JP2000058486A5 - - Google Patents

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Publication number
JP2000058486A5
JP2000058486A5 JP1998239490A JP23949098A JP2000058486A5 JP 2000058486 A5 JP2000058486 A5 JP 2000058486A5 JP 1998239490 A JP1998239490 A JP 1998239490A JP 23949098 A JP23949098 A JP 23949098A JP 2000058486 A5 JP2000058486 A5 JP 2000058486A5
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JP
Japan
Prior art keywords
plating
substrate
tank
electrolytic
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998239490A
Other languages
English (en)
Japanese (ja)
Other versions
JP4162298B2 (ja
JP2000058486A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP23949098A external-priority patent/JP4162298B2/ja
Priority to JP23949098A priority Critical patent/JP4162298B2/ja
Priority to PCT/JP1999/004349 priority patent/WO2000010200A1/ja
Priority to KR20017001685A priority patent/KR100694562B1/ko
Priority to US09/762,582 priority patent/US7033463B1/en
Priority to EP99937028A priority patent/EP1126512A4/en
Publication of JP2000058486A publication Critical patent/JP2000058486A/ja
Publication of JP2000058486A5 publication Critical patent/JP2000058486A5/ja
Priority to US11/360,685 priority patent/US20060144714A1/en
Publication of JP4162298B2 publication Critical patent/JP4162298B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP23949098A 1998-08-11 1998-08-11 基板めっき装置 Expired - Lifetime JP4162298B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP23949098A JP4162298B2 (ja) 1998-08-11 1998-08-11 基板めっき装置
EP99937028A EP1126512A4 (en) 1998-08-11 1999-08-11 METHOD AND APPARATUS FOR METALLIZING PLATELETS
KR20017001685A KR100694562B1 (ko) 1998-08-11 1999-08-11 기판 도금방법 및 장치
US09/762,582 US7033463B1 (en) 1998-08-11 1999-08-11 Substrate plating method and apparatus
PCT/JP1999/004349 WO2000010200A1 (fr) 1998-08-11 1999-08-11 Procede et appareil de metallisation de plaquettes
US11/360,685 US20060144714A1 (en) 1998-08-11 2006-02-24 Substrate plating method and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23949098A JP4162298B2 (ja) 1998-08-11 1998-08-11 基板めっき装置

Publications (3)

Publication Number Publication Date
JP2000058486A JP2000058486A (ja) 2000-02-25
JP2000058486A5 true JP2000058486A5 (enExample) 2005-06-09
JP4162298B2 JP4162298B2 (ja) 2008-10-08

Family

ID=17045558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23949098A Expired - Lifetime JP4162298B2 (ja) 1998-08-11 1998-08-11 基板めっき装置

Country Status (1)

Country Link
JP (1) JP4162298B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6824612B2 (en) * 2001-12-26 2004-11-30 Applied Materials, Inc. Electroless plating system
WO2009109464A1 (en) * 2008-03-05 2009-09-11 Applied Materials Inc. Coating apparatus with rotation module
JP6040092B2 (ja) 2013-04-23 2016-12-07 株式会社荏原製作所 基板めっき装置及び基板めっき方法

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