JP2000038573A5 - - Google Patents

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Publication number
JP2000038573A5
JP2000038573A5 JP1999115158A JP11515899A JP2000038573A5 JP 2000038573 A5 JP2000038573 A5 JP 2000038573A5 JP 1999115158 A JP1999115158 A JP 1999115158A JP 11515899 A JP11515899 A JP 11515899A JP 2000038573 A5 JP2000038573 A5 JP 2000038573A5
Authority
JP
Japan
Prior art keywords
polishing
metal film
semiconductor device
slurry
alumina
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1999115158A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000038573A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP11515899A priority Critical patent/JP2000038573A/ja
Priority claimed from JP11515899A external-priority patent/JP2000038573A/ja
Priority to US09/313,356 priority patent/US6475407B2/en
Priority to TW088108083A priority patent/TWI238849B/zh
Priority to KR1019990017816A priority patent/KR100328308B1/ko
Publication of JP2000038573A publication Critical patent/JP2000038573A/ja
Priority to US09/672,776 priority patent/US6770218B1/en
Publication of JP2000038573A5 publication Critical patent/JP2000038573A5/ja
Withdrawn legal-status Critical Current

Links

JP11515899A 1998-05-19 1999-04-22 半導体装置用金属膜研磨スラリ― Withdrawn JP2000038573A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP11515899A JP2000038573A (ja) 1998-05-19 1999-04-22 半導体装置用金属膜研磨スラリ―
US09/313,356 US6475407B2 (en) 1998-05-19 1999-05-18 Composition for polishing metal on semiconductor wafer and method of using same
TW088108083A TWI238849B (en) 1998-05-19 1999-05-18 Composition for polishing metal on semiconductor wafer and method of using same
KR1019990017816A KR100328308B1 (ko) 1998-05-19 1999-05-18 반도체 웨이퍼 상의 금속을 연마하기 위한 조성물 및 그의 이용방법
US09/672,776 US6770218B1 (en) 1998-05-19 2000-09-29 Composition for polishing metal on semiconductor wafer and method of using same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP13693498 1998-05-19
JP10-136934 1998-05-19
JP11515899A JP2000038573A (ja) 1998-05-19 1999-04-22 半導体装置用金属膜研磨スラリ―

Publications (2)

Publication Number Publication Date
JP2000038573A JP2000038573A (ja) 2000-02-08
JP2000038573A5 true JP2000038573A5 (enExample) 2006-07-13

Family

ID=26453731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11515899A Withdrawn JP2000038573A (ja) 1998-05-19 1999-04-22 半導体装置用金属膜研磨スラリ―

Country Status (3)

Country Link
JP (1) JP2000038573A (enExample)
KR (1) KR100328308B1 (enExample)
TW (1) TWI238849B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4557105B2 (ja) * 1999-05-28 2010-10-06 日産化学工業株式会社 研磨用組成物
KR100799965B1 (ko) * 2000-07-08 2008-02-01 에포크 머티리얼 컴퍼니, 리미티드 화학-기계적 연마제 조성물 및 연마 방법
KR100535074B1 (ko) * 2001-06-26 2005-12-07 주식회사 하이닉스반도체 루테늄의 화학 기계적 연마용 슬러리 및 이를 이용한연마공정
US20030003747A1 (en) * 2001-06-29 2003-01-02 Jae Hong Kim Chemical mechanical polishing slurry for ruthenium titanium nitride and polishing process using the same
KR100447975B1 (ko) * 2001-12-28 2004-09-10 주식회사 하이닉스반도체 씨엠피용 슬러리, 그 제조방법 및 이를 이용한 씨엠피 처리방법
KR100444308B1 (ko) 2001-12-29 2004-08-16 주식회사 하이닉스반도체 반도체 소자의 형성 방법
KR100638317B1 (ko) * 2004-07-28 2006-10-25 주식회사 케이씨텍 연마용 슬러리 및 이의 제조 방법 및 기판 연마 방법
KR100641348B1 (ko) 2005-06-03 2006-11-03 주식회사 케이씨텍 Ｃｍｐ용 슬러리와 이의 제조 방법 및 기판의 연마 방법
EP2322322B2 (en) * 2008-06-13 2022-10-05 Fujimi Incorporated Aluminum oxide particle and polishing composition containing the same
CN102869478A (zh) * 2010-04-28 2013-01-09 日本百考基株式会社 蓝宝石研磨用浆液和蓝宝石的研磨方法

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