JP4162298B2 - 基板めっき装置 - Google Patents
基板めっき装置 Download PDFInfo
- Publication number
- JP4162298B2 JP4162298B2 JP23949098A JP23949098A JP4162298B2 JP 4162298 B2 JP4162298 B2 JP 4162298B2 JP 23949098 A JP23949098 A JP 23949098A JP 23949098 A JP23949098 A JP 23949098A JP 4162298 B2 JP4162298 B2 JP 4162298B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- substrate
- tank
- electrolytic
- electroless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims description 78
- 238000007747 plating Methods 0.000 title claims description 73
- 238000009713 electroplating Methods 0.000 claims description 43
- 238000012545 processing Methods 0.000 claims description 39
- 238000007772 electroless plating Methods 0.000 claims description 37
- 239000003054 catalyst Substances 0.000 claims description 16
- 238000004140 cleaning Methods 0.000 claims description 15
- 238000012546 transfer Methods 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 8
- 238000011049 filling Methods 0.000 claims description 7
- 230000004913 activation Effects 0.000 claims description 5
- 230000003213 activating effect Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 description 24
- 230000008569 process Effects 0.000 description 22
- 239000007788 liquid Substances 0.000 description 19
- 239000010949 copper Substances 0.000 description 18
- 229910052802 copper Inorganic materials 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 238000005406 washing Methods 0.000 description 13
- 230000004888 barrier function Effects 0.000 description 9
- 238000005229 chemical vapour deposition Methods 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 7
- 230000032258 transport Effects 0.000 description 6
- 238000001994 activation Methods 0.000 description 5
- 238000011109 contamination Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000003638 chemical reducing agent Substances 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 101100165177 Caenorhabditis elegans bath-15 gene Proteins 0.000 description 1
- 101150003085 Pdcl gene Proteins 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
Images
Landscapes
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23949098A JP4162298B2 (ja) | 1998-08-11 | 1998-08-11 | 基板めっき装置 |
| PCT/JP1999/004349 WO2000010200A1 (fr) | 1998-08-11 | 1999-08-11 | Procede et appareil de metallisation de plaquettes |
| US09/762,582 US7033463B1 (en) | 1998-08-11 | 1999-08-11 | Substrate plating method and apparatus |
| EP99937028A EP1126512A4 (en) | 1998-08-11 | 1999-08-11 | METHOD AND APPARATUS FOR METALLIZING PLATELETS |
| KR20017001685A KR100694562B1 (ko) | 1998-08-11 | 1999-08-11 | 기판 도금방법 및 장치 |
| US11/360,685 US20060144714A1 (en) | 1998-08-11 | 2006-02-24 | Substrate plating method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23949098A JP4162298B2 (ja) | 1998-08-11 | 1998-08-11 | 基板めっき装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000058486A JP2000058486A (ja) | 2000-02-25 |
| JP2000058486A5 JP2000058486A5 (enExample) | 2005-06-09 |
| JP4162298B2 true JP4162298B2 (ja) | 2008-10-08 |
Family
ID=17045558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23949098A Expired - Lifetime JP4162298B2 (ja) | 1998-08-11 | 1998-08-11 | 基板めっき装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4162298B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6824612B2 (en) * | 2001-12-26 | 2004-11-30 | Applied Materials, Inc. | Electroless plating system |
| TWI463029B (zh) * | 2008-03-05 | 2014-12-01 | Applied Materials Inc | 具有旋轉模組之塗覆設備 |
| JP6040092B2 (ja) | 2013-04-23 | 2016-12-07 | 株式会社荏原製作所 | 基板めっき装置及び基板めっき方法 |
-
1998
- 1998-08-11 JP JP23949098A patent/JP4162298B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000058486A (ja) | 2000-02-25 |
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