JP2013012539A - Crimp apparatus and crimp method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology which improves the connection reliability of multiple laminated members.SOLUTION: A crimp apparatus 1 clamps a workpiece W including laminated semiconductor chips 3 placed on a wiring board 2 and crimps each member thereto. The crimp apparatus 1 is provided with an upper clamper part 27 and a lower clamper part 28 which face each other and sandwich the workpiece W to clamp the workpiece W. In the upper clamper part 27, a cooling part 32 and a heating part 33 are provided in this order in a direction that moves away from the clamp surface 27a side, and the temperature control is performed by the cooling part 32 and the heating part 33 so as to heat the workpiece W pressed against the clamp surface 27a. Further, the lower clamper part 28 has a support block 36 and multiple support rods 37 standing from the support block 36 and lined up and presses the workpiece W against the clamp surface 27a of the upper clamper part 27 while float-supporting the workpiece W with tips of the multiple support rods 37.

Description

  The present invention relates to a crimping apparatus and a crimping method, and more particularly to a technique effectively applied to a crimping apparatus and a crimping method for clamping a workpiece including a plurality of stacked members and crimping each member.

  In Japanese Patent Laid-Open No. 2000-1000083 (Patent Document 1), in an apparatus for mounting a plurality of semiconductor chips on a series of lead frames, a plurality of semiconductor chips are temporarily thermocompression bonded to the lead frame one by one, and preliminarily thermocompression bonded. A technique is disclosed in which the semiconductor chips are thermally bonded together in a lead frame.

JP 2000-1000083 A

  When an electronic component (for example, a semiconductor chip) is mounted on a substrate (for example, a wiring substrate), the connection terminals (for example, connection bumps) of the electronic component and the connection terminals (for example, connection pads) of the substrate are reliably electrically connected. There is a need. In addition, in order to protect and electrically isolate the connection terminals, an insulating resin (for example, an adhesive layer) may be provided between the electronic component and the substrate to ensure connection reliability. For example, metal bumps such as solder bumps and gold bumps are used as the connection bumps, and metal pads such as copper or an alloy thereof are used as the connection pads. As the adhesive layer, for example, NCF (Non Conductive Film) or NCP (Non Conductive Paste) is used.

  For example, a plurality of semiconductor chips are stacked on a wiring board via an adhesive layer, and the wiring board and the plurality of semiconductor chips are collectively pressure-bonded (finally bonded) to a work that has been temporarily pressure-bonded (temporarily bonded). In this case, it is necessary to heat and pressurize the connection bumps of the semiconductor chip that are electrically connected to the connection pads of the wiring board until they melt.

  However, for example, when the time until the adhesive layer is hardened is shorter than the time until the connection bump melts, the adhesive layer is connected before the connection bump and the connection pad are electrically connected (joined). May harden and cause poor connection (for example, no connection between connection terminals). In addition, when the heating time for the workpiece becomes long, depending on the adhesive layer, fine air mixed in advance may expand or foam due to heating, which may cause connection failure (for example, peeling of the semiconductor chip from the wiring board).

  The objective of this invention is providing the technique which can improve the connection reliability of the laminated | stacked several member. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows. A crimping apparatus according to an embodiment of the present invention is a crimping apparatus that clamps a workpiece including a plurality of stacked members and crimps each member, and includes an upper clamper portion and a lower clamper portion that sandwich and clamp the workpiece Are provided facing each other, the upper clamper section has a cooling section and a heating section, and adjusts the temperature in the cooling section and the heating section so as to heat the workpiece pressed against the clamping surface, The lower clamper portion includes a support block and a plurality of support rods arranged upright from the support block, and the clamp of the upper clamper portion is supported by floating the workpieces at the tips of the support rods. It presses against the surface.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows. According to this embodiment, the connection reliability of a plurality of stacked members can be improved.

It is sectional drawing which shows typically the crimping | compression-bonding apparatus in operation | movement in one Embodiment of this invention. It is sectional drawing which shows typically the crimping | compression-bonding apparatus in operation | movement following FIG. It is sectional drawing which shows typically the crimping | compression-bonding apparatus in operation | movement following FIG. It is a figure for demonstrating the temperature control function of the crimping | compression-bonding apparatus of FIG. It is a top view which shows typically an example of the principal part of the crimping | compression-bonding apparatus of FIG. It is sectional drawing which shows typically the semiconductor device in the manufacturing process in one Embodiment of this invention. FIG. 7 is a cross-sectional view schematically showing the semiconductor device in the manufacturing process following FIG. 6. FIG. 8 is a cross-sectional view schematically showing the semiconductor device in the manufacturing process following FIG. 7.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof may be omitted.

  The crimping apparatus according to this embodiment clamps each member by clamping a workpiece including a plurality of stacked members by sandwiching and clamping the workpiece between an upper clamper portion and a lower clamper portion that are provided to face each other.

  First, the workpiece | work in this embodiment is demonstrated with reference to FIGS. The main part of the workpiece | work W of the state after clamping from before clamping to FIGS. 6-8 is shown.

  The workpiece W is obtained by stacking the semiconductor chip 3 on the wiring board 2 as a plurality of stacked members. A plurality of semiconductor chips 3 are arranged in alignment on the wiring board 2, but in order to clarify the explanation in FIGS. 6 to 8, one semiconductor chip 3 on the wiring board 2 is used as a main part. Show.

  In the work W shown in FIG. 6, a plurality of connection pads 5 (for example, copper pads) exposed from the insulating layer 8 (for example, solder resist) and a plurality of corresponding connection bumps 6 (for example, solder bumps) are aligned. In this state, the semiconductor chip 3 is temporarily pressed (temporarily bonded) onto the substrate 2 via an adhesive layer 4 (for example, NCF or NCP). The workpiece W shown in FIG. 7 is in a state where the corresponding connection pads 5 and the connection bumps 6 are in contact with each other. In the workpiece W shown in FIG. 8, the corresponding connection pads 5 and connection bumps 6 are electrically bonded (flip chip bonding), and the semiconductor chip 3 is pressure-bonded onto the wiring substrate 2 via the adhesive layer 4. It is.

  Next, the crimping apparatus according to the present embodiment will be described with reference to FIGS. 1 to 3 show the crimping apparatus 1 in a series of operating states.

  The crimping device 1 includes an upper die 11 and a lower die 12 that are provided facing each other in the vertical direction (die opening / closing direction) and sandwich the workpiece W therebetween. The upper die 11 is fixedly assembled to the central portion of the movable platen 13, and the lower die 12 is fixedly assembled to the central portion of the fixed platen 14. The movable platen 13 and the fixed platen 14 are connected to each other by a plurality of tie bars 15. For example, if the movable platen 13 and the fixed platen 14 are rectangular plates, they are connected at the four corners. The fixed platen 14 is fixed to the tie bar 15, and the movable platen 13 is configured to slide with the tie bar 15. Further, the movable platen 13 and the fixed platen 14 are configured so that the parallelism of the surfaces facing each other is maintained. Note that the casing portion composed of the movable platen 13, the fixed platen 14, and the tie bar 15 is also called a die set.

  The movable platen 13 can be moved up and down (movable up and down) by a drive unit 19 (for example, a cylinder). As a result, the upper mold 11 can be raised and lowered with respect to the lower mold 12. Due to the vertical positional relationship between the movable platen 13 and the fixed platen 14, the workpiece W is supplied (loaded) between the upper die 11 and the lower die 12 in a state where the upper die 11 and the lower die 12 are separated and opened. (See FIG. 1). Further, when the upper mold 11 and the lower mold 12 are close to each other and are closed, a sealed space 16 (chamber) is formed (see FIGS. 2 and 3). In addition, since the parallelism of the mutually opposing surface of the movable platen 13 and the fixed platen 14 is maintained, the upper mold | type 11 and the lower mold | type 12 are also comprised so that the parallelism of the mutually opposing surface may be maintained.

  In such an upper mold 11, the crimping device 1 includes an upper clamper portion 27 and an upper seal portion 42. In the lower mold 12, the crimping device 1 includes a lower clamper portion 28, a leveling portion 29, a push block 30 (push portion), a guide portion 26, and a lower seal portion 43. Furthermore, the crimping device 1 includes a pressure adjusting unit 47 outside the upper mold 11 and the lower mold 12.

  The upper clamper unit 27 and the lower clamper unit 28 are provided to face each other. In the present embodiment, the lower clamper unit 28 can be moved up and down with respect to the upper clamper unit 27. The work 28 is sandwiched and clamped by the portion 28. The lower clamper unit 28 can be moved up and down by a drive unit (not shown) configured by an air cylinder or the like provided below the push block 30.

  The upper seal portion 42 and the lower seal portion 43 are provided to face each other, and are in contact with each other to form the sealed space 16 (see FIGS. 2 and 3). The upper seal portion 42 and the lower seal portion 43 include the upper clamper portion 27 and the lower clamper portion 28, respectively. The lower seal portion 43 includes the leveling portion 29, the push block 30, and the guide portion 26.

  The push block 30 is pushed up by a drive unit (not shown) when the lower clamper unit 28 is moved up and down (moved up and down) with respect to the upper clamper unit 27. Further, the leveling portion 29 is provided between the lower clamper portion 28 and the pushing block 30, and the clamp surface 28a of the lower clamper portion 28 with respect to the lower surface of the spacer block 22 and the clamp surface 27a of the upper base block 21, which will be described later. Is provided to smoothly ascend and descend while maintaining parallel. Further, the guide portion 26 guides when the lower clamper portion 28 moves up and down. The pressure adjusting unit 47 adjusts the pressure of, for example, compressed air that is filled in the sealed space 16. The mechanism including the push block 30, the leveling portion 29, and the guide portion 26 is also referred to as a parallel lifting mechanism because the lower clamper portion 28 is lifted and lowered in parallel.

  Before describing the details of the upper clamper portion 27, the lower clamper portion 28, the upper seal portion 42, the lower seal portion 43, the leveling portion 29, the push block 30, the guide portion 26, and the pressure adjusting portion 47, first, the upper mold 11 and the components of the lower mold 12 will be outlined.

  The upper mold 11 includes a fixed block 17, a plurality of posts 18 (post-like blocks), an upper base block 21, a spacer block 22, and an upper seal block 23. These blocks are made of alloy tool steel, for example. A fixed block 17 is fixed and assembled under the movable platen 13. A plurality of posts 18 are arranged under the fixed block 17 so as to stand downward and fixedly assembled. The upper base block 21 is fixed and assembled at the front end surfaces of the plurality of posts 18. A cylindrical upper seal block 23 in which a through hole 23a is formed is fixed and assembled to the outer peripheral portion on the lower surface side of the upper base block 21. In addition, a spacer block 22 is fixedly assembled to the lower base portion of the upper base block 21.

  The lower mold 12 has a lower base block 24 and a lower seal block 25. These blocks are made of alloy tool steel, for example. On the fixed platen 14, a cylindrical lower base block 24 having a through hole 24a is fixed and assembled. A cylindrical lower seal block 25 communicating with the through-hole 24a and having a through-hole 25a having a larger inner diameter is fixed and assembled to the outer peripheral portion on the upper surface side of the lower base block 24. A cylindrical guide portion 26 is concentrically fitted into the through hole 25 a of the lower seal block 25 and is fixedly assembled to the inner peripheral side of the upper surface of the lower base block 24.

  The upper clamper 27 and the lower clamper 28 sandwich and clamp (heat and press) the workpiece W. The upper clamper 27 is provided at the center of the upper base block 21. In the upper clamper 27, a plurality of temperature sensors 31, a cooling unit 32, and a heating unit 33 are arranged (built in) in this order in a direction away from the clamp surface 27a side of the upper clamper 27 and clamped. Temperature adjustment is performed on the workpiece W (see FIG. 3). That is, the upper clamper unit 27 is provided with a cooling unit 32 provided on the clamp surface 27a side and a heating unit provided away from the cooling unit 32 from the clamp surface 27a side in order to adjust the temperature of the clamped workpiece W. And a temperature control mechanism having a portion 33. As described above, the upper clamper unit 27 heats and presses the workpiece W.

  In the present embodiment, the spacer block 22 directly clamps the workpiece W. However, a description will be given assuming that the clamp surface 27 a is formed at the center of the upper base block 21. This is because the spacer block 22 is provided by being adjusted according to the thickness of the workpiece W, and may be unnecessary depending on the thickness of the workpiece W.

  The heating unit 33 included in the upper clamper unit 27 includes a plurality of heaters 35 extending (extending) in parallel with the clamp surface 27a of the upper clamper unit 27 in order to improve the heating capability. The heating capacity of the heater 35 is a temperature at which the connection bumps 6 (solder) of the semiconductor chip 3 are melted in consideration of the heat capacity of members such as the upper base block 21 and the adhesive layer 4 (NCF or NCP) is used. It is necessary that the temperature for heat curing be applied to the clamped workpiece W. The melting point of the solder used in this embodiment is, for example, about 250 to 260 ° C. The melting point of NCF or NCP is, for example, about 200 ° C. to 260 ° C., and is cured by heating and pressurizing for a predetermined time.

  The cooling unit 32 included in the upper clamper unit 27 extends (extends) in parallel with the clamp surface 27a of the upper clamper unit 27, and includes a plurality of cooling pipes 34 through which gas or liquid refrigerant circulates. Yes. In the crimping apparatus 1, for example, in a state where the heating unit 33 is turned on with respect to the clamped workpiece W, the cooling unit 32 is repeatedly turned on and off to maintain a predetermined temperature for the workpiece W for a predetermined time. The temperature is adjusted. For this reason, by providing the cooling unit 32 on the clamp surface 27a side closer to the workpiece W than the heating unit 33, the temperature applied to the workpiece W by the on / off operation of the cooling unit 32 can be easily followed.

  Specifically, the cooling unit 32 stops the flow of the refrigerant when the operation is off, and causes the refrigerant to flow when the operation is on. Since the on / off operation of the cooling unit 32 is switching of the refrigerant flow, it can be easily and quickly controlled. Although a Peltier element may be used as the cooling unit 32, the crimping apparatus 1 has a structure in which the workpiece W is heated by the heating unit 33 via the cooling unit 32. Therefore, the cooling pipe 34 for circulating the refrigerant is provided. It is possible to cool and heat more quickly than using it.

  Here, in order to explain the temperature adjustment mechanism of the crimping device 1 for the clamped workpiece W, FIG. 4 shows an example of the elapsed time-work temperature (t-T) characteristic. When the workpiece W placed on the lower clamper portion 28 is clamped by being sandwiched between the upper clamper portion 27 and the lower clamper portion 28 that are preheated by the heating portion 33 (for example, set to 300 ° C.), the workpiece W The temperature rises.

  In the temperature adjustment mechanism, heating is performed so that the temperature of the workpiece W clamped by the cooling unit 32 and the heating unit 33 included in the upper clamper unit 27 is within a range R (for example, ± 5 ° C.) of a predetermined temperature (for example, 260 ° C.). Keep doing. Specifically, while the heating unit 33 is turned on, the cooling unit 32 is repeatedly turned on and off. By providing the cooling unit 32 on the clamp surface 27a side closer to the workpiece W than the heating unit 33, the heating unit 33 side functions to block heat from the heating unit 33, and the clamp surface 27a side cools the workpiece W. The work W can be quickly cooled.

  Thereby, as shown to the continuous line A in FIG. 4, predetermined temperature can be maintained for predetermined time (for example, 30 minutes-60 minutes). Further, the temperature adjustment mechanism can prevent overshoot while quickly raising the heating temperature of the workpiece W. Thus, in the crimping | compression-bonding apparatus 1 provided with the temperature control mechanism, temperature control can be optimally performed with respect to the workpiece | work W in process.

  In addition, since the workpiece W can be rapidly heated and cooled by the upper clamper unit 27 having the cooling unit 32 and the heating unit 33, the pressure bonding apparatus 1 can perform rapid heating before the adhesive layer 4 is cured by heat. The connection bump 6 can be melted in a short time. A predetermined heating temperature can be maintained for a predetermined time, and the connection between the wiring board 2 and the semiconductor chip 3 can be achieved by optimally bonding the connection pads 5 and the connection bumps 6 and curing the adhesive layer 4. Reliability can be improved.

  In addition, the broken line B in FIG. 4 is a graph when the cooling unit 32 is continuously turned off while the heating unit 33 is turned on, and the broken line C is a state where the heating unit 33 is turned on. The graph figure at the time of continuing making the cooling part 32 operate | move on is shown. From this, it can be seen that the repetition of the on / off operation of the cooling section 32 is effective for temperature adjustment.

  The lower clamper unit 28 clamps the workpiece W together with the upper clamper unit 27. The lower clamper portion 28 is inserted into a sliding hole 26 a formed in the guide portion 26. The lower clamper section 28 has a support block 36 and a plurality of support rods 37 arranged upright from the support block 36, and supports the workpiece W in a floating manner at the tips of the plurality of support rods 37. In addition, floating support here means supporting in the state (state which floated) separated from the block-shaped member with a large heat capacity. A fixed block 38 is fixedly assembled on the support block 36. The fixing block 38 is to prevent (fix) the retaining block 38 with a rod head on one end side of the support rod 37. The workpiece W is supported (placed) on the other end side of the plurality of support rods 37 thus provided. That is, the clamp surface 28a of the lower clamper portion 28 is formed by the tip surfaces of the plurality of support rods 37 on the same horizontal plane.

  The plurality of support rods 37 are arranged in a matrix, for example, and support the workpiece W via the support plate 41. The support rods 37 are arranged at equal intervals so that the support plate 41 does not bend due to its own weight and the height is not uniform. By supporting the workpiece W using the support plate 41, the workpiece W can be arranged in parallel with the clamp surface 27 a of the upper clamp portion 27.

  In this embodiment, although the workpiece | work W is clamped via the support plate 41, it demonstrates as what the clamp surface 28a is formed in the front end surface of each support rod 37 on the same horizontal surface. This is because the support plate 41 can be omitted when a substrate (for example, a ceramic substrate) having high rigidity and little bending is used as the wiring substrate 2.

  By floatingly supporting the workpiece W with the plurality of support rods 37, the heat capacity of the lower clamper portion 28 is reduced and the lower portion (for example, the support block 36) of the clamp surface 28a is thermally separated. . For this reason, the lower clamper portion 28 can maintain a low temperature (for example, 50 ° C. or less) when the workpiece W is placed (supported), and the high temperature when the workpiece W is clamped together with the upper clamper portion 27. (For example, 260 ° C.) can be maintained.

  The guide part 26 guides when the lower clamper part 28 moves up and down. The guide portion 26 is a cylindrical block in which a sliding hole 26a is formed, and is made of, for example, alloy tool steel. The guide part 26 is supported by the center part on the inner peripheral side of the upper surface of the base block 24 so that the through hole 24a of the base block 24 and the sliding hole 26a communicate with each other. The guide portion 26 is concentrically fitted into the through hole 25a of the lower seal block 25 and fixed and assembled. The lower clamper portion 28, the leveling portion 29, and the push block 30 are inserted into the sliding hole 26a. In order to raise and lower the lower clamper part 28, the leveling part 29 and the push block 30, a drive part for raising and lowering the push block 30 is arranged as a drive source different from the drive part 19 above and below the sliding hole 26a. ing.

  In addition, when the drive part 19 of the movable platen 13 applies pressure to the sealed space 16, a clamping force necessary to prevent gas from leaking is generated, whereas the push block 30 is connected to the corresponding connection pad 5 of the workpiece W. It is necessary to generate a clamping force capable of joining the connection bump 6. In this case, the clamping force of the push block 30 is appropriately set based on the size of the workpiece, the number of bumps, or the type of bump. For example, when the workpiece size is large and the number of bumps is large, or in the case of a bump that requires a high clamping force for bonding (for example, a copper bump), it is necessary to use a drive unit that generates a high clamping force. The push block 30 is preferably one that can be finely adjusted, for example, every 1 kg in order to join the fine connection pads 5 and the connection bumps 6.

  The leveling portion 29 is provided for smoothly raising and lowering the lower clamper portion 28 while maintaining the upper and lower clamp surfaces 27a and 28a in parallel. As shown in FIG. 5, the leveling portion 29 includes a mounting block 52 inserted into the sliding hole 26 a of the guide portion 26 and two spring portions 51. Although FIG. 5 is a plan view, hatching is added for clarity of explanation.

  The spring portion 51 is provided between the side surface of the mounting block 52 and the inner wall surface of the sliding hole 26 a facing the mounting block 52. The spring portion 51 includes a spring 55 and a sliding plate 54 that is urged by the spring 55 and slides while being pressed against the inner wall surface of the sliding hole 26a. The spring 55 is assembled by being compressed by a natural length between a groove 52 a formed on the side surface of the mounting block 52 and the sliding plate 54. The sliding plate 54 is guided by a frame-like protrusion 53 (that is, a frame portion) protruding from the side surface of the mounting block 52 and pressed against the inner wall surface of the sliding hole 26a. The protruding portion 53 has a sliding plate 54 disposed inside the frame, and does not contact the inner wall surface of the sliding hole 26a.

  The mounting block 52 shown in FIG. 5 has a rectangular shape in plan view, and the sliding hole 26a into which the mounting block 52 is inserted has a rectangular shape in plan view (the opening is rectangular). A support block 36 of the lower clamper portion 28 is provided on the mounting block 52 (see FIG. 1). Of the four side surfaces of the mounting block 52, two adjacent side surfaces are in contact with the inner wall surfaces of the opposing sliding holes 26a, and spring portions 51 are provided on the remaining two adjacent side surfaces. That is, the two adjacent side surfaces are configured to press the sliding plates 54 against the inner wall surfaces of the sliding holes 26a via the springs 55, respectively.

  In the leveling portion 29 shown in FIG. 5, the two adjacent side surfaces of the mounting block 52 are always pressed against the two inner wall surfaces (which become corner portions) of the sliding holes 26 a facing each other. Further, in the leveling portion 29, the two adjacent adjacent side surfaces of the mounting block 52 are pressed against the two inner wall surfaces of the sliding holes 26a facing each other via the spring portions 51, respectively. . For this reason, when the lower clamper portion 28 is moved up and down by the push block 30, the mounting block 52 slides while being positioned in the slide hole 26 a, so that the clamp surface 28 a of the lower clamper portion 28 is moved to the upper clamper portion 27. A high degree of parallelism can be maintained with respect to the clamp surface 27a. Thus, the leveling portion 29 is slid in the sliding hole 26 a while being positioned by pressing the mounting block 52 against the inner wall surface of the sliding hole 26 a by the spring portion 51. The lower clamper portion 28 provided in the upper and lower guides up and down.

  It is also conceivable that the lower clamper portion 28 is directly moved up and down by the push block 30 without (not provided) the leveling portion 29. However, in such a configuration, the clamp surface 28a may incline during ascent / descent due to the clearance between the lower clamper portion 28 inserted into the slide hole 26a and the inner wall surface of the slide hole 26a. If the center of the connection pad 5 and the connection bump 6 is deviated by, for example, several μm due to the inclination of the clamp surface 28a, a problem may occur in the connection between the connection pad 5 and the connection bump 6. On the other hand, it is conceivable to suppress the inclination by making the clearance as small as possible. In this case, however, the lower mold 12 (particularly, the guide portion 26 or the Since the upper die 11 side of the support block 36 and the like that slides expands, the clearance becomes smaller on the upper die 11 side, and there is a possibility that it is difficult to move up and down.

  However, by using the leveling portion 29, even if the clearance with respect to the sliding hole 26a is sufficiently large, the support block 37 that supports the support rod 37 is guided without being inclined with respect to the clamp surface 27a on the upper mold 11 side. It is possible. Accordingly, since the clamping force can be made uniform over the entire surface of the workpiece W, each bump 6 can be uniformly heated and pressurized, and the connection reliability of the laminated wiring board 2 and semiconductor chip 3 is further improved. can do.

  The upper seal portion 42 and the lower seal portion 43 (portions surrounded by broken lines in FIG. 1) are provided to face each other and form a sealed space 16 (see FIG. 2 and FIG. 3) in contact with each other. is there. The lower seal portion 43 has a through hole that communicates with the lower base block 24 having the through hole 24a and the through hole 24a on the central portion of the fixed platen 14 so as to be a concave box portion that opens to the upper seal portion 42 side. A lower seal block 25 having a hole 25a is formed so as to overlap. At the boundary portion between the surfaces where the lower base block 24 and the lower seal block 25 are in contact with each other, the respective members are fixed and assembled with, for example, bolts, and thus are sealed. The lower clamper portion 28 is accommodated in such a lower seal portion 43. A seal member 44 (for example, an O-ring) is provided at the edge of the lower seal portion 43.

  Further, the upper seal portion 42 is formed by providing an upper seal block 23 having a through hole 23a below the outer peripheral portion of the upper base block 21 so as to be a concave box portion that opens to the lower seal portion 43 side. Yes. At the boundary portion of the surface where the upper base block 21 and the upper seal block 23 are in contact with each other, the respective members are fixed and assembled with, for example, bolts, and thus are sealed. The upper clamper portion 27 is accommodated in such an upper seal portion 42. Further, the edge of the lower seal 43 is brought into contact with the edge of the upper seal 42 via the seal member 44.

  When the upper seal portion 42 and the lower seal portion 43 are close to each other, the edge portion of the upper clamper portion 42 and the edge portion of the lower clamper portion 43 are in contact with each other to form a sealed space 16 (see FIG. 2). In other words, when the upper mold 11 and the lower mold 12 are close to each other, the mold is closed and the sealed space 16 is formed inside. In such a sealed space 16, since the workpiece W before and after the clamping is included, the workpiece W can be heated more rapidly by the upper clamper portion 42. The upper seal portion 42 and the lower seal portion 43 are close to form the sealed space 16 and do not clamp the workpiece W. The upper clamper 27 and the lower clamper 28 clamp the workpiece W.

  Further, a heater 45 extending in the depth direction is provided on the seal surface side of the lower seal block 25 constituting the lower seal portion 43, and a cooling pipe 46 (the refrigerant circulates inside the lower base block 24 side). Is provided).

  By providing the heater 45 on the seal member 44 side, that is, in the vicinity of the lower clamper portion 28, the heater can be heated from the lower clamper portion 28 side together with the upper clamp portion 27. Further, by providing the heater 45 in the vicinity of the lower clamper portion 28, the guide portion 26 assembled to the lower seal block 25 is thermally expanded in accordance with the heated lower clamper portion 28 by clamping the workpiece W. The lower clamper portion 28 can be smoothly raised and lowered within the sliding hole 26a. In addition, by providing the cooling pipe 46 near the lower base block 24 side, that is, in the vicinity of the drive unit that moves up and down the lower clamper unit 28, it is possible to cool the periphery of the drive unit and prevent the drive unit from malfunctioning. it can.

  The pressure adjusting unit 47 adjusts the pressure in the sealed space 16. In the present embodiment, the pressure adjusting unit 47 performs, for example, a compression process on the sealed space 16 through the air passage 48 formed in the upper seal block 23. For this reason, the pressure adjusting unit 47 has a compressor (for example, a compressor) connected to the sealed space 16.

  In the sealed space 16, when the adhesive layer 4 is heated by the upper clamp portion 27, a void is generated in the adhesive layer 4 and the adhesive layer 4 expands, and the semiconductor chip 3 may be separated from the wiring board 2. Therefore, the generation of voids can be suppressed by using the sealed space 16 as a compression space. Moreover, since the crimping | compression-bonding apparatus 1 is the structure which joins the several semiconductor chip 3 to the wiring board 2 collectively in a compression space, it can heat while suppressing generation | occurrence | production of a void and applying a uniform pressure. . Therefore, the connection reliability of the plurality of semiconductor chips 3 through the adhesive layer 4 on the wiring board 2 can be improved.

  Next, a method for manufacturing a semiconductor device 7 manufactured by using the pressure bonding apparatus 1 according to the present embodiment, together with a pressure bonding method (bonding method) for bonding a plurality of semiconductor chips 3 onto the wiring substrate 2 at once is shown. 1 to 3 and FIGS. 6 to 8 will be described. FIG. 1 and the like are cross-sectional views schematically showing the crimping device 1 in operation, and FIG. 6 and the like are drawings of the workpiece W shown in FIG. 1 and the like in order to clarify the workpiece W in the crimping device 1 in operation. The main part is shown enlarged.

  The crimping method according to the present embodiment can be summarized as follows. The workpiece W including the wiring substrate 2 and the semiconductor chip 3 stacked via the adhesive layer 4 is sandwiched between the upper clamper portion 27 and the lower clamper portion 28 provided to face each other. And clamping the wiring board 2 and the semiconductor chip.

  First, a plurality of connection pads 5 of the wiring substrate 2 and a plurality of connection bumps 6 of each semiconductor chip 3 corresponding to each other are aligned to face each other, and a plurality of layers stacked on the wiring substrate 2 with an adhesive layer 4 interposed therebetween. A workpiece W including the semiconductor chip 3 is prepared (see FIG. 6).

  The workpiece W is temporarily bonded to the wiring substrate 2 to which the adhesive layer 4 is bonded by aligning a plurality of semiconductor chips 3 in a matrix form from the adhesive layer 4 side using a known flip chip bonder. Temporary joining). The wiring board 2 is, for example, a glass epoxy board, in which a wiring pattern is formed, and connection pads 5 exposed from the insulating layer 8 are formed. Further, the semiconductor chip 3 is, for example, a MIS (Metal Insulator Semiconductor) transistor formed on a silicon substrate, and solder bumps are used as the connection bumps 6.

  Subsequently, as shown in FIG. 1, the workpiece W is placed on the lower mold 12 by a transfer device (not shown) in a state where the upper mold 11 and the lower mold 12 are separated from each other. Specifically, the workpiece W is transported between the upper clamp portion 27 and the lower clamper portion 28, and the workpiece W is supported in a floating manner by the clamp surfaces 28a formed by the tip surfaces of the plurality of support rods 37 of the lower clamper portion 28. To do. In this embodiment, in order to prevent deterioration of the adhesive layer 4, the workpiece W is supported in a floating manner so as to be supported at a low temperature (50 ° C. or less).

  Subsequently, as shown in FIG. 2, the upper mold part 11 and the lower mold 12 are brought close to each other so as to be opposed to each other, and the upper seal part 42 and the lower clamper part 28 each including the upper clamper part 27 and the lower clamper part 28 The sealed space 16 is formed by bringing the seal portion 43 into contact therewith. Next, a compression process for introducing compressed air is performed on the sealed space 16 sealed by the pressure adjusting unit 47 to form a compressed space. For example, this compression space is formed until the seal of the sealed space 16 is released. The sealed space 16 is preferably formed until at least the adhesive layer 4 is cured in order to prevent air from foaming.

  Subsequently, as shown in FIG. 3, the lower clamper portion 28 that can be moved up and down in the sliding hole 26a of the guide portion 26 from the state shown in FIG. The work W is sandwiched and clamped by the lower clamper unit 28. Thus, the workpiece W sandwiched from both sides by the upper clamper portion 27 and the lower clamper portion 28 and directly heated starts to be heated rapidly. Since the temperature in the sealed space 16 is increased by the radiant heat from the heater 35 of the heating unit 33 and the heater 45 of the lower seal block 25, the workpiece W is indirectly heated.

  When the temperature of the workpiece W rises rapidly, the connection bumps 6 and the adhesive layer 4 are in a molten state. For this reason, in the clamped work W, the melted adhesive layer 4 is pushed away so that the connection bump 6 comes into contact with the connection pad 5 (see FIG. 7), and the melted connection bump 6 and the connection pad 5 are joined (FIG. 8). reference).

  In the present embodiment, as described with reference to FIG. 5, the mounting block that slides in contact with the other side by the spring portion 51 that slides in contact with one side of the opposing inner wall surface of the sliding hole 26 a. While pressing 52, the lower clamper portion 28 provided on the mounting block 52 is raised. For this reason, when the lower clamper portion 28 is moved up and down by the push block 30, the mounting block 52 slides while being positioned in the slide hole 26 a, so that the clamp surface 28 a of the lower clamper portion 28 is moved to the upper clamper portion 27. A high degree of parallelism can be maintained with respect to the clamp surface 27a. Therefore, the displacement of the connection pad 5 and the connection bump 6 can be suppressed, and the connection reliability between the wiring board 2 and the semiconductor chip 3 can be further improved.

  Next, the workpiece W is heated and pressurized while being clamped by the upper clamper portion 27 and the lower clamper portion 28. Here, using the cooling unit 32 and the heating unit 33 included in the upper clamp unit 27, the workpiece W is continuously heated while being clamped while being clamped. Specifically, the ON operation and the OFF operation of the cooling unit 32 provided near the heating unit 33 on the clamp surface 27a side of the upper clamper unit 27 are repeated while the heating unit 33 is turned on.

  Thereby, the temperature and time which the contact bonding layer 4 hardens | cures can be maintained, maintaining the temperature which the connection bump 6 fuse | melts. For example, as described with reference to FIG. 4, a predetermined temperature (for example, 260 ° C.) can be maintained for a predetermined time (for example, 30 to 60 minutes). Thereby, the connection reliability of the wiring substrate 2 and the semiconductor chip 3 laminated via the adhesive layer 4 can be improved. In addition, unlike the configuration in which the temperature does not increase naturally by stopping heating by the heating unit 33, for example, the temperature can be forcibly stopped while the temperature is quickly increased to a predetermined temperature, so that the temperature is quickly increased. However, there is no overshoot. Thereby, the problem that the semiconductor chip 3 is damaged due to the temperature of the workpiece W becoming too high can be efficiently avoided.

  In the present embodiment, the cooling part 32 extends (extends) in parallel with the clamp surface 27a of the upper clamper part 27, and has a cooling conduit 34 through which the refrigerant circulates, and the cooling part 32 is turned off. At this time, the flow of the refrigerant is stopped, and the workpiece W clamped via the cooling pipe 34 is heated by the heating unit 33. Since the on / off operation of the cooling unit 32 is switching of the refrigerant flow, it can be easily and quickly controlled. Thus, the predetermined temperature can be maintained for a predetermined time by quickly controlling the cooling unit 32.

  Next, after the joining of the workpieces W is completed (see FIG. 3), the pressurization to the sealed space 16 by the pressure adjusting unit 47 is stopped, the lower clamper unit 28 is lowered, and the workpiece W placed thereon is moved. Separated from the clamp surface 27a of the upper clamper 27 (see FIG. 2). Next, the upper mold 11 and the lower mold 12 are separated from each other to open the sealed space 16 constituted by the upper seal portion 42 and the lower seal portion 43, and the work W is carried out from the lower mold 12 by a transfer device (not shown). Thus, the operation for joining one workpiece W is completed. That is, the semiconductor device 7 in which the semiconductor chip 3 is mounted on the wiring board 2 is manufactured (see FIG. 8). In addition, after supporting the workpiece | work W with the support rod 37, the temperature of the connection bump 6 may be lowered | hung by maintaining for a predetermined time, and you may carry out.

  As in the present embodiment, the connection pads 5 and the connection bumps 6 can be easily crimped (joined) by applying pressure simultaneously with heating by the upper clamper portion 27 and the lower clamper portion 28. Further, by maintaining the compressed space until the semiconductor chip 3 is mounted on the wiring board 2, even if fine air is contained in the adhesive layer 4, the fine air is compressed and miniaturized. In addition, it is possible to underfill the wiring substrate 2 and the semiconductor chip 3 with the adhesive layer 4 with high quality. Thereby, it is possible to effectively prevent the occurrence of connection failure between the connection pads 5 and the connection bumps 6 provided on the workpiece W, and to improve the connection reliability between the wiring substrate 2 and the semiconductor chip 3.

  Although the present invention has been specifically described above based on the embodiments, it is needless to say that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

  For example, in the embodiment, the case where the workpiece W including the wiring substrate 2 and the semiconductor chip 3 is used as the first and second members stacked via the adhesive layer has been described. It is applicable also to the workpiece | work with which the member of ... was laminated | stacked. For example, the present invention can also be applied to a work in which a wiring substrate is used as the first member, and semiconductor chips are used as the second and third members, respectively, with an adhesive layer interposed therebetween. Further, for example, a lead frame or a wafer other than the wiring substrate 2 may be used as the substrate. Further, for example, a chip component such as a capacitor chip in addition to the semiconductor chip 3 may be used as the electronic component.

  Moreover, although the said embodiment demonstrated the case where a compressor was used for the pressure adjustment part 47, the decompressor (for example, vacuum pump) which decompresses the sealed space 16 may be connected instead of a compressor. This is because by reducing the pressure, fine air in the adhesive layer 4 and foreign matters (floating matter) in the sealed space 16 can be removed. Further, the pressure adjusting unit 47 can perform processing using both a decompressor and a compressor. For example, heating is started after positive air is positively removed from the adhesive layer 4 or the foreign matter in the space is removed by setting the inside of the sealed space 16 in a reduced pressure atmosphere, and generation of voids is suppressed as a compressed space. Thus, a synergistic effect can be obtained, and the connection reliability of the plurality of semiconductor chips 3 via the adhesive layer 4 on the wiring substrate 2 can be further improved. As described above, the pressure adjusting unit 47 may include at least one of a compressor and a decompressor connected to the sealed space 16.

  Further, for example, in the embodiment, a work W (see FIG. 6) in a state where the connection pads 5 of the wiring board 2 and the connection bumps 6 of the semiconductor chip 3 are not in contact is prepared, and the work W is clamped and wired. The case where the semiconductor device 7 (see FIG. 8) is manufactured by collectively bonding the plurality of electronic components 3 to the substrate 2 has been described. Not limited to this, a work W (see FIG. 7) in a state where the connection pads 5 of the wiring board 2 and the connection bumps 6 of the semiconductor chip 3 are in contact with each other is prepared. The semiconductor device 7 may be manufactured by bonding the semiconductor chips 3 together. This is because, when the work W in which the connection bump 6 is melted is heated and pressed, the displacement between the connection pad 5 and the connection bump 6 can be suppressed.

  For example, in the above embodiment, the case where the connection bumps 6 of the semiconductor chip 3 are melted by heating has been described. Not limited to this, even if the connection pads 5 of the wiring board 2 are melted or the connection pads 5 of the wiring board 2 and the connection bumps 6 of the semiconductor chip 3 are also melted, the wiring board 2 and the semiconductor chip 3 are bonded together. Can be joined.

  For example, in the embodiment, the case where the workpiece W is placed on the lower mold 12 has been described. Not only this but the structure which supports the workpiece | work W in the upper mold | type 11 by adsorption | suction or holding | grip with a nail | claw may be sufficient. In this case, a temperature adjusting mechanism can be provided in the lower clamper portion.

  Further, for example, in the embodiment, the case where the cooling pipe 34 in which the refrigerant circulates is used as the cooling unit 32, but the cooling pipe 34 through which both air and water pass is used. Also good. Alternatively, a part of the cooling unit 32 may be used for air cooling and the other part may be used for water cooling. In this case, air cooling can be used to stabilize the temperature during crimping (clamping), and water cooling can be performed when initial heating is stopped or when cooling is completed (when not clamping). Productivity can be improved when pressure bonding is repeatedly performed on W.

  For example, in the above-described embodiment, the case where the upper mold 11 is fixed and assembled to the movable platen 13 and the lower mold 12 is fixed and assembled to the fixed platen 14 has been described. However, the present invention is not limited to this, and the upper mold 11 may be fixed to the fixed platen and the lower mold 12 may be fixed and assembled to the movable platen, and the lower mold 12 may be raised and lowered with respect to the upper mold 11.

DESCRIPTION OF SYMBOLS 1 Crimping device 27 Upper clamper part 28 Lower clamper part 32 Cooling part 33 Heating part 36 Support block 37 Support rod W Workpiece

Claims (8)

A crimping device for clamping a workpiece including a plurality of laminated members and crimping each member,
An upper clamper portion and a lower clamper portion that sandwich and clamp the workpiece are provided facing each other,
The upper clamper unit has a cooling unit and a heating unit, and performs temperature adjustment in the cooling unit and the heating unit so as to heat the workpiece pressed against the clamp surface,
The lower clamper portion includes a support block and a plurality of support rods arranged upright from the support block, and the clamp of the upper clamper portion is supported by floating the workpieces at the tips of the support rods. A crimping device that is pressed against a surface. The crimping apparatus according to claim 1,
The pressure-bonding device, wherein the cooling section includes a cooling pipe that extends in parallel with the clamp surface of the upper clamper section and in which a coolant circulates. The crimping apparatus according to claim 1 or 2,
A pusher for raising and lowering the lower clamper with respect to the upper clamper;
A leveling part that is provided between the lower clamper part and the pushing part, and adjusts the flatness of the clamp surface of the lower clamper part;
A guide part having a sliding hole into which the lower clamper part and the leveling part are inserted;
The leveling portion is inserted between an inner wall surface of the sliding hole and provided between a mounting block on which the support block is mounted and an inner wall surface of the sliding hole facing the mounting block. And a spring part,
The lower clamper portion in which the support block is provided on the mounting block while the leveling portion is positioned by pressing the mounting block against the inner wall surface of the sliding hole by the spring portion. A crimping device characterized by guiding the raising and lowering of the wire. In the crimping | compression-bonding apparatus as described in any one of Claims 1-3,
An upper seal portion and a lower seal portion that are provided opposite to each other and enclose each of the upper clamper portion and the lower clamper portion;
A pressure adjusting part that adjusts the pressure in the sealed space formed by contacting the upper seal part and the lower seal part,
The pressure adjusting device, wherein the pressure adjusting unit includes at least one of a compressor and a decompressor connected to the sealed space. It is a crimping method in which a workpiece including a plurality of laminated members is sandwiched and clamped between an upper clamper portion and a lower clamper portion provided to face each other, and each member is crimped.
(A) transporting the workpiece between the upper clamp portion and the lower clamper portion and floatingly supporting the workpiece at the tips of a plurality of support rods of the lower clamper portion;
(B) using the cooling part and the heating part of the upper clamp part, and continuing the heating within a predetermined temperature range while clamping the workpiece,
In the step (b), while the heating unit is turned on, the cooling unit provided on the clamping surface side of the upper clamper unit near the heating unit is repeatedly turned on and off. Crimping method. The crimping method according to claim 5,
In the step (b), the coolant flow is stopped when the cooling portion extending in parallel with the clamp surface of the upper clamper portion and having a cooling pipe line through which the coolant circulates is turned off, A crimping method, wherein the workpiece clamped via a cooling pipe is heated by the heating unit. The crimping method according to claim 5 or 6,
The step (b) includes a step of raising the lower clamper portion that can be moved up and down in the sliding hole to the upper clamper portion side, and clamping the work by sandwiching the workpiece between the upper clamper portion and the lower clamper portion. ,
The lower clamper portion provided on the mounting block as described above while pressing the mounting block that slides in contact with the other side by the spring portion that contacts and slides on one side of the inner wall surface facing the sliding hole A method of pressure bonding characterized by raising the pressure. The crimping method according to claim 5, 6 or 7,
After the step (a) and before the step (b), a sealed space is formed by contacting an upper seal portion and a lower seal portion that are provided facing each other and enclose the upper clamper portion and the lower clamper portion, respectively. A crimping method comprising a step of performing at least one of compression and decompression on the sealed space.

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