JP2000058508A5 - - Google Patents

Download PDF

Info

Publication number
JP2000058508A5
JP2000058508A5 JP1998239441A JP23944198A JP2000058508A5 JP 2000058508 A5 JP2000058508 A5 JP 2000058508A5 JP 1998239441 A JP1998239441 A JP 1998239441A JP 23944198 A JP23944198 A JP 23944198A JP 2000058508 A5 JP2000058508 A5 JP 2000058508A5
Authority
JP
Japan
Prior art keywords
dry etching
gas
reactive gas
etching method
reactive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998239441A
Other languages
English (en)
Japanese (ja)
Other versions
JP3704965B2 (ja
JP2000058508A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP23944198A priority Critical patent/JP3704965B2/ja
Priority claimed from JP23944198A external-priority patent/JP3704965B2/ja
Publication of JP2000058508A publication Critical patent/JP2000058508A/ja
Publication of JP2000058508A5 publication Critical patent/JP2000058508A5/ja
Application granted granted Critical
Publication of JP3704965B2 publication Critical patent/JP3704965B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP23944198A 1998-08-12 1998-08-12 ドライエッチング方法及び装置 Expired - Fee Related JP3704965B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23944198A JP3704965B2 (ja) 1998-08-12 1998-08-12 ドライエッチング方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23944198A JP3704965B2 (ja) 1998-08-12 1998-08-12 ドライエッチング方法及び装置

Publications (3)

Publication Number Publication Date
JP2000058508A JP2000058508A (ja) 2000-02-25
JP2000058508A5 true JP2000058508A5 (enrdf_load_html_response) 2004-10-21
JP3704965B2 JP3704965B2 (ja) 2005-10-12

Family

ID=17044828

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23944198A Expired - Fee Related JP3704965B2 (ja) 1998-08-12 1998-08-12 ドライエッチング方法及び装置

Country Status (1)

Country Link
JP (1) JP3704965B2 (enrdf_load_html_response)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4153961B2 (ja) * 2006-04-25 2008-09-24 積水化学工業株式会社 シリコンのエッチング方法
TWI335450B (en) 2006-05-15 2011-01-01 Ind Tech Res Inst Film cleaning method and apparatus
FR2913912A1 (fr) * 2007-03-23 2008-09-26 Cirtes Src Sa Procede de conception d'un emballage par stratoconception integre au procede de conception du produit a emballer.
US8771539B2 (en) * 2011-02-22 2014-07-08 Applied Materials, Inc. Remotely-excited fluorine and water vapor etch
KR101661096B1 (ko) * 2015-03-20 2016-09-30 주식회사 엔씨디 마스크 프리 건식 식각 장치 및 건식 식각 방법
KR102459129B1 (ko) * 2020-04-30 2022-10-26 도쿄엘렉트론가부시키가이샤 기판 처리 방법 및 플라즈마 처리 장치
JP2023071064A (ja) * 2021-11-10 2023-05-22 東京エレクトロン株式会社 プラズマ源及びプラズマ処理装置
WO2024247461A1 (ja) * 2023-05-31 2024-12-05 Ａｇｃ株式会社 凹部構造を有する部材を製造する方法および凹部構造を有する部材

Similar Documents

Publication Publication Date Title
KR910003758A (ko) 종형(縱型) 처리 장치 및 처리방법
KR950027986A (ko) 반도체장치의 제조방법과 제조장치
JP2005504855A5 (enrdf_load_html_response)
MY126419A (en) Vapor drying system and method
JP2000058508A5 (enrdf_load_html_response)
JP2000208498A5 (enrdf_load_html_response)
JP2009081395A (ja) 基板処理装置
KR101494995B1 (ko) 라디칼 에칭 장치 및 방법
KR960039224A (ko) 고속 에싱 방법
JP2000357683A5 (enrdf_load_html_response)
JP3653735B2 (ja) 表面処理方法及びその装置
JPS56123377A (en) Plasma cleaning and etching method
EP0886548A1 (en) Method and apparatus for drying and cleaning objects using aerosols
JP2010056263A (ja) イオン注入によりカーボン層が形成されたレジストの除去方法
JP2004356487A (ja) 有機物層の除去方法
JPH06120143A (ja) 気相化学反応装置
JP4059216B2 (ja) 表面処理方法及びその装置
JP3698065B2 (ja) 表面処理方法および装置並びに固体接合方法
JP2002502109A (ja) 基板の乾燥法および乾燥装置
JPH0323303Y2 (enrdf_load_html_response)
JP2002246374A5 (enrdf_load_html_response)
JPH1180990A5 (enrdf_load_html_response)
JPH0722376A (ja) ウエハ処理装置
JP2000091193A (ja) 表面処理方法及び装置
JPS6352411A (ja) 処理方法および装置