JP3514610B2 - Package for microwave equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave device package for accommodating microwave devices such as amplifiers, mixers and oscillators used for satellite communication, terrestrial microwave communication, mobile communication and the like.

[0002]

2. Description of the Related Art Conventionally, there has been a microwave device package as shown in FIG. FIG. 6 shows, as a conventional example, “Microwave Module Packaging” (IEEE MTT-S DI
FIG. 19 is an exploded perspective view showing the basic configuration of the microwave device package shown in GEST 1992 P1503). In FIG.
31 is a ceramic base, 32 is a first layer ceramic frame, 33 is a second layer ceramic frame, 34 is a lid,
35 is an input terminal, 36 is an output terminal, 37 is a bias terminal, 38 is an input matching circuit board, 39 is an output matching circuit board, and 40 is a semiconductor chip.

An input terminal 35, an output terminal 36 and a bias terminal 37 are formed on the first layer ceramic frame 32 by forming a metal film, and the front and back surfaces of the first layer ceramic frame 32 and the second layer ceramic frame 33 are formed. A connection line is formed of a metal film at a predetermined portion of the above, and these are integrally formed by simultaneous firing. The input matching circuit board 38, the output matching circuit board 39, and the semiconductor chip 40 are inserted into the first layer ceramic frame 32 and the second layer ceramic frame 33, attached to the ceramic base 31, and then the lid 34 is attached to the second layer. Ceramic frame 33
It is covered over, attached by a sealing means such as soldering or welding, and hermetically sealed.

Next, with reference to FIG. 6, the operation of the conventional microwave device package will be described. A signal input from the input terminal 5 is amplified by an amplifier composed of the input matching circuit board 8, the output matching circuit board 9 and the semiconductor chip 10, and taken out from the output terminal 6. The bias terminal 7 is used to apply a bias voltage to the semiconductor chip. The heat generated from the semiconductor chip propagates through the ceramic base 1 and is radiated from the housing. When the side surface metal film is provided on the outside of the package of the first-layer ceramic frame 2 and the second-layer ceramic frame 3, the cutoff frequency of the package is determined by the package outer dimensions.

[0005]

In the conventional package for a microwave device, as shown in FIG. 6, since a ceramic base is used, there is a problem that the heat dissipation characteristic is poor, and the first layer ceramic frame is also present. When the side surface metal film is provided on the outer side of the package of the second layer ceramic frame, the package cutoff frequency is low,
There is a problem that an in-band signal is fed back in the package and oscillation is likely to occur. Moreover, since the input matching circuit board 8, the output matching circuit board 9 and the first layer ceramic frame 2 are composed of separate components, the manufacturing cost is reduced. However, there is a problem that the size becomes higher and it becomes difficult to reduce the size.

The present invention has been made to solve the above conventional problems, and an object of the present invention is to provide a microwave device package which has good heat dissipation characteristics, is hard to oscillate, and can be easily miniaturized.

[0007]

A microwave device package according to a first aspect of the present invention includes a ceramic base, a first-layer ceramic frame arranged on the ceramic base, and the first-layer ceramic frame. A second-layer ceramic frame which is arranged in a layered manner on a single-layer ceramic frame, and a semiconductor chip and an input and output matching circuit board are provided in an inner region of the first-layer and second-layer ceramic frames on the ceramic base. In a microwave device package to be housed, a heat dissipation metal plate is arranged on the surface of the ceramic base, and the semiconductor chip and the input and output matching circuit board are mounted on the heat dissipation metal plate. A metal film is provided on the front surface and the back surface of the base at predetermined locations, and the ceramic ba The by providing a through hole in contact with the metal film by filling a metal, in which so as to electrically and thermally conductive the front and back surfaces of the metal film.

A microwave device package according to a second aspect of the present invention is provided on the surface of the ceramic base with respect to the inner side surfaces of the first layer ceramic frame and the second layer ceramic frame. The metal film is arranged so as to be electrically connected to the metal film.

In a microwave device package according to a third aspect of the present invention, a protrusion is provided on the inside of the package of the first layer ceramic frame and the second layer ceramic frame, and the ceramic is provided on the side surface of the protrusion. The metal film is provided so as to be electrically connected to the metal film provided on the surface of the base.

A microwave device package according to a fourth aspect of the present invention is provided on the surface of the ceramic base with respect to the portion of the first layer ceramic frame facing the second layer ceramic frame inside the package. A through hole filled with a metal arranged so as to be electrically connected to the metal film is provided.

A microwave device package according to a fifth aspect of the present invention is a tip formed of a microstrip line in a region formed inside the second layer ceramic frame on the first layer ceramic frame. It consists of distributed constant type circuit elements such as open line, tip short-circuited line, radial stub, DC element circuit using inter-line coupling, or lumped constant type circuit element such as thin film resistor, opposed parallel plate type capacitor and spiral inductor. The input matching circuit and the output matching circuit composed of microwave circuit elements are configured.

[0012]

DETAILED DESCRIPTION OF THE INVENTION

Embodiment 1. First, the configuration of the microwave device package according to the first embodiment of the present invention will be described with reference to FIG. 1 is an exploded perspective view showing a configuration of a microwave device package according to a first embodiment of the present invention. In FIG. 1, 1 is a ceramic base having a through hole 11, 2 is a first layer ceramic frame, and 3 is a second layer ceramic frame.

Further, 4 is a lid, 5 is an input terminal, 6 is an output terminal, 7 is a bias terminal, 8 is an input matching circuit board, 9 is an output matching circuit board, 10 is a semiconductor chip, and 11 is a ceramic base 1. Through hole filled with metal provided, 1
2 is a metal plate for heat radiation to which the semiconductor chip 10 is attached. Although the semiconductor chip 10 is attached to the heat dissipation metal plate 12, the input matching circuit board 8 and the output matching circuit board 9 may be attached.

Next, the operation of the microwave device package according to the present embodiment will be described. Metal films (not shown) are provided on the front and back surfaces of the ceramic base 1,
These metal films are electrically and thermally conducted through the through holes 11 filled with metal. The heat generated from the semiconductor chip 10 is diffused in a wide area by the metal plate 12 for heat radiation, propagates through the through hole 11 and the metal film filled with metal, and is radiated to the housing (not shown). As described above, according to this embodiment, a microwave device package having excellent heat dissipation characteristics can be obtained.

Embodiment 2. The configuration of the microwave device package according to the second embodiment of the present invention will be described below with reference to FIG. FIG. 2 is an exploded perspective view showing the configuration of the microwave device package according to the second embodiment of the present invention. In FIG. 2, 13 is a side surface metal film provided on the inner side surface of the first layer ceramic frame 22, and 14 is a side surface metal film provided on the inner side surface of the second layer ceramic frame 23.

Reference numeral 22 denotes a first layer ceramic frame having a side surface metal film 13 provided on a portion facing the inside of the package, and 23 denotes a second layer having a side surface metal film 14 provided on a portion facing the inside of the package. It is a ceramic frame,
Each of the side surface metal films 13 and 14 is configured to be electrically connected to the metal film provided on the surface of the ceramic base 1 and the lid 4. Note that, in FIG. 2, constituent members having the same reference numerals as those shown in FIG. 1 are the same as those in FIG.

Next, the operation of the microwave device package according to the present embodiment will be described. The side surface metal films 13 and 14 provided on each side surface of the first-layer ceramic frame 22 and the second-layer ceramic frame 23, the metal film (not shown) provided on the surface of the ceramic base 1, and the lid are pseudo. A waveguide is formed. The cut-off frequency of the package is the first and second layer ceramic frames 2.
Since it is determined by the distance between the side surface metal films 13 and 14 of 2 and 23 facing each other, the case where the side surface metal film is provided on the inner side surface of the package and the case where the side surface metal film is provided on the outer side surface as in the above-mentioned conventional example are compared. Then, the former has a smaller gap (lateral dimension) between the side surface metal films of the ceramic frame facing each other, and the cutoff frequency becomes higher. As described above, according to this embodiment, the cutoff frequency of the package is increased, and oscillation due to the feedback of the in-band signal inside the microwave device package can be prevented.

Embodiment 3. The configuration of the microwave device package according to the third embodiment of the present invention will be described below with reference to FIG. FIG. 3 is an exploded perspective view showing the configuration of the microwave device package according to the third embodiment of the present invention. In FIG. 3, reference numeral 15 is a protrusion provided on the package inner side of the first layer ceramic frame 24, and 19 is a protrusion provided on the package inner side of the second layer ceramic frame 25. Is provided with a metal film.

Reference numeral 24 indicates a protrusion 15 on the inside of the package.
Is a first layer ceramic frame, and 25 is a second layer ceramic frame having protrusions 19 on the inside of the package. The metal film provided on the side surface of each protrusion 15 and 19 is the surface of the ceramic base 1. Is electrically connected to the metal film provided on the cover 4 and the lid 4. In addition, in FIG.
The components having the same reference numerals as those shown in FIG. 1 are the same as those shown in FIG.

Next, the operation of the microwave device package according to the present embodiment will be described. Also in this embodiment, as in the case of the second embodiment, the cutoff frequency of the package is the metal film provided on the side surfaces of the projections 15 and 19 forming the pseudo waveguide that face each other. Since the distance is determined by the distance between the metal films, the distance between the metal films facing each other by the protrusion is further reduced, and the cutoff frequency is further increased. As described above, according to this embodiment, the cutoff frequency of the package can be increased, and the oscillation due to the feedback of the in-band signal inside the package can be prevented.

Fourth Embodiment The configuration of the microwave device package according to the fourth embodiment of the present invention will be described below with reference to FIG. FIG. 4 is an exploded perspective view showing the structure of the microwave device package according to the fourth embodiment of the present invention. In FIG. 4, 16 is a through hole provided in the first layer ceramic frame 26, and 26 is a through hole 1.
A first layer ceramic frame 6 is provided, and a second layer ceramic frame 27 faces the through hole 16.

Further, the through hole 16 is provided in a portion of the first layer ceramic frame 26 facing the second layer ceramic frame 27 and corresponding to the inside of the package component, and the inside of the through hole 16 is filled with metal or A metal film is provided on the side surface. The metal filled in the through hole or the metal film provided on the inner side surface is electrically connected to the metal film on the surface of the ceramic base 1. Note that, in FIG. 4, constituent members having the same reference numerals as those shown in FIG. 1 are the same as those in FIG.

Next, the operation of the microwave device package according to the present embodiment will be described. Also in the present embodiment, as in the case of the second embodiment, the cutoff frequency of the package is set to the slew facing each other provided in the first layer ceramic frame 26 so as to form the pseudo waveguide. The distance between the metal film or the metal film filled in the hole is determined, and the distance between the metal film or the filled metal in the through hole is smaller than the distance between the side surface metal films provided on the outer side surface as in the conventional example. Therefore, the cutoff frequency of the package is increased. As described above, according to this embodiment, the cutoff frequency of the package can be increased, and the oscillation due to the feedback of the in-band signal inside the package can be prevented.

Embodiment 5. The configuration of the microwave device package according to the fifth embodiment of the present invention will be described below with reference to FIG. FIG. 5 is an exploded perspective view showing the structure of the microwave device package according to the fifth embodiment of the present invention. In FIG. 5, 17 is an input matching circuit formed on the first layer ceramic frame 28, 18 is an output matching circuit formed on the first layer ceramic frame 28, and 28 is an input matching circuit 17 and an output matching circuit 18 formed thereon. Is a first layer ceramic frame, and 29 is a second layer ceramic frame covering the lid 4.

The input matching circuit 17 and the first layer ceramic frame 28 formed on the first layer ceramic frame 28.
The output matching circuit 18 configured as above is a distributed constant type circuit element such as an open-ended line, a short-circuited line, a radial stub, a direct current blocking circuit using line-to-line coupling, or a thin-film resistor, which is a microstrip line It includes a microwave circuit element including a lumped constant type circuit element such as a parallel plate type capacitor and a spiral inductor.
Note that, in FIG. 5, constituent members having the same reference numerals as those shown in FIG. 1 are the same as those in FIG.

Next, the operation of the microwave device package according to the present embodiment will be described. In the present embodiment, the input matching circuit 17 and the output matching circuit 18 are integrally formed on the first layer ceramic frame 28, and there is no change in the operation thereof. Therefore, all of the above-described first to fourth embodiments can be applied to the microwave device package according to the present embodiment, and the operation of the microwave device package according to each of the embodiments is the same as that of each of the above-described embodiments. Since it is the same as the form, further detailed description is omitted. As described above, according to this embodiment, cost reduction and size reduction can be achieved by reducing the number of parts.

[0027]

The first aspect of the present invention is configured as described above, and in particular, a metal plate for heat radiation is provided on a ceramic base, and a semiconductor chip is arranged on the metal plate for heat radiation.
A microwave device with good heat dissipation characteristics is provided by providing through holes filled with metal in the ceramic base to diffuse the heat generated from the semiconductor chip over a large area and conduct it to the package housing through the through holes. Even if the height of the semiconductor chip, the input matching circuit board, the output matching circuit board and the first layer ceramic frame is different, the height can be adjusted by the metal plate for heat dissipation.

A second aspect of the present invention is configured as described above, and in particular, by providing a metal film on the side surface of the first layer ceramic frame and the second layer ceramic frame on the package inner side, the inside of the package is improved. The lateral dimension of the formed pseudo waveguide is reduced, the cutoff frequency of the package is increased, and oscillation due to the feedback of the in-band signal inside the microwave device package can be prevented.

A third aspect of the present invention is configured as described above, and in particular, a protrusion is provided on the package inner side of the first layer ceramic frame and the second layer ceramic frame, and a metal film is provided on the side surface of the protrusion. This reduces the lateral dimension of the pseudo-waveguide formed in the package by the metal film on the side surface of the protrusion, increases the cutoff frequency of the package, and prevents oscillation due to feedback of in-band signals inside the package. can do.

A fourth aspect of the present invention is configured as described above, and in particular, the second layer in which the portion of the first layer ceramic frame facing the second layer ceramic frame corresponding to the inside of the package is filled with metal. By providing the through hole, the lateral dimension of the pseudo-waveguide formed in the package is reduced by the through hole, the cutoff frequency of the package is increased, and oscillation due to the feedback of the in-band signal inside the package is performed. Can be prevented.

A fifth aspect of the present invention is configured as described above, and in particular, a microwave circuit element that is formed on the input matching circuit board or the output matching circuit board is formed on the first layer ceramic frame. By doing so, it is possible to achieve cost reduction and size reduction by reducing the number of parts.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a configuration of a microwave device package according to a first embodiment of the present invention.

FIG. 2 is an exploded perspective view showing a configuration of a microwave device package according to a second embodiment of the present invention.

FIG. 3 is an exploded perspective view showing a configuration of a microwave device package according to a third embodiment of the present invention.

FIG. 4 is an exploded perspective view showing a configuration of a microwave device package according to a fourth embodiment of the present invention.

FIG. 5 is an exploded perspective view showing a configuration of a microwave device package according to a fifth embodiment of the present invention.

FIG. 6 is an exploded perspective view showing a basic configuration of a conventional microwave device package.

[Explanation of symbols]

1 Ceramic base, 2, 22, 24, 26, 2
8 First layer ceramic frame, 3, 23, 25, 2
7, 29 Second layer ceramic frame, 4 Lid, 5
Input terminal, 6 output terminal, 7 bias terminal,
8 input matching circuit board, 9 output matching circuit board, 1
0 semiconductor chip, 11 through holes provided in ceramic base, 12 metal plate for heat dissipation, 1
3 Side surface metal film of the first layer ceramic frame, 14
Side metal film of second layer ceramic frame, 15 protrusions, 16 through holes provided in first layer ceramic frame, 17 input matching circuit formed on first layer ceramic frame, 18 output formed on first layer ceramic frame Matching circuit, 19 protrusions, 31 ceramic base.

─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Kazuhisa Yamauchi 2-3-3 Marunouchi, Chiyoda-ku, Tokyo Mitsubishi Electric Corporation (56) Reference JP-A-2-244711 (JP, A) JP-A-4 -117801 (JP, A) JP-A 5-152471 (JP, A) JP-A 6-244298 (JP, A) JP-A 9-134981 (JP, A) JP-A 50-155973 (JP, A) ) JP-A-57-4147 (JP, A) JP-A-60-245259 (JP, A) Jitsukaihei 2-35443 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 23/12 301

Claims (5)

(57) [Claims] 1. A ceramic base, a first-layer ceramic frame stacked on the ceramic base, and a second-layer ceramic frame stacked on the first-layer ceramic frame, In a microwave device package in which a semiconductor chip and an input and output matching circuit board are housed inside the first and second layer ceramic frames on the ceramic base, a metal plate for heat dissipation is provided on the surface of the ceramic base. And mounting the semiconductor chip and the input and output matching circuit board on the heat-dissipating metal plate, and providing a metal film at a predetermined position on the front surface and the back surface of the ceramic base. By filling the base with a metal and providing a through hole in contact with the metal film, A microwave device package, characterized in that the front and back metal films are electrically and thermally conducted. 2. A metal film arranged to electrically connect to a metal film provided on a surface of the ceramic base with respect to side surfaces of the first-layer ceramic frame and the second-layer ceramic frame facing the inside of the package. The microwave device package according to claim 1, further comprising: 3. A protrusion is provided on the inside of the package of the first-layer ceramic frame and the second-layer ceramic frame, and a side surface of the protrusion is electrically connected to a metal film provided on the surface of the ceramic base. The microwave device package according to claim 1, further comprising a metal film arranged as described above. 4. A metal arranged so as to be electrically connected to a metal film provided on a surface of the ceramic base with respect to a portion of the first layer ceramic frame facing the second layer ceramic frame inside the package. The microwave device package according to claim 1, wherein a through hole filled with is provided. 5. A region formed inside the second layer ceramic frame on the first layer ceramic frame,
Distributed constant-type circuit elements such as open-ended lines, short-ended lines, radial stubs, DC blocking circuits using line-to-line coupling, or thin-film resistors, opposed parallel plate capacitors, spiral inductors, etc. 2. The package for a microwave device according to claim 1, wherein an input matching circuit and an output matching circuit each including a microwave circuit element configured by a constant type circuit element are configured.