CN1159959C - 电气工艺设备的制造方法 - Google Patents

电气工艺设备的制造方法 Download PDF

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Publication number
CN1159959C
CN1159959C CNB991101049A CN99110104A CN1159959C CN 1159959 C CN1159959 C CN 1159959C CN B991101049 A CNB991101049 A CN B991101049A CN 99110104 A CN99110104 A CN 99110104A CN 1159959 C CN1159959 C CN 1159959C
Authority
CN
China
Prior art keywords
conductor printing
wiring board
plastic body
conductive layer
support plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB991101049A
Other languages
English (en)
Chinese (zh)
Other versions
CN1241110A (zh
Inventor
汉斯-奥托・哈勒
汉斯-奥托·哈勒
・斯特鲁贝尔
沃尔克·斯特鲁贝尔
贝廷格
冈特·贝廷格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Deutsche Thomson Brandt GmbH
Original Assignee
Deutsche Thomson Brandt GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche Thomson Brandt GmbH filed Critical Deutsche Thomson Brandt GmbH
Publication of CN1241110A publication Critical patent/CN1241110A/zh
Application granted granted Critical
Publication of CN1159959C publication Critical patent/CN1159959C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3493—Moulded interconnect devices, i.e. moulded articles provided with integrated circuit traces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CNB991101049A 1998-06-30 1999-06-30 电气工艺设备的制造方法 Expired - Fee Related CN1159959C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19829248.1 1998-06-30
DE19829248A DE19829248A1 (de) 1998-06-30 1998-06-30 Verfahren zur Herstellung eines elektrotechnischen Bauteiles

Publications (2)

Publication Number Publication Date
CN1241110A CN1241110A (zh) 2000-01-12
CN1159959C true CN1159959C (zh) 2004-07-28

Family

ID=7872545

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB991101049A Expired - Fee Related CN1159959C (zh) 1998-06-30 1999-06-30 电气工艺设备的制造方法

Country Status (5)

Country Link
US (1) US6668450B1 (enExample)
EP (1) EP0969703A3 (enExample)
JP (1) JP2000036649A (enExample)
CN (1) CN1159959C (enExample)
DE (1) DE19829248A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19829248A1 (de) * 1998-06-30 2000-01-05 Thomson Brandt Gmbh Verfahren zur Herstellung eines elektrotechnischen Bauteiles
DE19963850A1 (de) * 1999-12-30 2001-07-26 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Erzeugen einer leitfähigen Struktur auf einem Substrat
US6952871B1 (en) * 1999-12-31 2005-10-11 Lear Automotive (Eeds) Spain, S.L. Method for manufacturing printed circuit boards
DE10240685A1 (de) * 2002-09-04 2004-03-25 Hübner GmbH Verfahren zur Herstellung einer Leiterbahnfolie für ein Kunststoffgehäuse oder für Kunststoffgehäuseteile, insbesondere für ein Schlossgehäuse sowie Kunststoffgehäuse, insbesondere Schlossgehäuse mit Leiterbahnen
US7243421B2 (en) * 2003-10-29 2007-07-17 Conductive Inkjet Technology Limited Electrical connection of components
DE102004019510A1 (de) * 2004-04-22 2005-12-01 Carl Freudenberg Kg Aus Kunststoff bestehendes Gehäuse für elektronische Einrichtungen und Verfahren zu seiner Herstellung
DE502005003831D1 (de) † 2005-03-03 2008-06-05 Arvinmeritor Gmbh Dachmodul mit Antenne
DE102005034083A1 (de) * 2005-07-21 2007-02-22 Hirschmann Car Communication Gmbh Verfahren zum Aufbringen von elektrischen Leiterstrukturen auf ein Zielbauteil von Kunststoff
DE102005034082A1 (de) * 2005-07-21 2007-02-01 Hirschmann Car Communication Gmbh Verfahren zum Aufbringen von elektrischen Leiterstrukturen auf ein Zielbauteil aus Kunststoff
DE102005039586B4 (de) * 2005-08-19 2011-06-22 Daimler AG, 70327 Verfahren zum Aufbringen einer Antennenstruktur auf ein Beplankungsteil einer Fahrzeugkarosserie und eine integrierte Antennenstruktur
DE102007017531A1 (de) * 2007-04-13 2008-10-16 Continental Automotive Gmbh Verfahren zur Herstellung eines Signal- und Potentialverteilungssystems für mechatronische Module

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4354895A (en) * 1981-11-27 1982-10-19 International Business Machines Corporation Method for making laminated multilayer circuit boards
WO1989004880A1 (en) * 1987-11-16 1989-06-01 Motorola, Inc. High temperature thermoplastic substrate having a vacuum deposited solderable electrical circuit pattern and method of manufacture
JPH0267114A (ja) * 1988-09-02 1990-03-07 Hitachi Ltd 配線回路を有する成形品
GB8913450D0 (en) * 1989-06-12 1989-08-02 Philips Electronic Associated Electrical device manufacture,particularly infrared detector arrays
US5046238A (en) * 1990-03-15 1991-09-10 Rogers Corporation Method of manufacturing a multilayer circuit board
JP2747096B2 (ja) * 1990-07-24 1998-05-06 北川工業株式会社 ３次元回路基板の製造方法
DE4036592A1 (de) 1990-11-16 1992-05-21 Bayer Ag Spritzgegossene leiterplatten durch hinterspritzen von flexiblen schaltungen mit thermoplastischen materialien
JP3219897B2 (ja) * 1993-05-07 2001-10-15 イビデン株式会社 プリント配線板
US5480503A (en) * 1993-12-30 1996-01-02 International Business Machines Corporation Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof
DE19829248A1 (de) * 1998-06-30 2000-01-05 Thomson Brandt Gmbh Verfahren zur Herstellung eines elektrotechnischen Bauteiles

Also Published As

Publication number Publication date
CN1241110A (zh) 2000-01-12
US6668450B1 (en) 2003-12-30
JP2000036649A (ja) 2000-02-02
DE19829248A1 (de) 2000-01-05
EP0969703A2 (en) 2000-01-05
EP0969703A3 (en) 2000-03-08

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee