JP2000022105A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JP2000022105A JP2000022105A JP10183692A JP18369298A JP2000022105A JP 2000022105 A JP2000022105 A JP 2000022105A JP 10183692 A JP10183692 A JP 10183692A JP 18369298 A JP18369298 A JP 18369298A JP 2000022105 A JP2000022105 A JP 2000022105A
- Authority
- JP
- Japan
- Prior art keywords
- film
- forming
- dielectric
- dielectric film
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/682—Capacitors having no potential barriers having dielectrics comprising perovskite structures
- H10D1/684—Capacitors having no potential barriers having dielectrics comprising perovskite structures the dielectrics comprising multiple layers, e.g. comprising buffer layers, seed layers or gradient layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/692—Electrodes
Landscapes
- Semiconductor Memories (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10183692A JP2000022105A (ja) | 1998-06-30 | 1998-06-30 | 半導体装置の製造方法 |
| US09/291,306 US6403441B1 (en) | 1998-06-30 | 1999-04-15 | Method for fabricating storage capacitor using high dielectric constant material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10183692A JP2000022105A (ja) | 1998-06-30 | 1998-06-30 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000022105A true JP2000022105A (ja) | 2000-01-21 |
| JP2000022105A5 JP2000022105A5 (enExample) | 2005-09-29 |
Family
ID=16140279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10183692A Pending JP2000022105A (ja) | 1998-06-30 | 1998-06-30 | 半導体装置の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US6403441B1 (enExample) |
| JP (1) | JP2000022105A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001066834A3 (en) * | 2000-03-07 | 2002-02-28 | Symetrix Corp | Chemical vapor deposition process for fabricating layered superlattice materials |
| US6762090B2 (en) | 2001-09-13 | 2004-07-13 | Hynix Semiconductor Inc. | Method for fabricating a capacitor |
| JP2007273892A (ja) * | 2006-03-31 | 2007-10-18 | Fujitsu Ltd | 薄膜キャパシタおよびこれを有する半導体装置 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000349255A (ja) * | 1999-06-03 | 2000-12-15 | Oki Electric Ind Co Ltd | 半導体記憶装置およびその製造方法 |
| KR100389913B1 (ko) * | 1999-12-23 | 2003-07-04 | 삼성전자주식회사 | 공정조건을 변화시키면서 화학기상 증착법으로 루테늄막을형성하는 방법 및 그에 의해 형성된 루테늄막 |
| US6617206B1 (en) * | 2000-06-07 | 2003-09-09 | Micron Technology, Inc. | Method of forming a capacitor structure |
| KR100396879B1 (ko) * | 2000-08-11 | 2003-09-02 | 삼성전자주식회사 | 동일 물질로 이루어진 이중막을 포함하는 다중막으로캡슐화된 캐패시터를 구비한 반도체 메모리 소자 및 그의제조 방법 |
| KR100360413B1 (ko) * | 2000-12-19 | 2002-11-13 | 삼성전자 주식회사 | 2단계 열처리에 의한 반도체 메모리 소자의 커패시터 제조방법 |
| US6730575B2 (en) * | 2001-08-30 | 2004-05-04 | Micron Technology, Inc. | Methods of forming perovskite-type material and capacitor dielectric having perovskite-type crystalline structure |
| US7211199B2 (en) * | 2002-03-15 | 2007-05-01 | The Trustees Of The University Of Pennsylvania | Magnetically-and electrically-induced variable resistance materials and method for preparing same |
| KR102794032B1 (ko) | 2019-12-13 | 2025-04-11 | 삼성전자주식회사 | 커패시터 구조물 및 이를 포함하는 반도체 장치 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3972059A (en) * | 1973-12-28 | 1976-07-27 | International Business Machines Corporation | Dielectric diode, fabrication thereof, and charge store memory therewith |
| JP2658819B2 (ja) | 1993-09-13 | 1997-09-30 | 日本電気株式会社 | 薄膜キャパシタ |
| JPH0982915A (ja) | 1995-09-18 | 1997-03-28 | Toshiba Corp | 半導体装置の製造方法 |
| US5612560A (en) * | 1995-10-31 | 1997-03-18 | Northern Telecom Limited | Electrode structure for ferroelectric capacitors for integrated circuits |
| JPH09246490A (ja) | 1996-03-11 | 1997-09-19 | Toshiba Corp | 半導体装置及びその製造方法 |
| KR100215861B1 (ko) * | 1996-03-13 | 1999-08-16 | 구본준 | 유전체 박막 제조방법 및 이를 이용한 반도체 장치제조방법 |
| US5807774A (en) | 1996-12-06 | 1998-09-15 | Sharp Kabushiki Kaisha | Simple method of fabricating ferroelectric capacitors |
| US6078072A (en) * | 1997-10-01 | 2000-06-20 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device having a capacitor |
| US6010744A (en) * | 1997-12-23 | 2000-01-04 | Advanced Technology Materials, Inc. | Method for nucleation controlled chemical vapor deposition of metal oxide ferroelectric thin films |
-
1998
- 1998-06-30 JP JP10183692A patent/JP2000022105A/ja active Pending
-
1999
- 1999-04-15 US US09/291,306 patent/US6403441B1/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001066834A3 (en) * | 2000-03-07 | 2002-02-28 | Symetrix Corp | Chemical vapor deposition process for fabricating layered superlattice materials |
| US6762090B2 (en) | 2001-09-13 | 2004-07-13 | Hynix Semiconductor Inc. | Method for fabricating a capacitor |
| JP2007273892A (ja) * | 2006-03-31 | 2007-10-18 | Fujitsu Ltd | 薄膜キャパシタおよびこれを有する半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US6403441B1 (en) | 2002-06-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6589839B1 (en) | Dielectric cure for reducing oxygen vacancies | |
| US5736449A (en) | Semiconductor memory device having improved isolation between electrodes, and process for fabricating the same | |
| US6180974B1 (en) | Semiconductor storage device having a capacitor electrode formed of at least a platinum-rhodium oxide | |
| US6165834A (en) | Method of forming capacitors, method of processing dielectric layers, method of forming a DRAM cell | |
| JP3319994B2 (ja) | 半導体記憶素子 | |
| JP3485690B2 (ja) | 半導体装置のキャパシタ及びその製造方法 | |
| US6335551B2 (en) | Thin film capacitor having an improved bottom electrode and method of forming the same | |
| US6225185B1 (en) | Method for fabricating semiconductor memory having good electrical characteristics and high reliability | |
| JPH11126881A (ja) | 高強誘電体薄膜コンデンサを有する半導体装置及びその製造方法 | |
| JPH1056145A (ja) | 半導体集積回路装置の製造方法 | |
| KR101084408B1 (ko) | 반도체 장치 및 그 제조방법 | |
| US6828190B2 (en) | Method for manufacturing capacitor of semiconductor device having dielectric layer of high dielectric constant | |
| JP2000022105A (ja) | 半導体装置の製造方法 | |
| JP3931113B2 (ja) | 半導体装置及びその製造方法 | |
| US6239459B1 (en) | Capacitors, methods of forming capacitors and integrated circuitry | |
| US20020125524A1 (en) | Semiconductor device and method of manufacturing same | |
| US20030059959A1 (en) | Method for fabricating capacitor | |
| JP2001237402A (ja) | 構造化された金属酸化物含有層および半導体構造素子の製造方法 | |
| US20060154382A1 (en) | Capacitor with high dielectric constant materials and method of making | |
| JP2000195956A (ja) | キャパシタの下部電極形成方法 | |
| JP3173451B2 (ja) | 半導体装置及びその製造方法 | |
| JPH0982915A (ja) | 半導体装置の製造方法 | |
| JPH11233734A (ja) | 半導体メモリ素子及びその製造方法 | |
| JP3317295B2 (ja) | 容量素子の製造方法 | |
| JPH10173149A (ja) | 半導体装置およびその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050512 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050512 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20071029 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080513 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080710 |
|
| A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20081218 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20090203 |
|
| RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20090203 |