JP2000100837A - Mounting device for semiconductor element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the processing ability of a mounting device by sequentially and temporarily executing thermo-compression on semiconductor elements to a lead frame in a first mounting mechanism and collectively or individually thermocompressing the semiconductor elements which are temporarily thermocompressed in a second mounting mechanism. SOLUTION: A first mounting mechanism 5 is constituted of a stage 51, where a semiconductor element 4 is loaded and a tool 52. The semiconductor elements 4 are sequentially and temporarily thermocompressed from a mounting position at the head of a lead frame 1 in a heated state on a hygroscopic prevention board 3. The tool 52 is fitted to a bonding head 53, and prescribed temperature is added to the tool 52 and the stage 51. A second mounting mechanism 6 is constituted of a stage 61 and a tool 62, which have sizes for covering all the semiconductor elements 4 that are temporarily thermocompressed to the lead frame 1, and it thermocompresses the lead frame 1 and all the semiconductor elements 4 in batch at once. Thus, mounting time per semiconductor element can be shortened.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an apparatus for mounting a plurality of semiconductor elements on a series of lead frames.

[0002]

2. Description of the Related Art Generally, LOC (Lead On Ch) is used.
When mounting a plurality of semiconductor elements having an ip) structure on a series of lead frames to which an adhesive tape is attached, the lead frames are previously heated in a furnace at a certain temperature for a certain time, and then discharged from the furnace. The semiconductor elements are mounted sequentially from the mounting position at the top of the lead frame.

At this time, a plate to which a certain temperature is applied, that is, a moisture absorption preventing plate, is provided under the lead frame before mounting to prevent moisture absorption of the adhesive tape which loses its adhesive strength when moisture is absorbed.

To mount a semiconductor element, the semiconductor element is mounted on a stage, and the semiconductor element is adhered to the lower surface of the lead frame with an adhesive tape. Then, a rectangular parallelepiped metal piece called a tool is lowered from above, and the lead frame and the semiconductor element are crimped. At this time, the stage and the tool have a structure in which a fixed temperature is applied, and the semiconductor element and the lead frame are thermocompression-bonded at a fixed temperature for a fixed time.

[0005]

However, in the conventional device, since the mounting time per semiconductor element is as long as 1 to 3 seconds, there is a problem that the processing capability is extremely low as compared with the bonding by the paste. Was.

[0006]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, according to the present invention, the semiconductor elements are temporarily thermocompression-bonded to the lead frame one by one in the first mounting mechanism, and are temporarily thermocompression-bonded in the second mounting mechanism. The semiconductor elements are thermocompression-bonded together or one by one.

[0007]

FIG. 1 is a side view showing a first embodiment of the present invention.

The semiconductor device mounting apparatus includes a furnace 2 for heating the lead frame 1, a moisture absorption preventing plate 3 for heating the lead frame 1 discharged from the furnace 2, and a temporary thermocompression bonding of the semiconductor element 4 to the lead frame 1. It comprises a first mounting mechanism 5 and a second mounting mechanism 6 for performing full thermocompression bonding of all the semiconductor elements 4 that have been provisionally thermocompression bonded.

The furnace 2 heats the lead frame 1 at a constant temperature for a certain period of time before mounting, and the moisture absorption prevention plate 3 heats the lead frame 1 to prevent the adhesive tape stretched on the lead frame 1 from absorbing moisture. All are exactly the same as the conventional apparatus.

The first mounting mechanism 5 includes a stage 51 on which the semiconductor element 4 is mounted and a tool 52. One semiconductor element 4 is sequentially mounted from the top mounting position of the lead frame 1 heated on the moisture absorption prevention plate 3. Temporary thermocompression bonding.

The tool 52 is mounted on a bonding head 53, and the tool 52 and the stage 51 have a structure in which a constant temperature is applied as in the conventional case.

The second mounting mechanism 6 comprises a stage 61 and a tool 62 large enough to cover all of the semiconductor elements 4 which are preliminarily thermocompression-bonded to the lead frame 1, and the lead frame 1 and all the semiconductor elements 4 Are thermocompression bonded at once.

The tool 62 is attached to a two-stage bonding head 63, and the tool 62 and the stage 61 have a structure in which a constant temperature is applied.

The shape of the stage 61 and the shape of the tool 62 are each integrated and flat.

FIG. 2 is a diagram for explaining the operation of the first embodiment.

First, before the semiconductor element 4 is mounted, the lead frame 1 is heated in the furnace 2 at a constant temperature for a fixed time.
Thereafter, the lead frame 1 discharged from the furnace 2 is conveyed to the first mounting mechanism 5 while being heated by the moisture absorption preventing plate 3,
The semiconductor elements 4 are temporarily thermocompression-bonded one by one from the top mounting position.

In the temporary thermocompression bonding, the stage 51 on which the semiconductor element 4 is mounted is lifted by a motor or the like (not shown) and is brought into contact with an adhesive tape stretched on the lower surface of the lead frame 1. The heating is performed during a period in which a minimum load is applied by the heated stage 51 and the tool 52 so that the semiconductor element 4 does not shift with respect to the lead frame 1. This time is less than one second.

After the plurality of semiconductor elements 4 are all preliminarily thermocompression-bonded to the lead frame 1, the lead frame 1 is discharged and sent to the second mounting mechanism 6.

In the second mounting mechanism 6, the heated stage 61 is raised by a motor or the like (not shown), and the heated tool 62 is lowered by a motor or the like (not shown) to temporarily attach the lead frame 1 to one lead frame 1. All thermo-compressed semiconductor elements 4
Are thermocompression bonded at once. This thermocompression bonding time is 1 to
3 seconds.

As described above, according to the first embodiment,
A first mounting mechanism 5 for temporarily thermocompression bonding a plurality of semiconductor elements 4 one by one to the lead frame 1 and a second mounting mechanism for fully thermocompression bonding all the semiconductor elements 4 temporarily thermocompressed to the lead frame 1 By providing 6, the mounting time per semiconductor device 4 is remarkably shortened as the number of semiconductor devices 4 increases, and the processing performance as a mounting device is improved.

FIG. 3 is a view showing a main part of a second embodiment of the present invention, and shows an example of a second mounting mechanism.

In the first embodiment, the shape of the stage and the tool is an integrated flat, but in the second embodiment, both the stage 63 and the tool 64 have a plurality of convex portions 65 corresponding to the mounting position of the semiconductor element 4. And a convex shape.

Other configurations, operations, and the like are the same as those of the first embodiment.

As described above, according to the second embodiment,
In addition to the effects of the first embodiment, the stage 63 and the tool 64 in the second mounting mechanism for performing the thermocompression bonding are made convex, so that it is possible to cope with upset and downset lead frames. Since the stress range applied to the semiconductor element 4 and the lead frame 1 at the time of thermocompression bonding is minimized, the deformation of the frame is reduced, and the quality is improved.

FIG. 4 is a view showing a main part of a third embodiment of the present invention, and shows an example of a second mounting mechanism.

The second embodiment is different from the second embodiment in that a plurality of projections 65 provided on a stage 66 and a tool 67 are provided.
Are formed independently, and they are detachably fixed to the stage 66 and the tool 67 by fixing means such as screws.

If the convex portion 65 is screwed, it can be easily mounted and removed, as well as its mounting position can be finely adjusted, and the quality can be stabilized.

FIG. 5 is a side view showing a fourth embodiment of the present invention.

The second embodiment differs from the first embodiment in the second mounting mechanism, and is otherwise the same. The second mounting mechanism 7 is the first mounting mechanism 5
It comprises a stage 71 for thermocompression-bonding the semiconductor elements 4 one by one, and a tool 72 attached to a bonding head 73.

FIG. 6 is a diagram for explaining the operation of the fourth embodiment. In the second mounting mechanism 7, the semiconductor elements 4 temporarily thermocompression-bonded to the lead frame 1 by the first mounting mechanism 5 are thermocompression-bonded one by one sequentially from the top mounting position. The time required for the main thermocompression bonding is 1-2 seconds.

As described above, according to the fourth embodiment,
Since the semiconductor elements 4 are thermocompression-bonded one by one to the lead frame 1 by the second mounting mechanism 7, processing time per semiconductor element is longer than that of the first embodiment. Due to the processing, the processing time is shorter than in the conventional apparatus.

Further, by making the second mounting mechanism 7 equivalent in configuration to the first mounting mechanism 5, the device control becomes easier than in the case of the first embodiment. There is also an advantage that the number of losses is small.

FIG. 7 is a side view showing a fifth embodiment of the present invention.

In this embodiment, a movable re-moisture absorption preventing plate 8 is provided in the first mounting mechanism 5 or the conventional mounting mechanism 50 in the first to fourth embodiments.

The conventional mounting mechanism 50 is the same in construction as the first mounting mechanism 5, but the first mounting mechanism 5 temporarily heat-presses the semiconductor elements 4 to the lead frame 1 one by one. Reference numeral 50 denotes a semiconductor element 4 mounted on the lead frame 1 by completely thermocompression bonding one by one. The point is that only the time for thermocompression bonding is different, so the case of the mounting mechanism 50 will be described below.

The moisture absorption prevention plate 3 heats the lead frame 1 discharged from the furnace 2, but does not cover the portion of the mounting mechanism 50 at the pressure bonding position. To prevent this, a re-absorption plate 8 is provided at the press-fitting position so that it can be moved by a motor or the like (not shown) in a direction perpendicular to the plane of the drawing, that is, in a direction perpendicular to the moving direction of the lead frame 1.

FIG. 8 is a plan view showing a portion of the moisture re-absorption preventing plate 8, showing a state in which one semiconductor element 4 has already been mounted.

When the lead frame 1 is transported and the mounting position of the semiconductor element 4 on the lead frame 1 reaches the above-mentioned crimping position, the re-moisture absorption preventing plate 8 heats the mounting position as shown in FIG. Immediately before thermocompression bonding of the semiconductor element 4, the semiconductor element 4 is moved from its mounting position in the Y direction (in the direction perpendicular to the moving direction of the lead frame 1) as indicated by an arrow.

After the re-absorption plate 8 moves, the second semiconductor element 4 is mounted.

FIG. 9 is an explanatory view of the operation of the fifth embodiment, showing the mounting operation from the state where one semiconductor element 4 has already been mounted, as in FIG.

FIG. 7A shows a standby state for mounting the second semiconductor element 4, in which the re-absorption preventing plate 8 heats the mounting position of the second lead frame 1.

In (b), immediately before mounting the semiconductor element 4, the re-absorption preventing plate 8 moves in the Y direction as shown by the arrow. When the re-moisture absorption preventing plate 8 moves, the semiconductor element 4 can be mounted at the mounting position which has been heated up to now, and the second semiconductor element 4 is mounted as shown in FIG.

In (d), the lead frame 1 is moved in the X direction (right direction), and when the third mounting position of the semiconductor element 4 reaches the pressure bonding position, the re-moisture absorption preventing plate 8 is moved in the Y direction (downward). Then, the lead frame 1 is moved to the lower side to heat the mounting position of the lead frame 1. The same applies to the case where the re-absorption plate 8 is moved first.

In this way, the process returns to the standby state for mounting the semiconductor element 4 as shown in FIG. 5A, and this operation is repeated to mount the semiconductor element 4 at all the mounting positions of one lead frame 1.

FIGS. 10 and 11 are explanatory diagrams of the operation in the case where the lead frame in the fifth embodiment is a multi-frame having three rows.

FIG. 6A shows a mounting standby state in which the semiconductor element 4 has already been mounted at the mounting position on the first row of the multiframe 11 and the portion at the mounting position on the second row has been heated by the re-absorption plate 8. I have.

(B) shows a state in which the moisture reabsorption preventing plate 8 has been moved by one pitch (one mounting position) in the Y direction row immediately before mounting the semiconductor element 4 in the first row. The moisture reabsorption preventing plate 8 is configured to be moved by a pitch in the Y direction (a direction perpendicular to the moving direction of the lead frame) by a motor or the like, that is, to be indexed.

In (c), the semiconductor element 4 is mounted in the first row, in (d) the anti-moisture absorption plate 8 moves as described above, and in (e), the semiconductor element 4 is mounted in the second row. Is done.

In (f), the moisture absorption prevention plate 8 moves from the mounting position in the third row, and in (g), the semiconductor element 4 in the third row.
Is implemented.

In (h), when the multi-frame 11 moves in the X direction (right direction) and the mounting position of the third row reaches the crimping position, the re-moisture absorption preventing plate 8 moves to the lower side of the multi-frame 11, The portion of the implementation device on the third row of the multi-frame 11 is heated, and a mounting standby state as shown in FIG. In addition,
The same is true even if the movement of the moisture re-absorption prevention plate 8 is performed first.

By repeating this, one multi-frame 11
The semiconductor element 4 is mounted in all the mounting positions.

In the fifth embodiment described above, the conventional mounting apparatus has no moisture absorption prevention plate for the adhesive tape below the mounting position of the lead frame sent out for thermocompression bonding. In order to solve the problem that the adhesive tape absorbs moisture when it stops for a certain period of time or longer, the semiconductor element cannot be mounted on the lead frame.

Accordingly, the re-moisture absorption preventing plate 8 is attached to the first mounting mechanism 5.
Is provided, in addition to the effect of shortening the mounting time, and in the case where the re-moisture absorption preventing plate 8 is provided in the conventional mounting mechanism 50, the mounting time is not reduced, but the following effects are obtained. Play.

Since the semiconductor element 4 cannot be mounted on the lead frames 1 and 11, the lead frame without the semiconductor element flows out to the next step. There is no reduction in the operation rate and no hindrance to efficient use of the members.

FIG. 12 is a side view showing a sixth embodiment of the present invention.

The fifth embodiment differs from the fifth embodiment only in that the re-moisture absorption preventing plate 9 can be moved in the same direction as the direction in which the lead frame 1 is moved.

FIG. 13 is a plan view showing a portion of the re-moisture absorption preventing plate 9 and shows that the re-moisture absorbing preventing plate 9 moves in the X direction (the same direction as the moving direction of the lead frame 1).

FIG. 14 is a diagram for explaining the operation of the sixth embodiment.
This shows a mounting operation from a state where one semiconductor element 4 has already been mounted.

FIG. 9A shows a standby state for mounting the second semiconductor element 4, and the re-absorption preventing plate 9 heats the mounting position of the second lead frame 1.

In (b), immediately before mounting the semiconductor element 4, the re-absorption preventing plate 9 moves in the X direction as shown by the arrow, and (c)
Then, the second semiconductor element 4 is mounted.

In (d), the lead frame 1 is moved in the X direction (right direction), and when the third mounting position of the semiconductor element 4 reaches the pressure bonding position, the re-moisture absorption preventing plate 9 is moved in the X direction (left direction). To heat the portion at the third mounting position. The same applies to the case where the movement of the moisture re-absorption preventing plate 9 is performed first.

Next, the process returns to the mounting standby state as shown in FIG. 6A, and this process is repeated to mount the semiconductor elements 4 at all the mounting positions of one lead frame 1.

FIGS. 15 and 16 are explanatory views of the operation in the case where the lead frame in the sixth embodiment is a multi-frame having three rows.

FIG. 7A shows a mounting standby state in which a semiconductor element has already been mounted at the mounting position on the first row of the multi-frame 11 and the portion at the mounting position on the second row has been heated by the re-absorption plate 9. .

In (b), immediately before the semiconductor element 4 is mounted on the first row, the moisture re-absorption preventing plate 9 is moved in the X direction (the same direction as the moving direction of the lead frame 1). Position.

In (c), the semiconductor element 4 is mounted on the first column. In (d), immediately after the semiconductor element 4 is mounted in the first column, the re-absorption preventing plate 9 returns to the mounting position in the same second row as in (a), and the portion is heated to wait for mounting.

In (e), immediately before mounting the semiconductor element 4 in the second row, the moisture reabsorption preventing plate 9 is moved in the X direction, and in (f), the semiconductor element 4 is mounted in the second row.

When the semiconductor element 4 is mounted on the third column in this way, the multi-frame 11 moves in the X direction (right direction) as shown in FIG. , The re-absorption plate 9 moves in the X direction (left direction),
The portion at the mounting position in the third row of the multi-frame 11 is heated, and a mounting standby state as shown in FIG. The same applies to the case where the movement of the moisture re-absorption prevention plate 9 is performed first.

By repeating this, one multi-frame 11
The semiconductor element 4 is mounted in all the mounting positions.

As described above, according to the sixth embodiment, the same effects as those of the fifth embodiment can be obtained.

[0071]

As described above, the present invention provides a first mounting mechanism for temporarily thermocompression-bonding a semiconductor element to a lead frame and a second mounting mechanism for thermocompression-bonding the temporarily thermocompressed semiconductor element. The mounting time per one element can be reduced, and the processing capability as a mounting device can be improved.

[Brief description of the drawings]

FIG. 1 is a side view showing a first embodiment of the present invention.

FIG. 2 is an operation explanatory diagram of the first embodiment.

FIG. 3 is a diagram showing a main part of a second embodiment of the present invention.

FIG. 4 is a diagram showing a main part of a third embodiment of the present invention.

FIG. 5 is a side view showing a fourth embodiment of the present invention.

FIG. 6 is an operation explanatory diagram of the fourth embodiment.

FIG. 7 is a side view showing a fifth embodiment of the present invention.

FIG. 8 is a plan view showing a re-moisture absorption preventing plate portion.

FIG. 9 is an operation explanatory diagram of the fifth embodiment.

FIG. 10 is an explanatory diagram of a multi-frame operation (part 1);

FIG. 11 is an explanatory diagram of a multi-frame operation (part 2).

FIG. 12 is a side view showing a sixth embodiment of the present invention.

FIG. 13 is a plan view showing a re-moisture absorption preventing plate portion.

FIG. 14 is an explanatory diagram of the operation of the sixth embodiment.

FIG. 15 is an explanatory diagram of a multi-frame operation (part 1);

FIG. 16 is an explanatory diagram of an operation of a multi-frame (part 2).

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead frame 11 Multi-frame 3 Moisture absorption prevention board 4 Semiconductor element 5 1st mounting mechanism 50 Mounting mechanism 51 Stage 52 Tool 6, 7 2nd mounting mechanism 61, 63, 66, 71 Stage 62, 64, 67, 72 Tool 65 Convex Part 8, 9 Re-absorption plate

Claims (10)

[Claims] 1. An apparatus for mounting a plurality of semiconductor elements on a series of lead frames using an adhesive tape, wherein: a moisture absorption prevention plate for heating the lead frames; and the semiconductor elements are temporarily and thermocompression-bonded to the lead frames one by one. A semiconductor device mounting apparatus, comprising: a first mounting mechanism; and a second mounting mechanism that performs full thermocompression bonding of all the semiconductor elements temporarily thermocompression-bonded to the lead frame. 2. The semiconductor device mounting apparatus according to claim 1, wherein said second mounting mechanism comprises an integrated flat stage and a tool. 3. The semiconductor device according to claim 1, wherein the second mounting mechanism comprises an integrated convex stage and a tool provided with a plurality of convex portions corresponding to the mounting position of the semiconductor element. Semiconductor device mounting device. 4. The semiconductor device according to claim 1, wherein the second mounting mechanism is formed of a convex stage and a tool in which a plurality of convex portions are independently formed corresponding to the mounting position of the semiconductor element, and these are removably fixed. The semiconductor device mounting apparatus according to claim 1, wherein: 5. An apparatus for mounting a plurality of semiconductor elements on a series of lead frames using an adhesive tape, wherein: a moisture absorption prevention plate for heating the lead frames; and the semiconductor elements are temporarily thermocompression-bonded one by one to the lead frames. A first mounting mechanism; and a second mounting mechanism having a configuration equivalent to that of the first mounting mechanism, the second mounting mechanism being configured to perform full thermocompression bonding of the semiconductor elements temporarily thermocompressed to the lead frame one by one. Semiconductor device mounting apparatus. 6. In the first mounting mechanism, the mounting position of a semiconductor element is changed by moving the lead frame.
When reaching the crimping position of the mounting mechanism, a portion at the mounting position is heated, and a re-moisture absorption prevention plate is provided which moves from the mounting position immediately before preliminarily thermocompression bonding the semiconductor element. A semiconductor device mounting apparatus according to any one of claims 1 to 5. 7. An apparatus for mounting a plurality of semiconductor elements on a series of lead frames using an adhesive tape, wherein: a moisture absorption preventing plate for heating the lead frames; and a mounting step for thermocompression bonding the semiconductor elements to the lead frames one by one. When the mounting position of the semiconductor element reaches the crimping position of the mounting mechanism by moving the lead frame, the portion at the mounting position is heated, and from the mounting position immediately before thermocompression bonding of the semiconductor element. A mounting device for a semiconductor element, comprising: a movable moisture absorption preventing plate; 8. The semiconductor device mounting apparatus according to claim 6, wherein the re-moisture absorption preventing plate is moved in a direction perpendicular to a moving direction of the lead frame. 9. The semiconductor device mounting apparatus according to claim 8, wherein said re-moisture absorption preventing plate is index-moved in a direction perpendicular to a moving direction of said lead frame. 10. The semiconductor device mounting apparatus according to claim 6, wherein the moisture re-absorption preventing plate is moved in a moving direction of the lead frame.