JP2004106094A - Polishing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polishing device preventing a flaw formed on a working surface by removing abnormal matters such as cutting chips attached to a tool surface, stabilizing the removal depth (removing amount) by fixing the amount of abrasive grains present on the surface of the tool and working fluid present in a working point, and providing a highly precise working. <P>SOLUTION: A cleaning means 20 of this polishing device 10 is provided with a brush 21, a means 22 feeding the working fluid, and a means 23 sucking the working liquid from the brush 21. The working fluid suction means 23 has a sufficient suction force for sucking the fed amount of the working fluid, and the width of a part contacting with the polishing tool 1 of the brush 21 is set to the width or more where the polishing tool 1 contacts with the workpiece and is engaged in the working. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a polishing apparatus, and more particularly to a polishing apparatus for performing ultra-precision polishing of an optical element or the like.
[0002]
[Prior art]
In polishing performed by load control, the relationship between the removal amount and the processing conditions is determined according to Preston's rule of thumb. Preston's rule of thumb can be expressed as follows:
δ = k × P × V × t (δ; removal amount, k; proportional constant, P; pressure, V; relative speed between tool and machining point (tool peripheral speed), t; residence time)
In the present invention, δ may be considered as the removal depth and P may be considered as the load.
[0003]
2. Description of the Related Art In high-precision processing such as processing of an optical element or the like in recent years, a removal depth accuracy of a level of several nm to several tens nm is desired.
[0004]
An example of a high-precision workpiece is an X-ray mirror, but the final processing step is polishing by load control. It is a situation where the desired accuracy is finally achieved over time.
[0005]
As a conventional method and apparatus for cleaning a grindstone, for example, a dressing action by removing grinding debris adhered to the grindstone using a conductive brush has been expected. This is intended to perform stable processing by performing grinding while maintaining the grindstone surface clean (for example, see Patent Document 1).
[0006]
In other words, at the same time as the grinding operation of the grinding wheel, a cleaning method that does not hinder the productivity by performing an efficient dressing action on the grinding wheel surface to which the grinding debris has adhered in an in-process state without generating dirt is provided. Trying to.
[0007]
Specifically, the brush portion of the conductive brush is slid on the grindstone while the workpiece is being ground to remove grinding debris that adheres between the abrasive grains of the grindstone, and at the same time, a weak current is applied to the brush to remove the grinding debris. Electrolytically peel off and remove, or remove the grinding debris by applying a strong current to cause a discharge action with the grindstone surface, or apply ultrasonic waves to the brush with an ultrasonic vibrator to apply grinding debris Is removed, or one of them is selected.
[0008]
Further, in the conventional polishing apparatus, solid components in the polishing agent, SiO2 and metal removed by polishing from the SiO2 insulating film and the metal electrode film, and polishing debris such as fragments of the polishing pad are deposited on the concave portion of the polishing pad surface. There was a problem to do. When a large amount of the deposited abrasive and polishing debris collects, they agglomerate to form a large lump, and when these lumps are caught between the wafer and the polishing pad during polishing, they cause scratches.
[0009]
Therefore, conventionally, in order to solve the problem of the deposits of these polishing agents and polishing debris, a polishing apparatus that cleans the polishing agent and polishing debris deposited on the concave portion of the polishing pad surface with a brush and prevents scratches during polishing is provided. (For example, see Patent Document 2).
[0010]
Specifically, the polishing apparatus is provided with a mechanism for spraying a polishing agent, such as a nylon brush or a jet of water, for discharging abrasives accumulated in recesses on the surface of the polishing pad or polishing debris. The generation of scratches on the polished surface due to the accumulation of dust is prevented.
[0011]
There is also a polishing apparatus provided with a tool surface cleaning mechanism and a machining fluid recovery mechanism to remove foreign substances and the like attached to the machining surface of the tool (for example, see Patent Document 3). This equipment performs polishing while cleaning the tool with a cleaning brush, and supplies cleaning liquid to the cleaning brush to remove foreign matter from the processing surface of the tool and perform high quality polishing. A cleaning brush is pressed against the surface, and the rotation of the tool causes the cleaning brush to remove foreign matter such as chips from the surface of the tool. Further, the polishing apparatus appropriately supplies a cleaning liquid to the cleaning brush.
[0012]
[Patent Document 1]
Japanese Patent Application Laid-Open No. H5-131367 [Patent Document 2]
JP-A-11-333695 [Patent Document 3]
JP 2001-170864 A
[Problems to be solved by the invention]
Certainly, according to this apparatus, foreign matter including debris adhered to the tool surface can be removed. However, even with this device, the removal depth (removal amount) is stabilized by keeping the amount of abrasive grains present on the tool surface constant and the amount of the working fluid present at the processing point constant. The proportional constant k of Preston's rule of thumb cannot be stabilized.
[0014]
Therefore, in the present invention, by removing foreign matter such as cutting chips attached to the tool surface, it is possible to prevent scratches generated on the machined surface, and to reduce the amount of abrasive grains present on the tool surface and the working fluid present at the machining point. It is an object of the present invention to provide a polishing apparatus that can stabilize the removal depth (removal amount) by making the amount constant, and, consequently, enable more accurate processing.
[0015]
[Means for Solving the Problems]
To achieve the above object, according to the first aspect of the present invention, a polishing apparatus is a polishing apparatus having cleaning means for cleaning a polishing tool, wherein the cleaning means contacts a polishing tool. Means for directly cleaning the polishing tool by hand, means for supplying the working fluid, and means for sucking the working fluid from the means for directly cleaning the polishing tool, wherein the means for sucking the working fluid is provided by the supplied working fluid. Characterized in that it has a sufficient suction force for sucking the water.
[0016]
According to the second aspect of the present invention, in the polishing apparatus, the means for directly cleaning the polishing tool in contact with the polishing tool is the polishing apparatus according to the first aspect, wherein a portion in contact with the polishing tool is an elastic body. It is a feature.
[0017]
According to the third aspect of the present invention, in the polishing apparatus, the width of the portion of the elastic body that contacts the polishing tool is equal to or larger than the width of the polishing tool that contacts the workpiece and participates in the processing. It is a polishing apparatus.
[0018]
According to a fourth aspect of the present invention, the polishing apparatus is the polishing apparatus according to the second or third aspect, wherein the elastic body has a brush shape.
[0019]
According to the fifth aspect of the present invention, the polishing apparatus is the polishing apparatus according to the fourth aspect, wherein at least a part of the plurality of bristles of the brush-like elastic body is in contact with each other. .
[0020]
According to a sixth aspect of the present invention, in the polishing apparatus according to the fourth or fifth aspect, the brush-like elastic body is obtained by planting hair on a cylindrical member. Things.
[0021]
According to the invention as set forth in claim 7, in the polishing apparatus, the bristles of the brush-like elastic body have a diameter smaller than the average value of the width of the concave portion existing on the surface of the polishing tool. The polishing apparatus is characterized in that:
[0022]
According to the invention as set forth in claim 8, in the polishing apparatus, the brush-shaped elastic body has no gap between the hairs when viewed from the direction of relative movement with the polishing tool during cleaning. 8. The polishing apparatus according to any one of items 1 to 7.
[0023]
According to a ninth aspect of the present invention, the polishing apparatus is the polishing apparatus according to the second or third aspect, wherein the elastic body has a sponge shape.
[0024]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, an embodiment of a polishing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.
[0025]
FIG. 1 shows an overall view of a polishing apparatus in one embodiment of the polishing apparatus according to the present invention. The polishing apparatus 10 includes a tool 1, a tool shaft 2, a linear slide (spindle) 3, a load sensor 4, a load generating mechanism 5, and a column 6.
[0026]
As shown in FIG. 1, the tool 1 has a rotating tire shape, a spherical shape, a shape composed of a part of those shapes, a disk shape, or a cylindrical shape, and is fixed to a spindle 3 which also serves as a linear slide. I have. The rotated tool 1 comes into contact with the workpiece 7 placed on the three-axis linear motion table 8 and grinds the workpiece 7 in the following manner.
[0027]
The load generating mechanism 5 applies a predetermined load to the linear slide 3, and the load is transmitted to the tool 1, and a load is generated between the tool 1 and the processing surface of the processing portion 7.
[0028]
The generated load is detected by the load sensor 4, and a command is issued from a control unit (not shown), for example, a personal computer, to the load generating mechanism unit 5 so that the load becomes a predetermined load.
[0029]
The workpiece 7 is so-called that the normal line of the workpiece surface coincides with the direction of the tool load by the movement of the X axis, the Y axis, the Z axis, and the A axis and the B axis of the rotation axes parallel to the X axis and the Y axis. Normal control is possible.
[0030]
A sensor for detecting a tangential force is provided in the spindle 3 which also serves as a linear slide.
[0031]
FIG. 2 shows an image diagram of an error between the designed shape and the shape measurement result before polishing of the surface to be processed.
[0032]
As shown in FIG. 2, there is an error between the desired design shape and the shape measurement result of the surface to be processed before polishing, and the removal amount or the removal depth at each processing point is determined from the error.
[0033]
Before processing a target surface to be processed, it is necessary to grasp in advance the relationship between the removal amount or the removal depth and the processing condition by processing the same material as the surface to be processed. For this relationship, Preston's empirical rule as shown in the following equation is conventionally known.
[0034]
δ = k × P × V × t (δ; removal amount, k; proportionality constant, P; pressure, V; relative speed between tool and processing point (tool peripheral speed), t; residence time)
In the present invention, δ may be considered as the removal depth and P may be considered as the load.
[0035]
Generally, the proportional constant k is a constant determined by the material of the workpiece and the tool. When P, V, and t are set as the processing conditions and the k is constant in the processing, the removal depth is uniquely determined. That is, the removal depth can be accurately obtained by stabilizing k.
[0036]
As described above, k is said to be a constant determined by the material of the workpiece and the tool, but the material of the tool should be selected so as not to change as much as possible during processing, and urethane resin or the like is used. I have.
[0037]
Also, the amount of abrasive grains, chips, and machining liquid (here, liquid used for lubrication and cooling, but the liquid may contain abrasive grains) present on the surface of the tool When k changes, k changes. That is, the removal depth changes.
[0038]
FIG. 3 is a side view of a cleaning mechanism in one embodiment of the polishing apparatus according to the present invention.
[0039]
The polishing apparatus according to the present invention is provided with a cleaning mechanism as shown in FIG. 3 in order to stabilize the amount of abrasive grains, chips, and machining liquid existing on the tool surface as described above.
However, this is only an example, and the present invention is not limited to this diagram.
[0040]
On the premise of the above, a first example of an embodiment of the polishing apparatus according to the present invention will be described below.
[0041]
In this embodiment, the cleaning mechanism shown in FIG. 3 is installed in the processing apparatus shown in FIG. 1 to polish martensitic stainless steel.
[0042]
Prior to the actual polishing, a martensitic stainless steel was polished in a state where the cleaning mechanism shown in FIG. 3 was removed while supplying a working fluid containing abrasive grains after truing a polishing tool made of urethane resin having pores.
[0043]
FIG. 4 is a table showing the relationship between the polishing distance and the removal depth. The horizontal axis is the polishing distance (mm), and the vertical axis is the removal depth (nm).
As shown in FIG. 4, as the polishing distance (the length of the tool path from the start point) increases, the removal depth increases, and thereafter, the removal depth becomes stable. This state is a state where sufficient abrasive grains are supplied to the polishing tool surface.
[0044]
In this embodiment, the same material as the work material to be polished was polished in order to make a state in which sufficient abrasive grains were supplied to the polishing tool surface. May be rubbed.
However, the method of the present embodiment is optimal for obtaining high accuracy.
[0045]
Next, actual cleaning is performed by setting the cleaning mechanism of FIG. In FIG. 3, the cleaning mechanism 20 includes a cleaning brush 21 (hereinafter, referred to as a brush 21), a processing liquid supply unit 22, and a processing liquid suction unit 23.
[0046]
The brush 21 is made of an elastic material and contacts the polishing tool 1 to directly clean the polishing tool 1 as the polishing tool 1 rotates.
The width of the brush 9 that is in contact with the polishing tool 1 is equal to or larger than the width that is in contact with the workpiece of the polishing tool 1 and is involved in the processing. All the areas that come into contact with the processing will be cleaned.
[0047]
The processing liquid supply unit 22 supplies the processing liquid, and the processing liquid suction unit 23 suctions the processing liquid sucked into the bristles of the cleaning brush 21 by a nozzle.
The supply and suction of the processing fluid are performed by a tube connected to the pump. The flow rate of the supply pump is set to 5 cc / min, and the flow rate of the suction pump is set to 8 cc / min. The capacity of the liquid was set to a value higher than sufficient suction.
[0048]
It is desirable that the bristles used for the brush 9 have a high density, because the force for sucking the working fluid with the effect similar to the capillary phenomenon becomes large.
In this embodiment, a brush of a flocking type is used. However, the bristle of the brush exists densely in the flocking hole, and at least a part of the bristle contacts the neighboring bristle outside the hole.
[0049]
FIG. 5 is a sectional view of a flocking hole of a flocking type brush in one embodiment of the polishing apparatus according to the present invention.
[0050]
The rotation of the polishing tool 1 causes the brush 30 and the polishing tool 1 in FIG. 5 to move relatively. The vertical direction in FIG. 5 is the direction of movement, and the bristles of the brush 30 when viewed from that direction. There is no gap between them. That is, the flocking holes are present at positions shifted left and right in FIG.
[0051]
Thereby, when the polishing tool 1 is cleaned, it is possible to prevent a portion that is not cleaned from remaining.
[0052]
The relative movement between the elastic body and the polishing tool is usually caused by the rotation of the polishing tool, but the present invention is not limited to this. The present invention is applicable regardless of whether the elastic body or the polishing tool moves.
[0053]
FIG. 6 is a table showing the relationship between the diameter of the bristles of the brush and the removal accuracy in one embodiment of the polishing apparatus according to the present invention. The horizontal axis is the hair diameter (mm), and the vertical axis is the removal accuracy (3σ / removal depth).
[0054]
Here, the relationship between the thickness of the bristles of the brush as a result of the polishing and the removal accuracy was examined. The variation in the removal depth with respect to the removal depth when a predetermined distance was polished was represented by 3σ, and the value obtained by dividing the value by the removal depth was defined as the removal accuracy. The thickness of the bristles of the brush is preferably 0.05 mm or less, and bristles having a diameter smaller than 0.07 mm, which is the average value of the diameter of the pores present on the tool surface, that is, the width of the concave portion present on the tool surface, are effective. The result was that there was.
[0055]
FIG. 7 is a schematic diagram of cleaning in one embodiment of the polishing apparatus according to the present invention. That is, this figure shows an image of contact between the bristle of the cleaning brush and the surface of the polishing tool.
As shown in the figure, if the brush hair is thin, the hair reaches the concave portion existing on the tool surface, so that effective cleaning can be performed.
[0056]
In other words, at the time of polishing with a porous polishing tool, by using a brush having bristles whose diameter is smaller than the average value of the width of the recesses present on the surface, the hairs penetrate into the recesses on the tool surface. Therefore, it is possible to remove excess abrasive grains, chips, and other foreign matters present in the recesses on the tool surface.
[0057]
Here, not only a porous polishing tool but also a polishing tool having irregularities on its surface are included in this category.
[0058]
Next, a description will be given below of a second example which is an embodiment of the polishing apparatus according to the present invention.
[0059]
In the second embodiment, the same polishing apparatus as that of the first embodiment is used to polish electroless nickel using a polishing tool made of urethane.
[0060]
Prior to actual polishing, after the polishing tool was trued, the electroless nickel was polished with the cleaning mechanism 20 shown in FIG. 3 removed while supplying a processing liquid containing abrasive grains.
[0061]
As in the first embodiment, when the removal depth became constant after the increase, the polishing was terminated, and the cleaning mechanism 20 in FIG. 3 was set. At this stage, sufficient abrasive grains are present on the polishing tool surface.
[0062]
8 and 9 show an example of a brush used in the present embodiment.
[0063]
In this embodiment, instead of the flocking type brush 30 of the first embodiment, first, a brush in which bristles are planted in a cylindrical member as shown in FIG. 8 is employed. That is, in the cleaning mechanism 20 shown in FIG. 3, the cleaning brush 21 is replaced by the brush 40 shown in FIG. 8. Here, the brush 40 shown in FIG. The tube was also connected to the pump (not shown), and the tube was connected to a pump to suck the working fluid.
[0064]
In this state, the electroless nickel work used earlier was polished until the removal depth became constant.
After that, actual polishing was performed. The rotation speed of the polishing tool was 200 rpm, the load was 100 gf, and the abrasive particles were alumina, and polishing was performed by controlling the residence time.
[0065]
There was no extra machining fluid at the machining point on the electroless nickel, and a minimum necessary machining fluid was present. The removal accuracy obtained by polishing was a value of 30 nm or less.
[0066]
Here, a brush as shown in FIG. 9 may be used instead of the brush as shown in FIG.
The brush unit 50 shown in FIG. 9A is obtained by reducing the diameter of the brush 40 shown in FIG. 8, and a plurality of these brushes are collected into an aggregate as shown in FIG. 9B. Used as a cleaning brush 60 as shown. In this case, a tube is also connected to the back of the tubular portion 61 of the bra 60 (the side where the hairs 62 are not planted), and the tube is connected to a pump to suck the working fluid.
[0067]
Next, a third example of one embodiment of the polishing apparatus according to the present invention will be described below.
[0068]
In the third embodiment, electroless nickel is polished using a polishing tool similar to the second embodiment described above, using a polishing tool made of a material obtained by solidifying wood powder with urethane resin.
[0069]
Prior to actual polishing, after the truing of the polishing tool, a paste containing diamond abrasive grains is applied to the entire processing surface, and then the electroless nickel is removed while the cleaning mechanism 20 in FIG. Polished.
[0070]
As in the first embodiment, when the removal depth became constant after the increase, the polishing was terminated, and the cleaning mechanism 20 in FIG. 3 was set.
[0071]
At this stage, sufficient abrasive grains are present on the polishing tool surface. Here, the sponge-like elastic body was replaced with the flocking type brush of the first embodiment, and employed in this embodiment. In this state, the electroless nickel work used earlier was polished until the removal depth became constant.
[0072]
After that, actual polishing was performed. The number of rotations of the polishing tool was 100 rpm, the load was 150 gf, and the abrasives were polished by controlling the residence time as diamond. There was no extra machining fluid at the machining point on the electroless nickel, and a minimum necessary machining fluid was present.
[0073]
Therefore, the paste containing abrasive grains applied to the processing surface in advance by the processing liquid was not washed away before processing, and a required amount of abrasive grains could be supplied. The removal accuracy obtained by polishing was a value of 35 nm or less.
[0074]
【The invention's effect】
According to the first to ninth aspects of the present invention, a mechanism for directly cleaning the polishing tool in contact with the polishing tool removes excess abrasive grains and working fluid, chips, and other foreign substances present on the polishing tool surface. can do. Further, a new working fluid can always be supplied by a mechanism for supplying the working fluid. In addition, a mechanism that sucks the working fluid from the mechanism that directly cleans the polishing tool ensures that excess abrasive grains, chips, and other foreign matter that have been removed together with the working fluid during cleaning are returned to the polishing tool and processing points. Suppress. In addition, the suction force of the machining fluid suction mechanism has the ability to more than adequately suck the supplied machining fluid, making it possible for the machining fluid to contain excess abrasive grains, cutting chips and other foreign matter. Is sufficiently aspirated. As described above, the amounts of the working fluid and the abrasive grains involved in the working can be kept constant, and foreign matter including cuttings can be removed. With these, the removal depth can be stabilized, and high-precision processing can be performed. Further, it is possible to prevent generation of scratches on the processed surface.
[0075]
According to the invention described in any one of claims 2 to 9, since the portion of the mechanism for directly cleaning the polishing tool in contact with the polishing tool is made of an elastic body, the polishing tool can be damaged or deformed. Disappears.
[0076]
According to the third to ninth aspects of the present invention, the width of the elastic body at the portion that comes into contact with the polishing tool is equal to or larger than the width of the polishing tool that comes into contact with the workpiece and is involved in the processing, and therefore, the elastic tool is involved in the processing of the polishing tool. The cleaning of the part to be performed becomes possible.
[0077]
According to the invention as set forth in claims 4 to 8, since the elastic body is in the shape of a brush, the surplus working fluid, abrasive grains, chips, and other foreign substances can be removed by the bristles, so that a scratch on the machined surface occurs. Can be prevented. Further, since the amounts of the abrasive grains and the processing liquid on the tool surface can be kept constant, the removal depth can be stabilized, and high-precision processing can be performed.
[0078]
According to the invention as set forth in claims 5 to 8, since at least a part of the brush-like elastic body is in contact with the adjacent hair, the excess processing liquid is effectively sucked by an effect similar to a capillary phenomenon. be able to.
[0079]
According to the invention as set forth in claims 6 to 8, since the brush-like elastic body has the hair planted in the cylindrical member, the hair portion effectively sucks the excess machining fluid with an effect similar to the capillary phenomenon. At the same time, extra abrasive grains on the tool surface, as well as chips and other foreign matter, can be removed. The processing liquid containing other foreign matter can be removed from the vicinity of the processing point.
[0080]
According to the seventh and eighth aspects of the present invention, the brush-like elastic body has bristles whose diameter is smaller than the average value of the width of the concave portion existing on the surface when the polishing is performed by the porous polishing tool. As a result, the hair can penetrate into the concave portion on the tool surface, so that it is possible to remove extra abrasive grains, chips, and other foreign substances present in the concave portion on the tool surface.
Note that the present invention is not limited to a polishing tool having pores, but can be applied to any polishing tool having an uneven surface.
[0081]
According to the invention described in claim 8, since the elastic body moves relatively to the polishing tool when cleaning the polishing tool, the elastic body rubs against each other. Therefore, cleaning of the polishing tool surface is performed, and it is possible to remove extra abrasive grains and machining liquid, cutting chips, and other foreign substances present on the tool surface. Further, since the elastic body has no gap when viewed from the moving direction, there is no place where the elastic body does not come into contact with the polishing tool surface when the two rub against each other. Therefore, all the parts related to the processing on the polishing tool surface are cleaned.
[0082]
According to the ninth aspect of the present invention, since the elastic body is in the form of a sponge, it is possible to remove excess abrasive grains and machining fluid, cutting chips, and other foreign substances present on the tool surface. In particular, since the water absorption of the working fluid is high, excess working fluid can be effectively removed.
[Brief description of the drawings]
FIG. 1 is an overall view of a processing apparatus in an embodiment of a polishing apparatus according to the present invention.
FIG. 2 is an image diagram of an error between a design shape and a shape measurement result of a surface to be processed before polishing.
FIG. 3 is a side view of a cleaning mechanism in one embodiment of the polishing apparatus according to the present invention.
FIG. 4 is a table showing a relationship between a polishing distance and a removal depth in one embodiment of the polishing apparatus according to the present invention.
FIG. 5 is a sectional view of a flocking hole of a flocking type brush in one embodiment of the polishing apparatus according to the present invention.
FIG. 6 is a table showing a relationship between a diameter of a brush bristle and a removal accuracy in an embodiment of the polishing apparatus according to the present invention.
FIG. 7 is a contact image diagram of bristles of a cleaning brush and a polishing tool surface in an embodiment of the polishing apparatus according to the present invention.
FIG. 8 is a perspective external view of a brush used in an embodiment of the polishing apparatus according to the present invention.
FIG. 9 is a perspective external view of a brush used in an embodiment of the polishing apparatus according to the present invention.
[Explanation of symbols]
1 tool (polishing tool)
2 Tool axis 3 Linear slide (spindle)
Reference Signs List 4 Load sensor 5 Load generating mechanism 6 Column 7 Workpiece 8 3-axis linear motion table 10 Polishing device 20 Cleaning mechanism 21, 30, 40, 50, 60 Cleaning brush (brush)
22 Working fluid supply unit 23 Working fluid suction units 41, 51, 61 Tubular portions 42, 52, 62 Bristle

Claims (9)

A polishing apparatus having cleaning means for cleaning a polishing tool,
The cleaning means includes:
Means for contacting the polishing tool and directly cleaning the polishing tool;
Means for supplying a working fluid,
Means for sucking the working fluid from means for directly cleaning the polishing tool,
The means for sucking the working fluid,
A polishing apparatus having a suction force sufficient to suck the supplied working fluid. Means for directly cleaning the polishing tool in contact with the polishing tool,
2. The polishing apparatus according to claim 1, wherein a portion contacting the polishing tool is an elastic body. The width of the portion of the elastic body that contacts the polishing tool,
3. The polishing apparatus according to claim 2, wherein the polishing tool has a width equal to or larger than a width involved in processing by contacting a work material. The elastic body is
The polishing apparatus according to claim 2, wherein the polishing apparatus has a brush shape. The polishing apparatus according to claim 4, wherein at least a part of the plurality of bristles of the brush-like elastic body is in contact with each other. The brush-like elastic body,
The polishing apparatus according to claim 4, wherein hair is planted on a cylindrical member. The bristles of the brush-like elastic body have
7. The polishing apparatus according to claim 4, wherein the diameter is smaller than the average value of the width of the concave portion existing on the surface of the polishing tool. The brush-like elastic body,
The polishing apparatus according to any one of claims 4 to 7, wherein there is no gap between the hairs when viewed from a direction of relative movement with respect to the polishing tool during the cleaning. The elastic body is
The polishing apparatus according to claim 2, wherein the polishing apparatus has a sponge shape.

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