JP2000036649A - 電子技術デバイスの製造方法及び電気技術装置 - Google Patents
電子技術デバイスの製造方法及び電気技術装置Info
- Publication number
- JP2000036649A JP2000036649A JP11185948A JP18594899A JP2000036649A JP 2000036649 A JP2000036649 A JP 2000036649A JP 11185948 A JP11185948 A JP 11185948A JP 18594899 A JP18594899 A JP 18594899A JP 2000036649 A JP2000036649 A JP 2000036649A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- conductive
- support sheet
- conductive path
- plastic body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 239000004033 plastic Substances 0.000 claims abstract description 47
- 229920003023 plastic Polymers 0.000 claims abstract description 47
- 238000000151 deposition Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 9
- 230000001737 promoting effect Effects 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 2
- 238000004070 electrodeposition Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 35
- 229910052802 copper Inorganic materials 0.000 abstract description 34
- 239000010949 copper Substances 0.000 abstract description 34
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract description 6
- 239000004020 conductor Substances 0.000 abstract description 4
- 238000001465 metallisation Methods 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 230000008021 deposition Effects 0.000 abstract description 3
- 229910052763 palladium Inorganic materials 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 abstract description 3
- 230000001133 acceleration Effects 0.000 abstract 2
- 230000035945 sensitivity Effects 0.000 abstract 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 5
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 5
- 238000005098 hot rolling Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000010137 moulding (plastic) Methods 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- 235000011299 Brassica oleracea var botrytis Nutrition 0.000 description 2
- 240000003259 Brassica oleracea var. botrytis Species 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- TXKMVPPZCYKFAC-UHFFFAOYSA-N disulfur monoxide Inorganic materials O=S=S TXKMVPPZCYKFAC-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XTQHKBHJIVJGKJ-UHFFFAOYSA-N sulfur monoxide Chemical compound S=O XTQHKBHJIVJGKJ-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3493—Moulded interconnect devices, i.e. moulded articles provided with integrated circuit traces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
- Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19829248.1 | 1998-06-30 | ||
| DE19829248A DE19829248A1 (de) | 1998-06-30 | 1998-06-30 | Verfahren zur Herstellung eines elektrotechnischen Bauteiles |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000036649A true JP2000036649A (ja) | 2000-02-02 |
| JP2000036649A5 JP2000036649A5 (enExample) | 2006-08-17 |
Family
ID=7872545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11185948A Withdrawn JP2000036649A (ja) | 1998-06-30 | 1999-06-30 | 電子技術デバイスの製造方法及び電気技術装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6668450B1 (enExample) |
| EP (1) | EP0969703A3 (enExample) |
| JP (1) | JP2000036649A (enExample) |
| CN (1) | CN1159959C (enExample) |
| DE (1) | DE19829248A1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19829248A1 (de) * | 1998-06-30 | 2000-01-05 | Thomson Brandt Gmbh | Verfahren zur Herstellung eines elektrotechnischen Bauteiles |
| DE19963850A1 (de) * | 1999-12-30 | 2001-07-26 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zum Erzeugen einer leitfähigen Struktur auf einem Substrat |
| US6952871B1 (en) * | 1999-12-31 | 2005-10-11 | Lear Automotive (Eeds) Spain, S.L. | Method for manufacturing printed circuit boards |
| DE10240685A1 (de) * | 2002-09-04 | 2004-03-25 | Hübner GmbH | Verfahren zur Herstellung einer Leiterbahnfolie für ein Kunststoffgehäuse oder für Kunststoffgehäuseteile, insbesondere für ein Schlossgehäuse sowie Kunststoffgehäuse, insbesondere Schlossgehäuse mit Leiterbahnen |
| US7243421B2 (en) * | 2003-10-29 | 2007-07-17 | Conductive Inkjet Technology Limited | Electrical connection of components |
| DE102004019510A1 (de) * | 2004-04-22 | 2005-12-01 | Carl Freudenberg Kg | Aus Kunststoff bestehendes Gehäuse für elektronische Einrichtungen und Verfahren zu seiner Herstellung |
| DE502005003831D1 (de) † | 2005-03-03 | 2008-06-05 | Arvinmeritor Gmbh | Dachmodul mit Antenne |
| DE102005034083A1 (de) * | 2005-07-21 | 2007-02-22 | Hirschmann Car Communication Gmbh | Verfahren zum Aufbringen von elektrischen Leiterstrukturen auf ein Zielbauteil von Kunststoff |
| DE102005034082A1 (de) * | 2005-07-21 | 2007-02-01 | Hirschmann Car Communication Gmbh | Verfahren zum Aufbringen von elektrischen Leiterstrukturen auf ein Zielbauteil aus Kunststoff |
| DE102005039586B4 (de) * | 2005-08-19 | 2011-06-22 | Daimler AG, 70327 | Verfahren zum Aufbringen einer Antennenstruktur auf ein Beplankungsteil einer Fahrzeugkarosserie und eine integrierte Antennenstruktur |
| DE102007017531A1 (de) * | 2007-04-13 | 2008-10-16 | Continental Automotive Gmbh | Verfahren zur Herstellung eines Signal- und Potentialverteilungssystems für mechatronische Module |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4354895A (en) * | 1981-11-27 | 1982-10-19 | International Business Machines Corporation | Method for making laminated multilayer circuit boards |
| WO1989004880A1 (en) * | 1987-11-16 | 1989-06-01 | Motorola, Inc. | High temperature thermoplastic substrate having a vacuum deposited solderable electrical circuit pattern and method of manufacture |
| JPH0267114A (ja) * | 1988-09-02 | 1990-03-07 | Hitachi Ltd | 配線回路を有する成形品 |
| GB8913450D0 (en) * | 1989-06-12 | 1989-08-02 | Philips Electronic Associated | Electrical device manufacture,particularly infrared detector arrays |
| US5046238A (en) * | 1990-03-15 | 1991-09-10 | Rogers Corporation | Method of manufacturing a multilayer circuit board |
| JP2747096B2 (ja) * | 1990-07-24 | 1998-05-06 | 北川工業株式会社 | ３次元回路基板の製造方法 |
| DE4036592A1 (de) | 1990-11-16 | 1992-05-21 | Bayer Ag | Spritzgegossene leiterplatten durch hinterspritzen von flexiblen schaltungen mit thermoplastischen materialien |
| JP3219897B2 (ja) * | 1993-05-07 | 2001-10-15 | イビデン株式会社 | プリント配線板 |
| US5480503A (en) * | 1993-12-30 | 1996-01-02 | International Business Machines Corporation | Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof |
| DE19829248A1 (de) * | 1998-06-30 | 2000-01-05 | Thomson Brandt Gmbh | Verfahren zur Herstellung eines elektrotechnischen Bauteiles |
-
1998
- 1998-06-30 DE DE19829248A patent/DE19829248A1/de not_active Withdrawn
-
1999
- 1999-06-21 EP EP99111866A patent/EP0969703A3/en not_active Withdrawn
- 1999-06-28 US US09/340,567 patent/US6668450B1/en not_active Expired - Fee Related
- 1999-06-30 CN CNB991101049A patent/CN1159959C/zh not_active Expired - Fee Related
- 1999-06-30 JP JP11185948A patent/JP2000036649A/ja not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| CN1241110A (zh) | 2000-01-12 |
| CN1159959C (zh) | 2004-07-28 |
| US6668450B1 (en) | 2003-12-30 |
| DE19829248A1 (de) | 2000-01-05 |
| EP0969703A2 (en) | 2000-01-05 |
| EP0969703A3 (en) | 2000-03-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060629 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060629 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20070320 |