JP1701619S - - Google Patents

Info

Publication number
JP1701619S
JP1701619S JPD2021-1105F JP2021001105F JP1701619S JP 1701619 S JP1701619 S JP 1701619S JP 2021001105 F JP2021001105 F JP 2021001105F JP 1701619 S JP1701619 S JP 1701619S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2021-1105F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2021-1105F priority Critical patent/JP1701619S/ja
Priority to US29/798,678 priority patent/USD1074628S1/en
Application granted granted Critical
Publication of JP1701619S publication Critical patent/JP1701619S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2021-1105F 2021-01-20 2021-01-20 Active JP1701619S (cs)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2021-1105F JP1701619S (cs) 2021-01-20 2021-01-20
US29/798,678 USD1074628S1 (en) 2021-01-20 2021-07-09 Light-emitting element module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2021-1105F JP1701619S (cs) 2021-01-20 2021-01-20

Publications (1)

Publication Number Publication Date
JP1701619S true JP1701619S (cs) 2021-12-06

Family

ID=78815175

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2021-1105F Active JP1701619S (cs) 2021-01-20 2021-01-20

Country Status (2)

Country Link
US (1) USD1074628S1 (cs)
JP (1) JP1701619S (cs)

Family Cites Families (84)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3795248B2 (ja) 1999-03-19 2006-07-12 ローム株式会社 チップ型発光装置
JP4357311B2 (ja) 2004-02-04 2009-11-04 シチズン電子株式会社 発光ダイオードチップ
TWI248218B (en) 2004-12-31 2006-01-21 Ind Tech Res Inst Light-emitting diode package structure and fabrication method thereof
US7211882B2 (en) 2005-03-22 2007-05-01 Harvatek Corporation LED package structure and method for making the same
KR100616693B1 (ko) * 2005-08-09 2006-08-28 삼성전기주식회사 질화물 반도체 발광 소자
US20070063213A1 (en) 2005-09-21 2007-03-22 Lighthouse Technology Co., Ltd. LED package
JP4715422B2 (ja) 2005-09-27 2011-07-06 日亜化学工業株式会社 発光装置
KR100779078B1 (ko) * 2005-12-09 2007-11-27 한국전자통신연구원 빛의 방출 효율을 향상시킬 수 있는 실리콘 발광 소자 및그 제조방법
TWD130663S1 (zh) 2007-06-14 2009-09-01 羅姆電子股份有限公司 發光二極體模組
USD581885S1 (en) 2007-06-14 2008-12-02 Panasonic Corporation Light source of light emitting diode
US7714334B2 (en) 2007-08-16 2010-05-11 Lin Peter P W Polarless surface mounting light emitting diode
USD590355S1 (en) 2007-11-29 2009-04-14 Citizen Electronics Co., Ltd. Light-emitting diode
USD590357S1 (en) 2007-11-29 2009-04-14 Citizen Electronics Co., Ltd. Light-emitting diode
USD599303S1 (en) 2007-12-05 2009-09-01 Seoul Semiconductor Co., Ltd. Light emitting diode (LED)
TWD135010S1 (zh) 2008-06-20 2010-05-21 西鐵城電子股份有限公司 發光二極體
JP2010021261A (ja) * 2008-07-09 2010-01-28 Toshiba Corp 光半導体素子の製造方法、光半導体素子及び光半導体装置の製造方法
WO2010011207A1 (en) * 2008-07-25 2010-01-28 Hewlett-Packard Development Company, L.P. Light-emitting devices
KR101154758B1 (ko) * 2008-11-18 2012-06-08 엘지이노텍 주식회사 반도체 발광소자 및 이를 구비한 발광소자 패키지
US7675087B1 (en) 2008-12-01 2010-03-09 Wen-Tsung Cheng Surface mount light emitting device
TWD139992S1 (zh) 2009-03-13 2011-04-11 日亞化學工業股份有限公司 發光二極體
TWD140389S1 (zh) 2009-10-16 2011-05-01 東芝股份有限公司 發光二極體
USD627310S1 (en) 2009-11-27 2010-11-16 Lite-On Technology Corp. Package of a light emitting diode
USD633449S1 (en) 2009-12-11 2011-03-01 Everlight Electronics Co., Ltd. Light emitting diode
USD624883S1 (en) 2009-12-11 2010-10-05 Everlight Electronics Co., Ltd. Light emitting diode
TWD139849S1 (zh) 2010-01-11 2011-04-01 億光電子工業股份有限公司 發光二極體封裝
TWD139850S1 (zh) 2010-03-19 2011-04-01 億光電子工業股份有限公司 發光二極體
USD653628S1 (en) * 2010-08-02 2012-02-07 Citizen Electronics Co., Ltd. Light-emitting diode
USD653629S1 (en) 2010-08-02 2012-02-07 Citizen Electronics Co., Ltd. Light-emitting diode
USD640994S1 (en) 2010-09-27 2011-07-05 Lite-On Technology Corporation Packing structure of light-emitting diode
TWD143606S1 (zh) 2010-09-29 2011-11-01 東芝股份有限公司 發光二極體
TWD143605S1 (zh) 2010-09-29 2011-11-01 東芝股份有限公司 發光二極體
USD653222S1 (en) 2011-01-26 2012-01-31 Toyoda Gosei Co., Ltd. Light emitting diode
USD663703S1 (en) 2011-02-10 2012-07-17 Rohm Co., Ltd. Light emitting diode module
TWD143390S1 (zh) 2011-02-25 2011-10-21 隆達電子股份有限公司; 發光二極體
TWD145643S (zh) 2011-04-28 2012-03-01 東芝股份有限公司 發光二極體
TWD146854S (zh) 2011-06-29 2012-05-01 隆達電子股份有限公司 發光二極體封裝
JP5628120B2 (ja) 2011-09-15 2014-11-19 ローム株式会社 発光素子モジュール
USD674965S1 (en) 2012-01-27 2013-01-22 Hubbell Incorporated LED optical component
JP5909421B2 (ja) 2012-08-01 2016-04-26 浜松ホトニクス株式会社 複合センサ及び複合センサモジュール
USD847102S1 (en) 2013-02-08 2019-04-30 Epistar Corporation Light emitting diode
TWD161897S (zh) 2013-02-08 2014-07-21 晶元光電股份有限公司 發光二極體之部分
TWI610465B (zh) * 2013-10-07 2018-01-01 晶元光電股份有限公司 發光二極體組件及製作方法
USD741821S1 (en) * 2014-04-10 2015-10-27 Kingbright Electronics Co., Ltd. LED component
USD724549S1 (en) 2014-05-09 2015-03-17 Kingbright Electronics Co. Ltd. LED component
TWD166329S (zh) 2014-06-06 2015-03-01 新世紀光電股份有限公司 發光二極體晶片之部分
USD737784S1 (en) * 2014-07-30 2015-09-01 Kingbright Electronics Co., Ltd. LED component
USD778846S1 (en) * 2014-12-15 2017-02-14 Kingbright Electronics Co. Ltd. LED component
USD778847S1 (en) 2014-12-15 2017-02-14 Kingbright Electronics Co. Ltd. LED component
USD783547S1 (en) * 2015-06-04 2017-04-11 Cree, Inc. LED package
USD793002S1 (en) 2015-12-24 2017-07-25 Semicon Light Co., Ltd. Mold for packaging semiconductor light emitting device
USD774475S1 (en) * 2016-02-19 2016-12-20 Kingbright Electronics Co. Ltd. LED component
USD774476S1 (en) * 2016-02-25 2016-12-20 Kingbright Electronics Co. Ltd. LED component
USD831593S1 (en) * 2016-03-24 2018-10-23 Hamamatsu Photonics K.K Optical semiconductor element
JP1563908S (cs) * 2016-03-24 2016-11-21
USD797361S1 (en) 2016-05-11 2017-09-12 SpeedTech Lights, Inc. LED optical lens
USD797366S1 (en) 2016-05-11 2017-09-12 SpeedTech Lights, Inc. LED optical lens
USD792639S1 (en) 2016-05-11 2017-07-18 SpeedTech Lights, Inc. LED optical lens
USD797363S1 (en) 2016-05-11 2017-09-12 SpeedTech Lights, Inc. LED optical lens
USD797360S1 (en) 2016-05-11 2017-09-12 SpeedTech Lights, Inc. LED optical lens
USD797365S1 (en) 2016-05-11 2017-09-12 SpeedTech Lights, Inc. LED optical lens
USD797359S1 (en) 2016-05-11 2017-09-12 SpeedTech Lights, Inc. LED optical lens
USD797362S1 (en) 2016-05-11 2017-09-12 SpeedTech Lights, Inc. LED optical lens
USD797364S1 (en) 2016-05-11 2017-09-12 SpeedTech Lights, Inc. LED optical lens
USD799103S1 (en) 2016-05-20 2017-10-03 Heptagon Micro Optics Pte. Ltd. Optical emitter module
US10790267B2 (en) 2017-08-28 2020-09-29 Lumens Co., Ltd. Light emitting element for pixel and LED display module
TWD194647S (zh) * 2018-05-11 2018-12-11 今臺電子股份有限公司 發光二極體封裝
KR102646700B1 (ko) * 2018-08-16 2024-03-13 엘지이노텍 주식회사 조명 장치
US20220052229A1 (en) * 2018-09-17 2022-02-17 Lumens Co., Ltd. Light-emitting device package capable of implementing surface light source, light-emitting module, and manufacturing method therefor
TWD201270S (zh) * 2018-10-26 2019-12-01 今臺電子股份有限公司 發光二極體封裝
US20210358998A1 (en) * 2018-11-16 2021-11-18 Sakai Display Products Corporation Micro led device and production method therefor
KR102271149B1 (ko) * 2018-12-31 2021-06-30 주식회사 나노엑스 양면 발광 led 칩의 제조 방법
WO2020203372A1 (ja) 2019-03-29 2020-10-08 京セラ株式会社 素子用基板、発光素子モジュールおよび発光装置
WO2021002158A1 (ja) * 2019-07-04 2021-01-07 日亜化学工業株式会社 発光装置の製造方法及び発光モジュールの製造方法、並びに、発光装置及び発光モジュール
JP7428500B2 (ja) 2019-10-31 2024-02-06 浜松ホトニクス株式会社 発光素子駆動回路
TWI705562B (zh) * 2019-12-13 2020-09-21 國立中興大學 大面積被動式微發光二極體陣列顯示器
KR102797522B1 (ko) * 2020-02-12 2025-04-18 삼성전자주식회사 반도체 발광 소자 및 이의 제조 방법
USD1022307S1 (en) 2020-03-27 2024-04-09 Ultra Bright Lightz, LLC Lighting apparatus
KR102845462B1 (ko) 2020-06-23 2025-08-11 삼성전자주식회사 Led 패키지 및 이를 포함하는 디스플레이 장치
KR20220112908A (ko) * 2021-02-04 2022-08-12 삼성전자주식회사 반도체 발광장치
KR102541515B1 (ko) * 2021-10-26 2023-06-07 국민대학교산학협력단 초박형 핀 led 소자 및 이를 포함하는 초박형 핀 led 전극어셈블리
KR102749453B1 (ko) * 2022-06-21 2024-12-31 국민대학교산학협력단 초박형 핀 led 소자 및 이를 포함하는 잉크조성물
JP2024085446A (ja) 2022-12-15 2024-06-27 日亜化学工業株式会社 発光装置
KR20240104919A (ko) * 2022-12-28 2024-07-05 국민대학교산학협력단 Led 소자 및 이를 포함하는 잉크조성물
USD1057674S1 (en) 2023-02-08 2025-01-14 Autosystems, A Division Of Magna Exteriors Inc. Light emitting chip scale package

Also Published As

Publication number Publication date
USD1074628S1 (en) 2025-05-13

Similar Documents

Publication Publication Date Title
BR112023005462A2 (cs)
BR112023012656A2 (cs)
BR112021014123A2 (cs)
BR112023009656A2 (cs)
BR112022009896A2 (cs)
BR112023008622A2 (cs)
BR112022024743A2 (cs)
BR112022026905A2 (cs)
BR112023011738A2 (cs)
BR112023004146A2 (cs)
BR112023006729A2 (cs)
BR102021018859A2 (cs)
BR102021015500A2 (cs)
BR112021017747A2 (cs)
BR102021007058A2 (cs)
BR102020022030A2 (cs)
BR112023016292A2 (cs)
BR112023011539A2 (cs)
BR112023011610A2 (cs)
BR112023008976A2 (cs)
BR102021020147A2 (cs)
BR102021018926A2 (cs)
BR102021018167A2 (cs)
BR102021017576A2 (cs)
BR102021016837A2 (cs)