JP2001276759A - Cleaning-fluid for glass substrate and method for cleaning glass substrate - Google Patents

Cleaning-fluid for glass substrate and method for cleaning glass substrate

Info

Publication number
JP2001276759A
JP2001276759A JP2000095072A JP2000095072A JP2001276759A JP 2001276759 A JP2001276759 A JP 2001276759A JP 2000095072 A JP2000095072 A JP 2000095072A JP 2000095072 A JP2000095072 A JP 2000095072A JP 2001276759 A JP2001276759 A JP 2001276759A
Authority
JP
Japan
Prior art keywords
cleaning
glass substrate
abrasive particles
glass
concentration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000095072A
Other languages
Japanese (ja)
Inventor
Takaaki Suematsu
孝章 末松
Terutaka Sawara
輝隆 佐原
Yoshimitsu Kitada
由光 北田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Plant Technologies Ltd
Original Assignee
Hitachi Plant Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
Priority to JP2000095072A priority Critical patent/JP2001276759A/en
Publication of JP2001276759A publication Critical patent/JP2001276759A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0075Cleaning of glass

Abstract

PROBLEM TO BE SOLVED: To provide a cleaning fluid for a glass substrate which shows an outstanding performance of removing polishing particles sticking to the surface of the glass substrate as well as a method for cleaning the glass substrate. SOLUTION: In the precision cleaning method for the glass substrate comprising five processes such as preliminary cleaning, primary chemical solution cleaning, secondary chemical solution cleaning, rinsing and drying, the glass substrate 12 is soaked in a cleaning tank 20 in the primary chemical solution cleaning process. The cleaning fluid 21 is composed of 50-200 mg/L hydrogen fluoride and 5 mg/L or more ozone in a dissolved state. The glass substrate is cleaned by ultrasonic wave using the cleaning fluid.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明はガラス基板の洗浄液
及び洗浄方法に係り、特に磁気ディスクや液晶ガラスな
どに用いられるガラス基板の洗浄液及び洗浄方法に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning solution and a cleaning method for a glass substrate, and more particularly to a cleaning solution and a cleaning method for a glass substrate used for a magnetic disk, a liquid crystal glass or the like.

【0002】[0002]

【従来の技術】例えば磁気ディスク用ガラス基板の製造
においては、まずディスク加工したガラス基板の表面を
研磨砥粒で研磨する。この時にガラス表面に付着した研
磨粒子を除去するために洗浄を行うが、洗浄が不十分で
あるとガラス表面に研磨粒子が残存し、磁気ディスクと
して正常な記録再生動作ができなくなったり、磁気ヘッ
ドを損傷させる原因になる。また、磁気ヘッドの浮上高
さも近年ますます減少しており、微粒子の除去ととも
に、洗浄時にエッチングむらが発生しない洗浄方法が求
められている。この種のガラス基板の洗浄方法として、
本出願人は先に特願平10−319014号を出願し
た。この方法はふっ化水素酸と硫酸等を混合した洗浄液
を用いてガラス基板の表面をエッチングすることによっ
て、前記研磨粒子を除去するものである。
2. Description of the Related Art For example, in the production of a glass substrate for a magnetic disk, first, the surface of a disk-processed glass substrate is polished with abrasive grains. At this time, cleaning is performed to remove the abrasive particles attached to the glass surface.However, if the cleaning is insufficient, the abrasive particles remain on the glass surface, making it impossible to perform a normal recording / reproducing operation as a magnetic disk or a magnetic head. Cause damage. In addition, the flying height of the magnetic head has been decreasing more and more in recent years, and there has been a demand for a cleaning method that removes fine particles and does not cause uneven etching during cleaning. As a method of cleaning this kind of glass substrate,
The present applicant has previously filed an application for Japanese Patent Application No. 10-319014. In this method, the abrasive particles are removed by etching the surface of the glass substrate using a cleaning liquid in which hydrofluoric acid and sulfuric acid are mixed.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、前記洗
浄液による洗浄は研磨粒子の除去には有効であるが、洗
浄液の濃度がやや高いのでガラスの表面に微細なエッチ
ングむらが発生することが判明した。本発明の目的は、
上記従来技術の問題点を改善して、ガラス表面に付着残
存した研磨粒子を効果的に除去するすることができ、し
かもガラスの表面に微細なエッチングむらが生じること
がないガラス基板の洗浄液及び洗浄方法を提供すること
にある。
However, it has been found that cleaning with the above-mentioned cleaning solution is effective for removing abrasive particles, but fine etching unevenness occurs on the glass surface because the concentration of the cleaning solution is rather high. The object of the present invention is
A cleaning solution and a cleaning solution for a glass substrate, which can solve the problems of the prior art described above and can effectively remove abrasive particles adhered and remaining on the glass surface, and do not cause fine etching unevenness on the glass surface. It is to provide a method.

【0004】[0004]

【課題を解決するための手段】前記目的を達成するため
に、本発明に係るガラス基板の洗浄液は50〜200m
g/Lのふっ化水素(以下、HFと称する。)と5mg
/L以上のオゾンを溶存したことを特徴とする。
In order to achieve the above-mentioned object, the glass substrate cleaning solution according to the present invention is 50 to 200 m.
g / L of hydrogen fluoride (hereinafter referred to as HF) and 5 mg
/ L or more ozone is dissolved.

【0005】また、本発明に係るガラス基板の洗浄方法
は、ガラス表面に研磨粒子が付着したガラス基板から前
記研磨粒子を洗浄除去するガラス基板の洗浄方法であっ
て、前記ガラス基板を50〜200mg/LのHFと5
mg/L以上のオゾンを溶存した洗浄液に浸漬し超音波
洗浄することを特徴とする。また、本発明は上記の洗浄
をした前記ガラス基板を、さらに、ふっ化アンモニウム
水溶液又はアルカリ溶液に浸漬し超音波洗浄することを
特徴とする
Further, a method of cleaning a glass substrate according to the present invention is a method of cleaning a glass substrate by removing the polishing particles from the glass substrate having the polishing particles adhered to the glass surface, wherein the glass substrate is used in an amount of 50 to 200 mg. / L HF and 5
It is characterized by being immersed in a cleaning solution in which mg / L or more of ozone is dissolved and ultrasonically cleaned. Further, the present invention is characterized in that the glass substrate washed above is further immersed in an ammonium fluoride aqueous solution or an alkaline solution and subjected to ultrasonic cleaning.

【0006】[0006]

【作用】本発明においては、洗浄液に溶存するHFとオ
ゾンの化学的な相互作用と超音波による物理的作用が相
乗することによって、ガラス表面に付着した研磨粒子が
効率よく除去される。また、洗浄液に溶存するHFの濃
度が希薄であるため、エッチングの程度が微弱でありガ
ラスの表面に微細なエッチングむらが生じることがな
い。
In the present invention, the chemical interaction between HF and ozone dissolved in the cleaning liquid and the physical action by ultrasonic waves work in synergy to remove abrasive particles attached to the glass surface efficiently. Further, since the concentration of HF dissolved in the cleaning liquid is low, the degree of etching is weak, and fine etching unevenness does not occur on the surface of the glass.

【0007】本発明では、洗浄液中のオゾンによって酸
化性のヒドロキシルラジカルが生成し、このヒドロキシ
ルラジカルがガラス表面の濡れ性を向上させ、ガラス表
面と研磨粒子との付着力を弱める。また、洗浄液中の低
濃度のHFによってガラス表面がエッチングされ、この
時にガラス表面に付着した研磨粒子がガラス表面から容
易に離脱する。このオゾンによるガラス表面の濡れ性向
上とHFによるエッチングがほぼ同時に進行しつつ、超
音波による物理的作用が加わって前記のように研磨粒子
が効率よく除去される。
In the present invention, oxidizing hydroxyl radicals are generated by the ozone in the cleaning solution, and the hydroxyl radicals enhance the wettability of the glass surface and weaken the adhesion between the glass surface and the abrasive particles. Further, the glass surface is etched by the HF having a low concentration in the cleaning liquid, and the abrasive particles attached to the glass surface at this time are easily separated from the glass surface. While the improvement of the wettability of the glass surface by the ozone and the etching by the HF proceed almost at the same time, the physical action by the ultrasonic wave is added, and the abrasive particles are efficiently removed as described above.

【0008】洗浄液中のオゾンの濃度は5mg/L以上
であることが必要である。5mg/L未満であると前記
ガラス表面の濡れ性向上が不十分となり、前記ガラス表
面からの研磨粒子の離脱作用が低下する。また、洗浄液
中のオゾンの濃度が高いほど前記ガラス表面からの研磨
粒子の離脱作用が向上する。しかし、20mg/Lを越
えても前記研磨粒子の離脱作用はほとんど向上しない。
したがって、経済性の観点から洗浄液中のオゾンの濃度
は5〜20mg/Lであることが好ましい。
[0008] The concentration of ozone in the cleaning solution must be 5 mg / L or more. When the amount is less than 5 mg / L, the wettability of the glass surface is insufficiently improved, and the action of detaching the abrasive particles from the glass surface is reduced. Further, as the concentration of ozone in the cleaning liquid is higher, the action of detaching the abrasive particles from the glass surface is improved. However, even if it exceeds 20 mg / L, the detachment action of the abrasive particles hardly improves.
Therefore, the concentration of ozone in the cleaning liquid is preferably 5 to 20 mg / L from the viewpoint of economy.

【0009】洗浄液中のHFの濃度は50〜200mg
/Lであることが必要である。50mg/L未満である
とHFによるエッチングが不十分となり、前記ガラス表
面からの研磨粒子の離脱作用が低下する。また、200
mg/Lを越えるとHFによるエッチングが必要以上に
進行し、ガラスの表面に微細なエッチングむらが生じ
る。
[0009] The concentration of HF in the cleaning solution is 50 to 200 mg.
/ L. If it is less than 50 mg / L, the etching by HF becomes insufficient, and the action of detaching the abrasive particles from the glass surface is reduced. Also, 200
If the amount exceeds mg / L, the etching with HF proceeds more than necessary, and fine etching unevenness occurs on the surface of the glass.

【0010】[0010]

【発明の実施の形態】図1は本発明に係る洗浄方法を組
み入れたガラス基板の精密洗浄工程の好ましい実施の形
態を示したものであり、予備洗浄工程、1次薬液洗浄工
程、2次薬液洗浄工程、リンス工程、乾燥工程の5工程
からなる。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a preferred embodiment of a precision cleaning process of a glass substrate incorporating a cleaning method according to the present invention, which includes a pre-cleaning process, a primary chemical cleaning process, and a secondary chemical solution. It consists of five steps: a washing step, a rinsing step, and a drying step.

【0011】予備洗浄工程では、基板カセット14に収
容したガラス基板12を予備洗浄槽16内の純水17に
浸漬し、超音波発生装置18から照射した超音波により
超音波洗浄する。洗浄時には純水17を洗浄槽16の下
部から連続的に補充し、補充した分だけ槽上部のトラフ
19から越流させることによって純水17を更新し、そ
の清浄度を維持する。
In the pre-cleaning step, the glass substrate 12 housed in the substrate cassette 14 is immersed in pure water 17 in a pre-cleaning tank 16 and subjected to ultrasonic cleaning by ultrasonic waves emitted from an ultrasonic generator 18. At the time of cleaning, the pure water 17 is continuously replenished from the lower part of the cleaning tank 16, and the pure water 17 is renewed by flowing over the replenished amount from the trough 19 at the upper part of the tank to maintain the cleanliness.

【0012】上記の予備洗浄工程によってガラス基板表
面に付着した研磨粒子を粗取りした後、本発明に係る1
次薬液洗浄工程に移る。この工程では、予備洗浄後のガ
ラス基板12を前記基板カセット14に収容した状態で
1次薬液洗浄槽20内の洗浄液21に浸漬し、超音波発
生装置22からの超音波により超音波洗浄する。超音波
発生装置22から発生させる超音波の周波数は35〜6
0kHzの範囲に選択することが好ましい。洗浄液21
は、前記したように50〜200mg/LのHFと5m
g/L以上のオゾンを溶存した溶液を用いる。洗浄液2
1は予め調合されたものを購入して使用すると簡便であ
る。しかし、溶存オゾンは時間の経過と共に濃度が低下
し易いので、好ましくは調合装置によって調合したもの
を直接に洗浄槽に供給する。この洗浄液21を洗浄時に
は洗浄槽20の下部から連続的に補充し、補充した分だ
け槽上部のトラフ23から越流させることによって、洗
浄液21の濃度と清浄度を維持する。なお、トラフ23
から越流した洗浄液21を再度、1次薬液洗浄槽20に
戻し、図示しない制御手段によってHFとオゾンの濃度
が所定の範囲内となるように制御すると、洗浄液21の
使用量を節減することができる。この1次薬液洗浄工程
によってガラス表面に付着した研磨粒子の大部分がガラ
ス表面から離脱する。しかしながら、一旦剥離した研磨
粒子がガラス表面に再付着する現象もあって、ガラス基
板には相当数の研磨粒子が残存付着している。このた
め、次段の2次薬液洗浄工程を実施する。
After the abrasive particles adhering to the surface of the glass substrate are roughly removed by the above-described pre-cleaning step, the polishing method according to the present invention is applied.
Move on to the next chemical cleaning step. In this step, the pre-cleaned glass substrate 12 is immersed in the cleaning liquid 21 in the primary chemical liquid cleaning tank 20 while being housed in the substrate cassette 14, and is ultrasonically cleaned by ultrasonic waves from the ultrasonic generator 22. The frequency of the ultrasonic wave generated from the ultrasonic generator 22 is 35 to 6
It is preferable to select in the range of 0 kHz. Cleaning liquid 21
Is 50 to 200 mg / L HF and 5 m
A solution in which g / L or more of ozone is dissolved is used. Cleaning liquid 2
For convenience, it is convenient to purchase and use a pre-mixed product. However, since the concentration of dissolved ozone tends to decrease with the passage of time, it is preferable to directly supply the dissolved ozone to the washing tank by using a compounding device. During cleaning, the cleaning liquid 21 is continuously replenished from the lower part of the cleaning tank 20, and the replenishment is allowed to flow from the trough 23 in the upper part of the tank to maintain the concentration and the cleanliness of the cleaning liquid 21. The trough 23
When the cleaning liquid 21 which has overflowed from the tank is returned to the primary chemical cleaning tank 20 again and the control means (not shown) controls the concentrations of HF and ozone to fall within a predetermined range, the amount of the cleaning liquid 21 used can be reduced. it can. Most of the abrasive particles adhered to the glass surface by the first chemical liquid washing step are separated from the glass surface. However, there is also a phenomenon in which the abrasive particles that have been peeled off once again adhere to the glass surface, and a considerable number of the abrasive particles remain and adhere to the glass substrate. For this reason, the next-stage secondary chemical cleaning step is performed.

【0013】2次薬液洗浄工程では、1次薬液洗浄後の
ガラス基板12を前記基板カセット14に収容した状態
で2次薬液洗浄槽24内の洗浄液25に浸漬し、超音波
発生装置27からの超音波により超音波洗浄する。洗浄
液25としてはふっ化アンモニウム水溶液又はアンモニ
ア水等の溶液が好ましく用いられる。すなわち、これら
の洗浄液はpHが中性又はアルカリ性であり、浸漬した
ガラス基板や研磨粒子の表面のゼータ電位が共に負とな
る。このため、負に帯電したガラス基板や研磨粒子が電
気的に反発し合うので、再付着が起き難い。特に洗浄液
25として濃度が0.5%程度のふっ化アンモニウム水
溶液を用いた場合にはガラス表面に対して微量のエッチ
ング作用があり、より一層ガラス表面に残存した研磨粒
子の離脱作用が促進する。この洗浄液25を洗浄時には
洗浄槽24の下部から連続的に補充し、補充した分だけ
槽上部のトラフ28から越流させることによって、洗浄
液25の濃度と清浄度を維持する。
In the secondary chemical cleaning step, the glass substrate 12 after the primary chemical cleaning is accommodated in the substrate cassette 14 and immersed in a cleaning liquid 25 in a secondary chemical cleaning tank 24. Ultrasonic cleaning with ultrasonic waves. As the cleaning liquid 25, a solution such as an aqueous solution of ammonium fluoride or aqueous ammonia is preferably used. That is, the pH of these cleaning solutions is neutral or alkaline, and the zeta potential of the surfaces of the immersed glass substrate and the abrasive particles is both negative. For this reason, the negatively charged glass substrate and the abrasive particles repel each other, so that re-adhesion hardly occurs. In particular, when an aqueous solution of ammonium fluoride having a concentration of about 0.5% is used as the cleaning liquid 25, a slight amount of etching action is exerted on the glass surface, and the action of removing abrasive particles remaining on the glass surface is further promoted. During cleaning, the cleaning liquid 25 is continuously replenished from the lower portion of the cleaning tank 24, and the replenishment is allowed to flow over the trough 28 in the upper part of the tank, thereby maintaining the concentration and cleanliness of the cleaning liquid 25.

【0014】リンス工程では、前記2次薬液洗浄槽24
から引き上げた基板カセット14を先ずリンス槽26内
の純水32に所定時間浸漬する。リンス槽26の構造は
前記予備洗浄槽16や薬液洗浄槽20、24と同様であ
り、超音波発生装置29からの超音波により超音波洗浄
し、ガラス基板12に付着している前記洗浄液25を洗
い流す。
In the rinsing step, the secondary chemical cleaning tank 24
First, the substrate cassette 14 pulled up from the container is immersed in pure water 32 in the rinsing tank 26 for a predetermined time. The structure of the rinsing tank 26 is the same as that of the pre-cleaning tank 16 and the chemical liquid cleaning tanks 20 and 24. The rinsing tank 26 is ultrasonically cleaned by ultrasonic waves from an ultrasonic generator 29 to remove the cleaning liquid 25 adhered to the glass substrate 12. Wash off.

【0015】次の乾燥工程では、リンス槽26から引き
上げた基板カセット14を乾燥ボックス33に入れ、公
知の手段によってガラス基板12に付着している純水を
除去する。この乾燥工程によって一連の精密洗浄が完了
する。以上の各工程を例えばタクトタイム3分で順次実
行することによって表面に研磨粒子や洗浄液がほとんど
残存しないガラス基板を得ることができる。
In the next drying step, the substrate cassette 14 pulled up from the rinsing tank 26 is placed in a drying box 33, and pure water adhering to the glass substrate 12 is removed by a known means. This drying process completes a series of precision cleaning. By sequentially performing each of the above steps, for example, with a tact time of 3 minutes, a glass substrate with almost no abrasive particles or cleaning liquid remaining on the surface can be obtained.

【0016】なお、本発明に係る洗浄液はガラス基板を
浸漬して洗浄する際の洗浄液としてだけではなく、例え
ばブラシ等を用いてスクラビング洗浄する際の洗浄液と
しても有用である。
The cleaning liquid according to the present invention is useful not only as a cleaning liquid when immersing and cleaning a glass substrate, but also as a cleaning liquid when performing scrubbing cleaning using a brush or the like.

【0017】[0017]

【実験例1】2.5インチの磁気ディスク用ソーダガラ
ス基板を研磨砥粒で研磨して、その表面に研磨粒子が付
着したガラス基板を供試材とした。この時の研磨条件
は、研磨砥粒として粒径0.4〜0.8μmの酸化セリウ
ムを用い、この酸化セリウムを純水に10重量%で懸濁
させたものを研磨液とした。この研磨液を用いて研磨装
置により研磨圧力75gf/cm2、テーブル回転数4
0rpmの条件で、10分間研磨した。研磨後のガラス
基板を室温の純水を用いて超音波洗浄し、試験サンプル
とした。
EXPERIMENTAL EXAMPLE 1 A 2.5 inch soda glass substrate for a magnetic disk was polished with abrasive grains, and a glass substrate having abrasive particles adhered to its surface was used as a test material. The polishing conditions at this time were: cerium oxide having a particle size of 0.4 to 0.8 μm was used as polishing abrasive grains, and cerium oxide suspended in pure water at 10% by weight was used as a polishing liquid. Using this polishing liquid, a polishing pressure of 75 gf / cm 2 and a table rotation speed of 4 were obtained by a polishing apparatus.
Polishing was performed at 0 rpm for 10 minutes. The polished glass substrate was subjected to ultrasonic cleaning using pure water at room temperature to obtain a test sample.

【0018】上記の試験サンプルに対して,HFとオゾ
ンを溶存する洗浄液を用いて超音波洗浄する際の、HF
濃度が除去特性に及ぼす影響を調べた。実験の条件は、
洗浄液中の溶存オゾンの濃度を10mg/Lと一定に
し、HF濃度を0〜500mg/Lの範囲内で変化させ
た。液温が15℃の洗浄液に試験サンプルを浸漬し、3
分間超音波洗浄した。この時の超音波の周波数を45k
Hzとした。
When the test sample is subjected to ultrasonic cleaning using a cleaning solution in which HF and ozone are dissolved,
The effect of concentration on removal characteristics was investigated. The experimental conditions were
The concentration of dissolved ozone in the washing solution was kept constant at 10 mg / L, and the HF concentration was changed within the range of 0 to 500 mg / L. The test sample is immersed in a cleaning solution having a temperature of 15 ° C.
Ultrasonic cleaning for minutes. The frequency of the ultrasonic wave at this time is 45k
Hz.

【0019】除去性能の評価は、洗浄完了後の試験サン
プルを200倍の顕微鏡で観察し、除去されずに残留し
ている粒径が約0.3μm以上の粒子の個数を目視で計
数した。また、エッチングむらについては、試験サンプ
ルの表面粗さを原子間力顕微鏡で測定し、各試験サンプ
ルの表面平均粗さ(Ra)を求めた。
The removal performance was evaluated by observing the test sample after washing with a microscope of 200 times magnification and visually counting the number of particles having a particle size of about 0.3 μm or more that had not been removed and remained. Regarding the etching unevenness, the surface roughness of the test sample was measured with an atomic force microscope, and the surface average roughness (Ra) of each test sample was determined.

【0020】以上に述べた条件で行った実験の結果を図
2及び図3に示す。図2において横軸は洗浄液中のHF
濃度、縦軸はガラス基板一枚当たりに残留している粒子
の個数を示す。図2から明らかなように、HF濃度が5
0mg/L以上では残留粒子数が500個/基板以下と
なり、良好な洗浄性能を示す。HF濃度が50mg/L
未満であると除去性能がが低下する。
FIGS. 2 and 3 show the results of an experiment conducted under the above-described conditions. In FIG. 2, the horizontal axis represents HF in the cleaning solution.
The concentration and the vertical axis indicate the number of particles remaining per glass substrate. As is clear from FIG.
At 0 mg / L or more, the number of residual particles is 500 particles / substrate or less, indicating good cleaning performance. HF concentration is 50mg / L
If it is less than this, the removal performance will decrease.

【0021】図3において横軸は洗浄液中のHF濃度、
縦軸は試験サンプルの洗浄後の表面平均粗さと洗浄前の
表面平均粗さとの比を示す。図3から明らかなように、
HF濃度が200mg/L以下では表面平均粗さ比は1
以下であり、洗浄によってより一層滑らかな表面を形成
できる。HF濃度が200mg/Lを越えると表面平均
粗さ比は1以上となり、エッチングが必要以上に進行し
て、エッチングむらが生じたことが判る。
In FIG. 3, the horizontal axis represents the HF concentration in the cleaning solution,
The vertical axis indicates the ratio between the surface average roughness of the test sample after cleaning and the surface average roughness before cleaning. As is clear from FIG.
When the HF concentration is 200 mg / L or less, the surface average roughness ratio is 1
That is, the smoother surface can be formed by washing. When the HF concentration exceeds 200 mg / L, the surface average roughness ratio becomes 1 or more, and it can be seen that the etching proceeds more than necessary and uneven etching occurs.

【0022】[0022]

【実験例2】HFとオゾンを溶存する洗浄液を用いて洗
浄する際の、オゾン濃度が除去特性に及ぼす影響を調べ
た。洗浄液中のHF濃度を100mg/Lと一定にし、
オゾン濃度を0〜40mg/Lの範囲内で変化させた。
これ以外の実験条件は試験サンプルを始めとして、すべ
て前記実験例1と同一の条件で行った。
[Experimental Example 2] The effect of ozone concentration on removal characteristics during cleaning using a cleaning solution containing HF and ozone dissolved therein was examined. The HF concentration in the washing solution was kept constant at 100 mg / L,
The ozone concentration was changed within the range of 0 to 40 mg / L.
All other experimental conditions, including the test sample, were performed under the same conditions as in Experimental Example 1.

【0023】以上に述べた条件で行った実験の結果を図
4に示す。図4において横軸は洗浄液中のオゾン濃度、
縦軸はガラス基板一枚当たりに残留していた粒子の個数
を示す。図4から明らかなように、オゾン濃度が5mg
/L以上では残留粒子数が500個/基板以下となり、
良好な洗浄性能を示す。オゾン濃度が5mg/L未満で
あると粒子の除去性能がが低下する。また、オゾン濃度
を20mg/L以上としても洗浄性能は向上しない。
FIG. 4 shows the results of an experiment conducted under the conditions described above. In FIG. 4, the horizontal axis is the ozone concentration in the cleaning liquid,
The vertical axis indicates the number of particles remaining per glass substrate. As is clear from FIG.
/ L or more, the number of residual particles is 500 particles / substrate or less,
Shows good cleaning performance. If the ozone concentration is less than 5 mg / L, the performance of removing particles is reduced. Further, even if the ozone concentration is 20 mg / L or more, the cleaning performance is not improved.

【0024】[0024]

【実験例3】実験例1で用いた試験サンプルと同一の試
験サンプルに対して表1に示した洗浄液によって1次洗
浄した後、2次洗浄を行う試験1〜8を実施した。各試
験での洗浄時間は各洗浄毎に3分とし、この時の超音波
の周波数をいずれも45kHzとした。試験1〜8の
内、試験1〜4は本発明に係る試験、試験5〜8は本発
明以外の方法に係る試験である。
[Experimental Example 3] Tests 1 to 8 in which the same test sample as that used in Experimental Example 1 was subjected to primary cleaning with the cleaning liquid shown in Table 1 and then to secondary cleaning were performed. The cleaning time in each test was 3 minutes for each cleaning, and the frequency of the ultrasonic wave at this time was 45 kHz. Of Tests 1 to 8, Tests 1 to 4 are tests according to the present invention, and Tests 5 to 8 are tests according to methods other than the present invention.

【0025】[0025]

【表1】 [Table 1]

【0026】上記の試験1〜8の各試験サンプルについ
て、実験例1と同一の方法で除去されずに残留している
粒径が約0.3μm以上の粒子の個数を目視で計数し
た。また、エッチングむらについては、試験サンプルの
最大高さ(Rmax)を表面粗さ計で測定した。各試験
の各洗浄後の試験サンプルの残留粒子数(N)と最大高
さ(Rmax)を表2に示す。
With respect to each of the test samples 1 to 8 described above, the number of particles having a particle size of about 0.3 μm or more remaining without being removed in the same manner as in Experimental Example 1 was visually counted. Regarding the etching unevenness, the maximum height (Rmax) of the test sample was measured by a surface roughness meter. Table 2 shows the number of residual particles (N) and the maximum height (Rmax) of the test sample after each washing in each test.

【0027】[0027]

【表2】 [Table 2]

【0028】表2から明らかなように、本発明に係る試
験1〜4試験サンプルの残留粒子数(N)は、いずれの
場合も30個以下であり、ガラス基板から研磨粒子を効
果的に除去することができた。また、最大高さ(Rma
x)も10nm以下であり、エッチングむらが認められ
なかった。一方、本発明以外の方法に係る試験5〜8の
2次洗浄後における結果は、研磨粒子の除去効果又は最
大高さ(Rmax)のすくなくとも一方が本発明に係る
方法に比べて悪い値を示した。
As is clear from Table 2, the number of residual particles (N) of the test samples 1 to 4 according to the present invention is 30 or less in each case, and the abrasive particles are effectively removed from the glass substrate. We were able to. In addition, the maximum height (Rma
x) was 10 nm or less, and no etching unevenness was observed. On the other hand, the results after the secondary cleaning in Tests 5 to 8 according to the method other than the present invention show that at least one of the removal effect of the abrasive particles or the maximum height (Rmax) shows a worse value than the method according to the present invention. Was.

【0029】[0029]

【実験例4】試験サンプルの原材料として、ソーダガラ
ス基板に換えてアルミノシリケート基板やセラミックガ
ラス基板を用いた前記各実験と同様の実験をスポット的
に行った。その結果、前記各実験と同様の結果が得られ
た。
[Experimental Example 4] The same experiments as the above-described experiments using an aluminosilicate substrate or a ceramic glass substrate instead of a soda glass substrate as a raw material of a test sample were performed in a spot manner. As a result, the same results as those in the above experiments were obtained.

【0030】[0030]

【発明の効果】本発明に係るガラス基板の洗浄液及び洗
浄方法によれば、ガラス表面に研磨粒子が付着したガラ
ス基板から前記研磨粒子を効果的に洗浄除去することが
でき、しかもエッチングむらも生じることがない。
According to the glass substrate cleaning solution and the cleaning method of the present invention, the abrasive particles can be effectively removed from the glass substrate having the abrasive particles adhered to the glass surface, and the etching unevenness also occurs. Nothing.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明を実施するための洗浄工程を示す説明図
である。
FIG. 1 is an explanatory view showing a cleaning step for carrying out the present invention.

【図2】実験例1の実験結果を示す第1のグラフであ
る。
FIG. 2 is a first graph showing experimental results of Experimental Example 1.

【図3】実験例1の実験結果を示す第2のグラフであ
る。
FIG. 3 is a second graph showing experimental results of Experimental Example 1.

【図4】実験例2の実験結果を示すグラフである。FIG. 4 is a graph showing experimental results of Experimental Example 2.

【符号の説明】[Explanation of symbols]

12……ガラス基板 14……基板カセット 20……1次薬液洗浄槽 21……洗浄液 22……超音波発生装置 24……2次薬液洗浄槽 25……洗浄液 27……超音波発生装置 12 Glass substrate 14 Substrate cassette 20 Primary chemical cleaning tank 21 Cleaning liquid 22 Ultrasonic generator 24 Secondary chemical cleaning tank 25 Cleaning liquid 27 Ultrasonic generator

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 3B201 AA03 AB44 BB04 BB05 BB85 BB89 BB93 BB98 CA01 CB15 CC01 CC11 CC21 4H003 BA12 DA15 DB01 DC04 EA05 EA21 EA22 EA23 EA31 ED02 ──────────────────────────────────────────────────続 き Continued on the front page F-term (reference) 3B201 AA03 AB44 BB04 BB05 BB85 BB89 BB93 BB98 CA01 CB15 CC01 CC11 CC21 4H003 BA12 DA15 DB01 DC04 EA05 EA21 EA22 EA23 EA31 ED02

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】50〜200mg/Lのふっ化水素と5m
g/L以上のオゾンを溶存したことを特徴とするガラス
基板の洗浄液。
(1) 50 to 200 mg / L of hydrogen fluoride and 5 m
g / L or more ozone dissolved in a glass substrate cleaning solution.
【請求項2】ガラス表面に研磨粒子が付着したガラス基
板から前記研磨粒子を洗浄除去するガラス基板の洗浄方
法であって、前記ガラス基板を請求項1に記載の洗浄液
中に浸漬し超音波洗浄することを特徴とするガラス基板
の洗浄方法。
2. A method for cleaning a glass substrate, comprising removing the abrasive particles from a glass substrate having abrasive particles adhered to the glass surface, wherein the glass substrate is immersed in the cleaning liquid according to claim 1 for ultrasonic cleaning. A method of cleaning a glass substrate.
【請求項3】ガラス表面に研磨粒子が付着したガラス基
板から前記研磨粒子を洗浄除去するガラス基板の洗浄方
法であって、前記ガラス基板を請求項1に記載の洗浄液
中に浸漬し超音波洗浄した後に、前記ガラス基板をふっ
化アンモニウム水溶液又はアルカリ溶液に浸漬し超音波
洗浄することを特徴とするガラス基板の洗浄方法。
3. A method for cleaning a glass substrate, comprising washing and removing the abrasive particles from a glass substrate having abrasive particles adhered to the glass surface, wherein the glass substrate is immersed in the cleaning liquid according to claim 1 for ultrasonic cleaning. Cleaning the glass substrate by immersing the glass substrate in an aqueous solution of ammonium fluoride or an alkaline solution and performing ultrasonic cleaning.
JP2000095072A 2000-03-30 2000-03-30 Cleaning-fluid for glass substrate and method for cleaning glass substrate Pending JP2001276759A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000095072A JP2001276759A (en) 2000-03-30 2000-03-30 Cleaning-fluid for glass substrate and method for cleaning glass substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000095072A JP2001276759A (en) 2000-03-30 2000-03-30 Cleaning-fluid for glass substrate and method for cleaning glass substrate

Publications (1)

Publication Number Publication Date
JP2001276759A true JP2001276759A (en) 2001-10-09

Family

ID=18610023

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP2001276759A (en)

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CN103313804A (en) * 2011-01-18 2013-09-18 电气化学工业株式会社 Ultrasonic cleaning method and apparatus
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