TWM472197U - Density panel module of circuit board test device - Google Patents

Description

MDF test device MDF module

The present invention relates to a MDF test device for a circuit board test device, which is used for detecting circuits, conductive patterns and electrical contacts on a circuit board to be tested.

The circuit boards inside most electronic devices have complex circuit distribution, conductive patterns and/or a large number of electrical contacts for signal transmission or logic circuits and the like. Therefore, the circuit board must be tested at the back end of the process for circuit distribution, conductive patterns and/or a large number of electrical contacts to ensure its performance.

As shown in FIG. 1 to FIG. 3 , the conventional circuit board testing device includes a needle board 20 , a MDF module 40 and a base 60 . The MDF module 40 is provided with a plurality of ejector pins 10 . And each of the ejector pins 10 is connected to each of the plurality of test slots 61 on the base 60 via a wire 30, and the test device 61 can be plugged into each test device (not shown) To provide a test signal, the needle board 20 is provided with a plurality of probes 21 according to the electrical contacts to be tested on the circuit of the circuit board 70 to be tested; by placing the needle board 20 on the MDF module 40, and the probe 21 is abutted against the corresponding ejector pin 10 to achieve electrical connection, and the circuit board 70 to be tested is disposed on the needle plate 20, so that the electrical contact to be tested abuts each of the probes. The pins 21 are electrically connected, and can be connected to the test device via the ejector pins 10, the wires 30, and the test sockets 61, thereby forming a conductive loop for testing the circuit board 70 to be tested.

As shown in FIG. 3, the MDF module 40 in the conventional circuit board test fixture includes a plurality of MDFs 41a, 41b, 41c and a limiting plate 42 having corresponding through holes 43 for accommodating a thimble 10, each of the thimbles 10 having an abutment a portion 11 , a coupling post 12 , an elastic member 13 , a support post 14 and a contact portion 15 , and the two ends of the elastic member 13 are respectively disposed on the binding post 12 and the support post 14 , the abutting portion 11 The contact portion 12 is disposed on the binding post 12 for abutting the probe 21, and the contact portion 15 is disposed at the bottom of the support post 14 and connected to the wire 30, wherein the abutting portion 11 of each of the thimbles 10 passes through the The limiting hole 44 of the limiting plate 42 is formed by dislocating the limiting hole 421 of the limiting plate 42 and each of the through holes 43 to engage the limiting plate 42 with each of the pins 10 . The abutting portion of the ejector pin 10 is fixed to the abutment portion 11 on the abutting portion 11.

However, only the abutting portion 11 above the thimble 10 is fixed on the circuit board 70 to be tested. The ejector pin 10 is still unable to be stabilized because only the elastic member 13 is supported between the abutting portion and the contact portion 15, so that the probe 21 is elasticized against the abutting portion 11 of the ejector pin 10. When the component 13 is compressed, the abutting portion and the contact portion 15 may be shaken and skewed, which may cause electrical connection failure or poor effect. Moreover, the limiting plate 42 is disposed between the MDF 41b and the MDF 41c. When the MDF module 40 is removed, the limiting plate 42 must be properly displaced to make the limiting hole of the limiting plate. The 421 is aligned with the abutting portion 11 of each of the thimbles 10 without being caught by the limiting groove on the abutting portion 11, thereby causing inconvenience in the disassembly of the limiting plate 42.

In order to solve the above shortcomings of the prior art, the present invention provides a circuit board testing device. The MDF module can make the thimble accommodated in the MDF module more stable, thereby achieving better electrical connection, and the MDF module of the present invention has the advantages of convenient assembly and disassembly.

For the above purposes and other purposes, the present invention provides a dense circuit board test device The stencil module is configured to assemble a plurality of thimbles, wherein each ejector pin has an abutting portion, a coupling post, an elastic member, a support post and a contact portion, and the elastic member ends are respectively disposed on the ejector pin And abutting portion is disposed on the binding post for abutting a probe, the contact portion is disposed at the bottom of the support column and connected with a wire to be electrically connected by the wire Connected to a test device, the MDF module includes a first density plate, a second density plate, and a third density plate. The first density plate has a plurality of first limiting portions, each of the first limiting portions includes a first through hole and a second through hole, wherein the first through hole receives the thimble a second through hole accommodating the contact portion, wherein the first through hole and the second through hole respectively correspond to the support column and the contact portion; the second density plate has a plurality of receiving holes The positions of the accommodating holes are corresponding to the first limiting portions, and each of the accommodating holes receives the thimble; the third density plate has a plurality of second limiting portions, and the second The position of the limiting portion corresponds to the accommodating holes, and each of the second limiting portions includes a third through hole and a fourth through hole, wherein the third through hole receives the thimble The abutting portion receives the probe, and the third through hole and the fourth through hole respectively have a size corresponding to the abutting portion and the probe.

In the MDF module of the above-mentioned circuit board testing device, the second density board is two The above is superimposed on each other so that the corresponding accommodating holes of the second MDF stacked together accommodate the thimbles.

In the MDF module of the above-mentioned circuit board testing device, the MDF module does not abut the When the probe is connected to the wire, the contact portion passes through the second through hole of the first limiting portion and protrudes from the bottom surface of the first density plate.

Therefore, the MDF module of the circuit board testing device of the present invention, by the first density The first limiting portion of the plate and the second limiting portion of the second density plate can stabilize the thimble to avoid shaking of the thimble; and the MDF module of the circuit board testing device of the present invention is MDF The positions of the first limiting portion, the receiving hole of the second density plate and the second limiting portion of the third density plate correspond to each other, and the third density plate is separated from the second density plate when being disassembled The thimble can be taken out, and has the advantage of convenient disassembly.

10‧‧‧ thimble

11‧‧‧Affiliation

12‧‧‧ binding column

13‧‧‧Flexible components

14‧‧‧Support column

15‧‧‧Contacts

16‧‧‧Combined convex

20‧‧‧ needle board

21‧‧‧ probe

30‧‧‧Wire

40‧‧‧ MDF module

41a, 41b, 41c‧‧‧ MDF

42‧‧‧Limited board

43‧‧‧through hole

44‧‧‧Limited holes

50‧‧‧floor

51‧‧‧through holes

60‧‧‧Base

61‧‧‧Test slot

70‧‧‧Device board to be tested

100‧‧‧First MDF

110‧‧‧First Limitation

111‧‧‧First through hole

112‧‧‧Second through hole

200‧‧‧Second MDF

200a, 200b‧‧‧ second MDF

210‧‧‧ accommodating holes

300‧‧‧ Third MDF

310‧‧‧Second Limitation

311‧‧‧ third through hole

312‧‧‧4th through hole

Figure 1 is an exploded schematic view of a conventional circuit board test apparatus.

Figure 2 is a side elevational view of a conventional circuit board test apparatus.

Fig. 3 is an enlarged schematic view of a portion B in Fig. 2.

Fig. 4 is an exploded perspective view showing the application of the MDF module of the present embodiment to a circuit board test device.

Fig. 5 is a schematic diagram showing the combination of the MDF module of the present embodiment applied to the circuit board testing device.

Figure 6 is a side view showing the application of the MDF module of the present embodiment to a circuit board test device.

Fig. 7 is an enlarged schematic view of a portion A in Fig. 6.

Fig. 8 is a view showing a state in which the MDF test module of the present embodiment is disassembled.

Fig. 9 is a view showing a state in which the ejector pin is taken out when the MDF test module of the present embodiment is removed.

Figure 10 is a partially enlarged schematic view showing the second density plate in the MDF test module of the present embodiment.

FIG. 11 is a partially enlarged schematic view showing the second through hole of the first MDF in which the contact portion is not connected to the wire and is protruded from the MLC test module of the present embodiment.

Figure 12 is a partially enlarged schematic view showing the portion of the MDF test module of the present embodiment in which the contact portion is connected to the wire.

In order to fully understand the purpose, characteristics and efficacy of this creation, we will implement the following specific implementation. For example, and with the accompanying drawings, a detailed description will be given to the present creation, and the following is a description: Please refer to FIG. 4 to FIG. 9 , which are schematic diagrams of the present embodiment. 4 is an exploded view of the MDF test device of the present embodiment, and FIG. 5 is a schematic diagram of the combination of the MDF module of the present embodiment applied to the circuit board test device, FIG. The MDF module of the present embodiment is applied to the side view of the circuit board test device, and FIG. 7 is a partial enlarged view of the portion A of FIG. 6 , and FIG. 8 is an example of the MDF test module of the present embodiment. State diagram of disassembly.

The MDF module 1 of the present invention is used for mounting on the bottom plate 50 of the circuit board test device. The MDF module 1 is used for assembling a plurality of ejector pins 10, as shown in FIGS. 6 to 9. Each of the thimbles 10 has an abutting portion 11, a coupling post 12, and an elastic member 13. a support post 14 and a contact portion 15 , and the two ends of the elastic member 13 are respectively disposed on the joint protrusion 12 and the joint protrusion 16 of the support post 14 . As shown, the elastic member 13 can be, for example, a spring, and the two ends of the elastic member 13 are respectively sleeved on the joint protrusion 12 and the joint protrusion 16 of the support 14; the abutment portion 11 is disposed on the joint pillar 12 for abutting a needle A probe 21 of the board 20 is electrically connected to the circuit board 70 to be tested disposed on the needle board 20. The contact portion 15 is disposed at the bottom of the support column 14 and is used for connecting a wire 30 to be connected by the wire. 30 is electrically connected to the test slot 61 of the base 60, and is then connected to a test device (not shown). According to the test device, the test device can provide a test signal to the circuit board 70 to be tested via the test slot 61, the wire 30, the ejector pin 10, and the probe 21; otherwise, the circuit board to be tested 70 A result signal can be output and transmitted to the test device via the probe 21, the ejector pin 10, the wire 30, and the test slot 61.

Referring to FIGS. 4 to 7 , the MDF module 1 includes a first MDF. 100. A second MDF 200 and a third MDF 300.

In this embodiment, the first density board 100 has a plurality of first limiting portions 110, each of which The first limiting portion 110 includes a first through hole 111 and a second through hole 112. The first through hole 111 receives the support post 14 of the ejector pin 10, and the second through hole 112 is received. The contact portion 15 is accommodated, and the size of the first through hole 111 and the second through hole 112 respectively correspond to the support column 14 and the contact portion 15 , specifically, as shown in the figure, due to the wire 30 The diameter or the width is smaller than the outer diameter or the width of the contact portion 15 , so the outer diameter or width of the second through hole 112 is smaller than the outer diameter or width of the first through hole 111 . In addition, the first through hole 111 can be a circular hole, a rectangular hole or other shape corresponding to the outer shape of the support column 14 , and the second through hole 112 can be a circular hole corresponding to the shape of the contact portion 15 . Rectangular holes or other shapes.

In this embodiment, the second density board 200 has a plurality of receiving holes 210, and the like The position of the accommodating hole 210 corresponds to the first limiting portions 110, and each of the accommodating holes 210 accommodates the ejector pins 10. As shown in the figure, the length of the receiving hole 210 of the second density plate 200 is smaller than the length of the ejector pin 10. The contact portion 15 and the abutting portion 11 protrude from the second density plate 200, and respectively The first MDF 100 and the third MDF 300 are placed.

In this embodiment, the third density board 300 has a plurality of second limiting portions 310, The second limiting portion 310 corresponds to the accommodating holes 210, and each of the second limiting portions 310 includes a third through hole 311 and a fourth through hole 312. The through hole 311 receives the abutting portion 11 of the ejector pin 10, and the fourth through hole 312 receives the probe 21, and the third through hole 311 and the fourth through hole 312 respectively correspond to each other in size. The portion 11 and the probe 21, specifically, as shown in the figure, since the outer diameter or width of the probe 21 is smaller than the outer diameter or width of the abutting portion 11, the outer diameter of the fourth through hole 312 Or the width is smaller than the outer diameter or width of the third through hole 311. In addition, the third through hole 311 can be a circular hole, a rectangular hole or other shape corresponding to the outer shape of the abutting portion 11, and the fourth through hole 312 can be a circular hole corresponding to the outer shape of the probe 21. , rectangular holes or other shapes.

According to this, when detecting the circuit board 70 to be tested, the probe 21 abuts and contacts When the abutting portion 11 of the ejector pin 10 and the elastic member 13 are compressed, since the contact portion 15 and the abutting portion 11 of the ejector pin 10 are the first limiting portion 110 of the first MDF 100 and the third portion The second limiting portion 310 of the MDF 300 is limited, so that the contact portion 15 and the abutting portion 11 can be relatively moved along a straight line without being skewed, so that the thimble 10 can be prevented from shaking and the thimble 10 can be more stable. The effect of a preferred electrical connection.

As shown in FIG. 8 and FIG. 9, in the embodiment, the first MDF 100 is The position of the limiting portion 110, the receiving hole 210 of the second density plate 200 and the second limiting portion 310 of the third density plate 300 correspond to each other, that is, the center line of the three is in a straight line, so when the user wants to disassemble In the MDF module 1, the third MDF 300 is lifted up and separated from the second MDF 200, and the ejector pin 10 is taken out from the accommodating hole of the second MDF 200. Therefore, the MDF module 1 of the present embodiment has the advantage of being easy to disassemble.

Referring to FIG. 10, in the MDF module 1 of the embodiment, the second density board is There may be two or more overlapping layers, and two second density plates 200a, 200b are exemplified in the drawing, so that the corresponding accommodating holes 210 of the second density boards 200a, 200b are mutually accommodated. Thimble 10.

In addition, please refer to FIG. 4 to FIG. 6 , in this embodiment, the circuit board test device A plurality of through holes 51 are formed in the bottom plate 50, and each of the through holes 51 is used to pierce and fix each of the wires 30. And the through hole 51 of the bottom plate 50, the first limiting portion 110 of the first density plate 100, the receiving hole 210 of the second density plate 200, and the third portion, as shown in FIG. 4 and FIG. The second limiting portion 310 of the MDF 300 and the position of the probe 21 of the needle plate 20 correspond to each other, that is, each of the wires 30, each of the thimbles 10 and each of the probes 21 correspond to each other, and corresponds to the waiting The electrical contacts of the circuit board 70 are measured. Each of the wires 30 passes through each of the through holes 51 when the circuit board test device is fabricated. And protruding from the top surface of the bottom plate 50, and then trimming, so that the cut surface of each of the wires 30 exposes the central copper wire, and the length of the wires 30 protruding from the bottom plate 50 is the same.

Please refer to FIG. 11 , in the MDF module 1 of the embodiment, the MDF module 1 When the probe 21 and the wire 30 are not abutted, the contact portion 15 passes through the second through hole 112 of the first limiting portion 110 and protrudes from the bottom surface of the first density plate 100; When the board module 1 is mounted on the bottom plate 50 of the circuit board test device, the contact portion 15 of each of the ejector pins 10 abuts against the wire 30 corresponding to the position thereof, as shown in Fig. 12; When the needle 21 is pressed down against the abutting portion 11 of the ejector pin 10, the contact portion 15 of each thimble 10 abuts against the wire 30 corresponding to the position thereof. At this time, the elastic member 13 of the thimble 10 is compressed and pushed against the pin. The abutting portion 11 and the contact portion 15 enable the abutting portion 11 and the probe 21 and the contact portion 15 to be in close contact with the lead wire, thereby further improving the reliability of the electrical connection.

In summary, the MDF module 1 of the present embodiment is connected by the ejector pin 10. The accommodating portion 10 and the abutting portion 11 are disposed in the first limiting portion 110 of the first MDF 100 and the second limiting portion 310 of the third MDF 300, so as to prevent the ejector pin 10 from shaking and the ejector pin 10 It is more stable, and the effect of the better electrical connection is achieved; and the MDF module 1 of the present embodiment can directly separate the third MDF 300 from the second MDF 200, and the thimble can be 10 is taken out, and has the advantage of convenient disassembly.

The present invention has been disclosed in the above preferred embodiments, and it should be understood by those skilled in the art that the present invention is only intended to depict the present invention and should not be construed as limiting the scope of the present invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of this creation is subject to the definition of the scope of patent application.

10‧‧‧ thimble

11‧‧‧Affiliation

12‧‧‧ binding column

13‧‧‧Flexible components

14‧‧‧Support column

15‧‧‧Contacts

16‧‧‧Combined convex

20‧‧‧ needle board

21‧‧‧ probe

30‧‧‧Wire

100‧‧‧First MDF

110‧‧‧First Limitation

111‧‧‧First through hole

112‧‧‧Second through hole

200‧‧‧Second MDF

210‧‧‧ accommodating holes

300‧‧‧ Third MDF

310‧‧‧Second Limitation

311‧‧‧ third through hole

312‧‧‧4th through hole

Claims (3)

A MDF test device for assembling a plurality of thimbles, wherein each of the ejector pins has an abutting portion, a coupling post, an elastic member, a support post and a contact portion, and the elastic member The end portions are respectively disposed on the binding post and the support column, and the abutting portion is disposed on the binding post for abutting a probe, the contact portion is disposed at the bottom of the support column and connected with a wire, The MCU is electrically connected to a test device, and the MDF module includes: a first MDF having a plurality of first limiting portions, each of the first limiting portions including a first communication connected And a second through hole, the first through hole accommodating the support post of the ejector pin, the second through hole receiving the contact portion, and the first through hole and the second through hole are respectively sized The second density plate has a plurality of accommodating holes, and the positions of the accommodating holes are corresponding to the first limiting portions, and each of the accommodating holes accommodates each of the accommodating holes a thimble; and a third density plate having a plurality of second limiting portions, the second limiting positions Positioning corresponding to the accommodating holes, each of the second limiting portions includes a third through hole and a fourth through hole, wherein the third through hole receives the abutting portion of the thimble The fourth through hole accommodates the probe, and the third through hole and the fourth through hole respectively have a size corresponding to the abutting portion and the probe. The MDF module of the circuit board testing device of claim 1, wherein the second MDF is two or more and overlapped with each other to accommodate the corresponding second MDF. The holes collectively accommodate each of the thimbles. The MDF test module of the circuit board test device of claim 1, wherein the contact portion passes through the first limit portion when the MDF module does not abut the probe and the wire The two through holes protrude from the bottom surface of the first density plate.