JP2000091328A5 - - Google Patents

Download PDF

Info

Publication number
JP2000091328A5
JP2000091328A5 JP1999238526A JP23852699A JP2000091328A5 JP 2000091328 A5 JP2000091328 A5 JP 2000091328A5 JP 1999238526 A JP1999238526 A JP 1999238526A JP 23852699 A JP23852699 A JP 23852699A JP 2000091328 A5 JP2000091328 A5 JP 2000091328A5
Authority
JP
Japan
Prior art keywords
substrate
cathode electrode
plasma etching
etching apparatus
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999238526A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000091328A (ja
JP4487026B2 (ja
Filing date
Publication date
Priority claimed from KR1019980034587A external-priority patent/KR100275671B1/ko
Application filed filed Critical
Publication of JP2000091328A publication Critical patent/JP2000091328A/ja
Publication of JP2000091328A5 publication Critical patent/JP2000091328A5/ja
Application granted granted Critical
Publication of JP4487026B2 publication Critical patent/JP4487026B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP23852699A 1998-08-26 1999-08-25 プラズマエッチング装置 Expired - Fee Related JP4487026B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019980034587A KR100275671B1 (ko) 1998-08-26 1998-08-26 플라즈마 식각 설비
KR1998P34587 1998-08-26

Publications (3)

Publication Number Publication Date
JP2000091328A JP2000091328A (ja) 2000-03-31
JP2000091328A5 true JP2000091328A5 (https=) 2006-10-05
JP4487026B2 JP4487026B2 (ja) 2010-06-23

Family

ID=19548300

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23852699A Expired - Fee Related JP4487026B2 (ja) 1998-08-26 1999-08-25 プラズマエッチング装置

Country Status (4)

Country Link
JP (1) JP4487026B2 (https=)
KR (1) KR100275671B1 (https=)
CN (1) CN1157758C (https=)
TW (1) TW472320B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001127041A (ja) * 1999-10-26 2001-05-11 Matsushita Electric Ind Co Ltd 基板のプラズマ処理装置およびプラズマ処理方法
EP1352415A2 (en) * 2000-10-23 2003-10-15 Applied Materials, Inc. Monitoring substrate processing using reflected radiation
CN102969361B (zh) * 2011-09-01 2015-09-23 中国科学院微电子研究所 光照稳定性非晶态金属氧化物tft器件以及显示器件
KR101384980B1 (ko) * 2012-06-25 2014-04-14 주식회사 테스 플라즈마 발생장치 및 이를 포함하는 박막증착장치
CN105225989B (zh) * 2015-10-13 2018-12-28 京东方科技集团股份有限公司 等离子刻蚀机
CN108711546B (zh) * 2018-04-28 2019-07-23 武汉华星光电技术有限公司 下电极及干蚀刻机
CN111970838B (zh) * 2020-08-24 2021-09-21 泉州市创智工业设计服务有限公司 一种用于生产电路板的蚀刻机

Similar Documents

Publication Publication Date Title
KR970077338A (ko) 멀티챔버 스퍼터링 장치
EP1286382A3 (en) Atmospheric pressure plasma treatment apparatus and method
KR940011662A (ko) 이방성 에칭방법 및 장치
EP0996141A3 (en) Image display apparatus and method for producing the same
WO2004051702A3 (en) Apparatus for treating surfaces of a substrate with atmospheric pressure plasma
JP2000091328A5 (https=)
US20020170498A1 (en) Chemical vapor deposition apparatus
JP2000200698A5 (https=)
CN119593067B (zh) 一种籽晶粘接装置及方法
JPH11204297A5 (https=)
JP4487026B2 (ja) プラズマエッチング装置
JP4268433B2 (ja) プラズマ処理装置
JPH0467776B2 (https=)
JP3590433B2 (ja) 液晶パネルの製造方法
JP2646261B2 (ja) プラズマ処理装置
JP4604591B2 (ja) プラズマ処理方法
JP3716854B2 (ja) 液晶パネルの製造方法
JP4064540B2 (ja) プラズマcvd処理装置
JP2926711B2 (ja) ドライエッチング装置
JP3610971B2 (ja) 液晶パネルの製造装置および液晶パネルの製造方法
JP2506389B2 (ja) マスク基板のドライエッチング方法
JP2000315861A (ja) 基板のスミア除去装置およびスミア除去方法
KR101250237B1 (ko) 서셉터 및 이를 적용한 스퍼터링 장치
KR101063197B1 (ko) 액정표시장치 제조용 플라즈마 화학기상증착장치
JPS6333962Y2 (https=)