JP2000033548A - Washing brush - Google Patents

Abstract

PROBLEM TO BE SOLVED: To remove burr and dust at a μm level existing on a machined surface satisfactorily. SOLUTION: This washing brush 1 is constituted in such a manner that wire materials 4 for brush having several kinds of diameters are fixed on a brush holder 3 provided at a tip of a handle 2 using adhesive such as epoxy resin. As for the wire materials 4 for brush, four kinds of wire diameters of ϕ8 μm, ϕ12 μm, ϕ25 μm, and ϕ100 μm are used, and an amount of wire materials having the smallest wire diameter is increased most and a tip of its brush hair is prolonged most. Burr and dust at a μm level are removed by the wire materials 4 for brush having the diameter of ϕ8 μm, and burr and dust having the same size as each wire diameter are removed by the wire materials 4 for brush having the diameters of ϕ12 μm, ϕ25 μm, and ϕ100 μm. The bending rigidity of a tip hair having small wire diameter is reinforced to compensate the insufficiency of a removing force.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to various parts used in space and aircraft, medical equipment, advanced electronic equipment, semiconductor substrates, general precision equipment, etc. The present invention relates to a cleaning brush suitable for removing burrs and dust on a flat clean surface required for pre-processing such as pressing and painting in a moving body surface and a machine industry.

[0002]

2. Description of the Related Art As a cleaning technique in this field, cleaning using a tooth brush-like cleaning brush or cleaning using an ultrasonic cleaner is generally known.

[0003]

In the cleaning using the cleaning brush, the diameter of the wire of the brush is too large to correspond to the size of minute burrs or dusts.
It is difficult to remove burrs and dust of 1 μm with a hair tip of mm. In addition, a substance having a μm level exerts an intermolecular attractive force greater than gravity, and the phenomenon that the removed matter is reattached is remarkable.

Further, even if the machined surface is finished in a mirror-like shape, ridges having a width of several μm are observed from a microscopic viewpoint, and burrs are present near the ridges. ing. Such burrs cannot be removed at all by the force applied by the ultrasonic cleaner. The present invention has been made in order to solve such inconvenience, and an object of the present invention is to provide a cleaning brush capable of satisfactorily removing burrs and dust on a surface to be processed.

[0005]

In order to achieve this object, a cleaning brush according to the present invention provides a brush having a wire tip corresponding to the size of burrs and dust on a surface to be processed and the adhesion strength of the dust. It is characterized by having. In principle, an object to be removed having a diameter of several μm is removed using a brush having a hair tip having a diameter of several μm. In this case, if only a wire having a small wire diameter is used, the brush may be bent or bent due to the diameter and length of the wire, and the removal force is insufficient, but a wire having a large diameter is used to compensate for the removal force. Mix. For a wire having a large wire diameter, if there is an object to be removed having a size similar to the wire diameter, the object to be removed is removed.

For example, when it is assumed that several types of burrs and dusts having different sizes are mixed, wire rods having diameters of several μm, ten and several μm, twenty and several μm, thirty and several μm, fifty μm, and hundred μm, respectively. Is used as a brush. In this case, it is preferable that the wire material has a larger amount as the wire material has a smaller diameter, and that the bristle tip has a longer length as the wire material has a smaller wire diameter. The wires having the respective wire diameters are involved in removing burrs and dust having substantially the same size, and wires having a larger wire diameter compensate for the shortage of the removing power.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram for explaining a cleaning brush which is an example of an embodiment of the present invention, and FIG.
3 is a view for explaining a cleaning brush according to another embodiment of the present invention, FIG. 4 is a right side view of FIG. 3, and FIGS. 5 to 12 are manufacturing methods of the cleaning brush. FIG. 13 to FIG. 20 are views for explaining a cleaning brush according to another embodiment of the present invention.

FIGS. 1 and 2 show a tooth brush-like cleaning brush 1. In this cleaning brush 1, a brush holder 3 provided at the tip of a handle 2 is provided with brush wires 4 of various diameters such as epoxy resin. Is fixed by the adhesive S. The material of the wire 4 for brushing may be a non-metallic material such as glass fiber or carbon fiber, a metal such as stainless steel or tungsten, or a metal such as these, depending on the substance or condition of the material to be removed present on the surface to be processed. The combination can be appropriately selected and used.

In this embodiment, as the brush wire 4, φ8 μm, φ12 μm, φ25 μm, φ
Four types of wire diameters of 100 μm are used, and the thinner the wire, the larger the amount and the longer the bristle tips. In addition, the wire diameter of the brush wire 4 is not limited to this embodiment, and is appropriately changed and determined assuming the size of burrs and dust existing on the surface to be processed.

[0010] Then, burrs and dusts at the μm level are removed by the brush wire 4 having a wire diameter of φ8 μm, and
A brush wire 4 having a wire diameter of m, φ25 μm, φ100 μm removes burrs and dusts of the same size as each wire diameter, and reinforces the bending stiffness of a finer wire diameter to compensate for insufficient removal power. . In this case, the thinner the wire diameter, the longer the bristle tips. Therefore, when cleaning the surface to be processed, first, the thinnest brush wire 4 of φ8 μm bends first, and then the brush wires 4 of φ12 μm and φ25 μm sequentially. Since the wire 4 bends and finally the thickest wire wire 4 for φ100 μm bends, the bristles and dust on the surface to be processed can be satisfactorily removed from the thin ends to the thick ends. The burr and dust removed from the hair tips are less likely to adhere to the bristles, making it easier to remove the burr and dust. In order to prevent the removed burrs and dust from adhering to the tips of the cleaning brush 1, a gas or a liquid may be caused to flow at a high speed during the brushing. Burrs and dust may be removed by another brush.

Next, an example of a method for manufacturing the cleaning brush 1 will be described. That is, as shown in FIG. 5 to FIG. 12, a predetermined number of the adhesive tapes 5 are arranged in a state of being aligned for each brush wire 4 of each wire diameter.
And wound up in a bundle, and the wound pieces are appropriately combined for each wire diameter and fixed to the brush holder 3 with an adhesive S such as epoxy resin. In this way, the brush wires 4 having a wire diameter of μm level having different wire diameters can be easily bundled, so that the manufacturing of the cleaning brush 1 can be simplified. In this case, the position and number of the adhesive tapes 5 with respect to the brush wires 4 having different wire diameters are determined according to the length of the bristle tips. Further, the brush wire 4 having a single wire diameter may be fixed to the adhesive tape 5 and may be wound up in a loop in a multiplex manner.

In the above embodiment, the case where the present invention is applied to the toothbrush-like cleaning brush 1 is taken as an example. However, the present invention is not limited to this. For example, as shown in FIGS. Φ8 μm, φ25 in cylindrical brush holder 10
The brush wire 4 having a wire diameter of 100 μm or 100 μm may be fixed with an adhesive S such as an epoxy resin.
3 to 16 may be used.

FIG. 13 shows an example in which a stainless steel wire 20 is twisted and a thin wire 21 is attached to the tip L ₂ .
It is an example of a tapered brush that becomes thinner toward the tip. Thus, the side walls of the pores and the like, the bottoms of the pores, and the like are cleaned. FIG. 14 shows an example in which thin wires 31 embedded in multiple rows in a mounting bracket 30 are attached by caulking. Thus, the surface of the product, the bottom of the groove, and the side surface of the groove are cleaned. In FIG. 14, the brush is a rectangular brush. However, the fitting may be substantially circular or another shape, and the wire 31 may be arranged according to the shape of the fitting.

FIG. 15 shows a wire 41a which is sandwiched between two spring plates 40 so as to be exposed to the inner and outer diameters, and the two spring plates 40 are formed as coil springs and are exposed on the inner and outer peripheral surfaces of the spiral. , 41b. In this case, one or more coil spring-shaped wires having a smaller diameter than the spring plate 40 may be similarly inserted into the inner peripheral portion of the spring plate 40 to increase the rigidity of the entire brush.

FIG. 16 shows a shoe polish-like brush, in which the wires 50 are arranged in a staggered or parallel manner and fixed to the holder 51 by an adhesive or caulking. 13 to 16, the wires constituting the brush may be provided in a combination of different diameters or with different heights as shown in FIGS. By the way, the mechanical industry using metal, especially steel, processes a geometric plane by cutting, grinding, honing, lapping, and the like, and for example, a block gauge, a steel ball, a roller, and the like are the best.

In the semiconductor industry, the development of a processing technology for an ultra-flat cleaning surface of a silicon wafer has recently been advanced, and a technology corresponding to the metal surface has been required. Metals are more polycrystalline and contain more impurities than silicon, so various problems have come up with accuracy of several nanometers. The conventional processing method is a mechanical processing and mainly depends on shaving. Therefore, even if the accuracy is increased, the cut surface is essentially an aggregate of flaws, and the flaws are only reduced. In addition, burrs are formed at the interface between the flaws, and when the burrs come into contact with each other, they become dust on the surface. Dust of several microns is generally subjected to an ultrasonic cleaning method when the van der Waals force becomes larger than gravity. In such a case, it becomes difficult to remove it from the surface to be processed.

In order to remove these dusts, the silicon wafer surface is subjected to a chemical treatment such as melting. However, since the metal surface contains various constituent atoms and impurities as described above, processing such as chemical polishing is extremely difficult, and furthermore, chemical processing (for example, melting) in fine dust and burrs is performed. There are substances that cannot be used.
In addition, due to chemical treatment, undesired substances are often formed on the workpiece with oxides called rust, and most of the processing methods of the processing surface are crushed harder than the processing surface. Since fine abrasive grains that are easy to use are used, a phenomenon in which ultrafine processed particles stick into the surface to be processed also appears, deteriorating the surface function.

Therefore, the present inventors have proposed a burr of 1 to several μm,
In order to remove dust effectively from the surface to be processed, a bundle of fibers (wires) such as stainless steel, glass, carbon, etc. having a wire diameter of several microns to several tens microns is coated with a chemical polishing agent such as a phosphoric acid ester or a sulfur compound. A cleaning brush was devised in which these were included and fixed with a binder. The type and amount of the chemical polishing agent are appropriately selected and determined depending on the type of the workpiece and the required surface accuracy, and the bending rigidity of the fiber tip is reinforced by the binder. .

FIGS. 17 to 19 show an embodiment in which the cleaning brush is applied to a ball lapping machine. The ball lapping machine has a circular fixed plate 72 having a grindstone portion 71 fixed to the upper side of a base plate 70, and a grindstone portion 74 fixed to a lower side of the base plate 73, and the grindstone surface 74 a is fixed to the grindstone surface 72 a of the fixed plate 72. And a circular turntable 75 concentrically arranged in a facing state.

Each grinding wheel surface 72 of the fixed disk 72 and the rotating disk 75
a, 74a is formed with an annular ball groove 76,
The steel ball 77 is sandwiched between the ball grooves 76 of the grindstone surfaces 72a and 74a, and the lapping of the steel ball 77 is performed by rotating the rotating disk 75 in this state. The steel balls are manufactured by so-called lapping using free abrasive grains or grinding stone lapping in which lapping is performed using a grinding wheel of a ball lapping machine.

In this embodiment, the fixed plate 72
And, as each of the grindstone portions 71 and 74 of the rotating disk 75, a bundle of fibers (wires) 78 of stainless steel, glass, carbon, or the like having a wire diameter of several microns to several tens microns is chemically polished with, for example, a phosphate ester or a sulfur compound. A cleaning brush containing an agent 79 and fixing them with a binder 80 is used.

Then, fine burrs and dust existing on the surface to be processed of the steel ball 77 are removed by the fiber 78.
Ultra-fine dust that can be removed by the fiber 78 but re-adheres and micro-burrs that cannot be removed by the fiber 78 are dissolved with a chemical polishing agent, and substances that are insoluble in the chemical polishing agent such as carbon contained are those substances. Is melted and removed by the fiber-78.

After processing by the cleaning brush, the progress of the polishing by the chemical abrasive is reliably stopped, and the ion concentration in the ultrapure water is checked in order to confirm that the progress of the neutralization treatment and the polishing has been completely stopped. Measurement. If the workpiece contains carbon, the carbon is deposited on the surface of the workpiece by chemical polishing. In such a case, the deposited carbon is removed after the processing, for example, as shown in FIGS. It is preferable to remove with the cleaning brush described in the above.

As described above, in this embodiment, a smooth surface can be obtained by almost completely removing μm-level burrs, dust, and residual crushed pieces of lapping abrasive grains present on the machined surface. In addition, a surface that does not generate dust even when it comes into contact with other components can be provided. In this embodiment, a case in which a cleaning brush is applied to the grindstone portion of the ball wrapping machine is taken as an example. Instead, however, the grindstone portion 90 of the super-finishing machine and the grindstone portion of the honing machine shown in FIG. As shown in FIG. 19 and FIG. 20, a cleaning brush having a shape suitable for the workpiece may be applied.

After the normal honing, the surface to be processed may be processed by the cleaning brush of this embodiment. In some cases, abrasive grains may be applied to the cleaning brush according to the processing object. You may mix. Furthermore,
When the deposited carbon after processing is removed by the cleaning brush described with reference to FIGS. 1 to 16, the removal may be performed by an ultrasonic flow.

[0026]

As is apparent from the above description, according to the present invention, it is possible to obtain an effect that burrs and dusts at the μm level existing on the surface to be processed can be removed satisfactorily.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining a cleaning brush as an example of an embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is a view for explaining a cleaning brush according to another embodiment of the present invention.

FIG. 4 is a right side view of FIG.

FIG. 5 is a diagram for explaining a method of manufacturing a cleaning brush.

FIG. 6 is a right side view of FIG.

FIG. 7 is a view for explaining a method of manufacturing a cleaning brush.

FIG. 8 is a right side view of FIG. 7;

FIG. 9 is a diagram for explaining a method of manufacturing a cleaning brush.

FIG. 10 is a right side view of FIG. 9;

FIG. 11 is a diagram for explaining a manufacturing method of the cleaning brush.

FIG. 12 is a right side view of FIG.

FIG. 13 is a view for explaining a cleaning brush according to another embodiment of the present invention.

FIG. 14 is a view for explaining a cleaning brush according to another embodiment of the present invention.

FIG. 15 is a view for explaining a cleaning brush according to another embodiment of the present invention.

FIG. 16 is a view for explaining a cleaning brush according to another embodiment of the present invention.

FIG. 17 is a view for explaining an example in which a cleaning brush according to another embodiment of the present invention is used for a ball lapping machine.

FIG. 18 is a perspective view of a fixed plate constituting the ball wrapping machine.

FIG. 19 is a partially enlarged sectional view of FIG. 18;

FIG. 20 is a view for explaining a cleaning brush according to another embodiment of the present invention.

[Explanation of symbols]

 1. Cleaning brush 2. Pattern 3. Brush holder 4. Wire rod

Claims (1)

[Claims] 1. A cleaning brush having a bristles having a wire diameter corresponding to the size of burrs and dust on a surface to be processed and the adhesion strength of the dust.