JP1707776S - Carrier for electronic component test equipment - Google Patents

Carrier for electronic component test equipment

Info

Publication number
JP1707776S
JP1707776S JP2021014553F JP2021014553F JP1707776S JP 1707776 S JP1707776 S JP 1707776S JP 2021014553 F JP2021014553 F JP 2021014553F JP 2021014553 F JP2021014553 F JP 2021014553F JP 1707776 S JP1707776 S JP 1707776S
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JP
Japan
Prior art keywords
electronic component
carrier
socket
article
testing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021014553F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2021014553F priority Critical patent/JP1707776S/en
Application granted granted Critical
Publication of JP1707776S publication Critical patent/JP1707776S/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

本物品は、半導体集積回路などの電子部品を保持するキャリアである。このキャリアは、当該電子部品の電気的特性をテストする電子部品試験装置内において搬送されるトレイに装着されて用いられる。本物品は、「使用状態を示す参考Ｂ－Ｂ’断面図」に示すように、トレイ側の部材と係合するフックによって、トレイに装着される。そして、電子部品をテストする際に、本物品の底部に保持された電子部品を上方からソケットに押し付け、当該電子部品から導出する外部接続端子をソケットの端子に接触させることで、ソケットを介して電子部品と電子部品試験装置とを電気的に接続する。電子部品試験装置は、この状態で電子部品の試験を実行する。This article is a carrier that holds electronic components such as semiconductor integrated circuits. This carrier is used by being mounted on a tray carried in an electronic component testing device for testing the electrical characteristics of the electronic component. This article is attached to the tray by a hook that engages with a member on the tray side, as shown in "Reference BB'cross-sectional view showing a state of use". Then, when testing the electronic component, the electronic component held at the bottom of the article is pressed against the socket from above, and the external connection terminal derived from the electronic component is brought into contact with the terminal of the socket, thereby passing through the socket. Electrically connect the electronic component and the electronic component test device. The electronic component test device executes the test of the electronic component in this state.

JP2021014553F 2021-07-05 2021-07-05 Carrier for electronic component test equipment Active JP1707776S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021014553F JP1707776S (en) 2021-07-05 2021-07-05 Carrier for electronic component test equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021014553F JP1707776S (en) 2021-07-05 2021-07-05 Carrier for electronic component test equipment

Publications (1)

Publication Number Publication Date
JP1707776S true JP1707776S (en) 2022-02-17

Family

ID=80326206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021014553F Active JP1707776S (en) 2021-07-05 2021-07-05 Carrier for electronic component test equipment

Country Status (1)

Country Link
JP (1) JP1707776S (en)

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