., Ltd. | Encapsulated semiconductor device and electronic circuit board mounting same |
| US20040177984A1 (en) * | 2003-03-11 | 2004-09-16 | Groothuis Steven K. | Microelectronic component assemblies having lead frames adapted to reduce package bow |
| CN1567585A (en) * | 2003-06-20 | 2005-01-19 | 晶致半导体股份有限公司 | Semiconductor package having heat sink |
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2005
- 2005-04-22 CN CNB2005100663335A patent/CN100388475C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5877937A (en) * | 1995-12-28 | 1999-03-02 | Rohm Co., Ltd. | Encapsulated semiconductor device and electronic circuit board mounting same |
| US20040177984A1 (en) * | 2003-03-11 | 2004-09-16 | Groothuis Steven K. | Microelectronic component assemblies having lead frames adapted to reduce package bow |
| CN1567585A (en) * | 2003-06-20 | 2005-01-19 | 晶致半导体股份有限公司 | Semiconductor package having heat sink |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1851913A (en) | 2006-10-25 |
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