TWD195142S - Electronic component test vehicle - Google Patents
Electronic component test vehicleInfo
- Publication number
- TWD195142S TWD195142S TW106304637F TW106304637F TWD195142S TW D195142 S TWD195142 S TW D195142S TW 106304637 F TW106304637 F TW 106304637F TW 106304637 F TW106304637 F TW 106304637F TW D195142 S TWD195142 S TW D195142S
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic component
- carrier
- electronic components
- outer periphery
- design
- Prior art date
Links
- 238000012360 testing method Methods 0.000 title abstract description 13
- 239000000758 substrate Substances 0.000 abstract description 6
- 238000004040 coloring Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000002788 crimping Methods 0.000 description 1
Abstract
【物品用途】;本設計之物品為測試半導體集成電路等電子元件電性的電子元件測試裝置設有搬運托盤之載具。如使用狀態剖視參考圖所示，於測試電子元件時，將載具上的電子元件從上方壓在插座上，藉由從電子元件導出的外部連接端子與插座的端子接觸，而通過插座使電子元件與電子元件測試裝置電性連接，電子元件測試裝置則於此狀態下進行電子元件的測試。電子元件放置在設置於載具底面的基板上，基板的外周部則藉由鉚接件固定於載具的外周部，且於載具的外周部設置了使鉚接件固定基板外周部的斜面，以避免鉚接件與插座之間的干擾。;【設計說明】;圖式所揭露之灰階填色，為本案不主張設計之部分。此外，如立體參考圖及仰視參考圖所示，本案灰階填色部分之設有開口之部分，亦為本案不主張設計之部分。[Use of the item]; The item of this design is a carrier equipped with a transport pallet for an electronic component testing device that tests the electrical properties of electronic components such as semiconductor integrated circuits. As shown in the cross-sectional reference diagram in use, when testing electronic components, the electronic components on the carrier are pressed against the socket from above, and the external connection terminals derived from the electronic components are in contact with the terminals of the socket, and the socket is used. The electronic component is electrically connected to the electronic component testing device, and the electronic component testing device performs testing of the electronic component in this state. The electronic components are placed on the substrate provided on the bottom surface of the carrier, and the outer periphery of the substrate is fixed to the outer periphery of the carrier through rivets, and a slope is provided on the outer periphery of the carrier to allow the rivets to fix the outer periphery of the substrate. Avoid interference between rivets and sockets. ;[Design Description];The gray-scale coloring disclosed in the drawing is a part of the design that is not recommended in this case. In addition, as shown in the three-dimensional reference drawing and the bottom-view reference drawing, the portion with openings in the gray-scale color-filled part of this case is also a part of this case that does not advocate design.
Description
本設計之物品為測試半導體集成電路等電子元件電性的電子元件測試裝置設有搬運托盤之載具。如使用狀態剖視參考圖所示，於測試電子元件時，將載具上的電子元件從上方壓在插座上，藉由從電子元件導出的外部連接端子與插座的端子接觸，而通過插座使電子元件與電子元件測試裝置電性連接，電子元件測試裝置則於此狀態下進行電子元件的測試。電子元件放置在設置於載具底面的基板上，基板的外周部則藉由鉚接件固定於載具的外周部，且於載具的外周部設置了使鉚接件固定基板外周部的斜面，以避免鉚接件與插座之間的干擾。 The article of the present design is an electronic component testing device for testing electronic components such as semiconductor integrated circuits, and is provided with a carrier for transporting trays. As shown in the reference cross-sectional reference diagram, when testing the electronic component, the electronic component on the carrier is pressed onto the socket from above, and the external connection terminal derived from the electronic component contacts the terminal of the socket, and is made through the socket. The electronic component is electrically connected to the electronic component testing device, and the electronic component testing device performs the electronic component testing in this state. The electronic component is placed on the substrate provided on the bottom surface of the carrier, and the outer peripheral portion of the substrate is fixed to the outer peripheral portion of the carrier by the crimping member, and the inclined surface of the outer peripheral portion of the substrate is fixed to the outer peripheral portion of the carrier. Avoid interference between the rivet and the socket.
圖式所揭露之灰階填色，為本案不主張設計之部分。此外，如立體參考圖及仰視參考圖所示，本案灰階填色部分之設有開口之部分，亦為本案不主張設計之部分。 The gray-scale coloring disclosed in the figure is not part of the design of this case. In addition, as shown in the three-dimensional reference picture and the bottom reference picture, the portion of the gray-scale color-filled portion of the case is also not part of the design.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2017-9411F JP1587040S (en) | 2017-04-28 | 2017-04-28 | |
| JP2017-009411 | 2017-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD195142S true TWD195142S (en) | 2019-01-01 |
Family
ID=59966945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106304637F TWD195142S (en) | 2017-04-28 | 2017-08-15 | Electronic component test vehicle |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1587040S (en) |
| TW (1) | TWD195142S (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM472197U (en) | 2013-07-09 | 2014-02-11 | Rato Technology Corp | Density panel module of circuit board test device |
| TWM494308U (en) | 2014-06-23 | 2015-01-21 | 3D Circuit Taiwan Company Ltd | Parallel test device for integrated circuit |
| TWM519218U (en) | 2015-12-11 | 2016-03-21 | Suzonetech Co Ltd | Circuit testing apparatus |
-
2017
- 2017-04-28 JP JPD2017-9411F patent/JP1587040S/ja active Active
- 2017-08-15 TW TW106304637F patent/TWD195142S/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM472197U (en) | 2013-07-09 | 2014-02-11 | Rato Technology Corp | Density panel module of circuit board test device |
| TWM494308U (en) | 2014-06-23 | 2015-01-21 | 3D Circuit Taiwan Company Ltd | Parallel test device for integrated circuit |
| TWM519218U (en) | 2015-12-11 | 2016-03-21 | Suzonetech Co Ltd | Circuit testing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1587040S (en) | 2017-10-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2008101944A5 (en) | ||
| MY192643A (en) | Alignment fixtures for integrated circuit packages | |
| WO2006041807A3 (en) | Contact for electronic devices | |
| PH12014501797A1 (en) | Test socket with hook-like pin contact edge | |
| KR101709946B1 (en) | Test socket with integrated vacuum suction line | |
| KR20170000572A (en) | Probe apparatus for test of electronic device | |
| TWD195142S (en) | Electronic component test vehicle | |
| SG11201900527RA (en) | Connector pin apparatus for semiconductor chip testing, and method for manufacturing same | |
| US7261571B2 (en) | Electrical connector | |
| KR20160113492A (en) | Flexible composite contact and test Socket using the same | |
| KR101500609B1 (en) | A test device | |
| KR101544499B1 (en) | A test device | |
| MY185482A (en) | Stray inductance reduction in packaged semiconductor devices and modules | |
| JP1707777S (en) | Carrier for electronic component test equipment | |
| JP1707776S (en) | Carrier for electronic component test equipment | |
| US20160003869A1 (en) | Test carrier | |
| WO2020166498A1 (en) | Socket | |
| KR101792972B1 (en) | Semiconductor burn-in test device | |
| KR20150019262A (en) | Method for testing semiconductor package | |
| TW200720662A (en) | Calibration board for electronic component tester | |
| US10527671B2 (en) | Absorption testing apparatus | |
| US20170146568A1 (en) | Electronic test equipment | |
| PH12021551211A1 (en) | Test socket for semiconductor integrated circuits | |
| KR20170119452A (en) | Insert assembly for receiving semiconductor device and test tray including the same | |
| TW200951449A (en) | Test system and probe device |