JP1603175S - - Google Patents

Info

Publication number
JP1603175S
JP1603175S JPD2017-23165F JP2017023165F JP1603175S JP 1603175 S JP1603175 S JP 1603175S JP 2017023165 F JP2017023165 F JP 2017023165F JP 1603175 S JP1603175 S JP 1603175S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2017-23165F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2017-23165F priority Critical patent/JP1603175S/ja
Priority to US29/644,401 priority patent/USD856947S1/en
Application granted granted Critical
Publication of JP1603175S publication Critical patent/JP1603175S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2017-23165F 2017-10-19 2017-10-19 Active JP1603175S (enrdf_load_stackoverflow)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2017-23165F JP1603175S (enrdf_load_stackoverflow) 2017-10-19 2017-10-19
US29/644,401 USD856947S1 (en) 2017-10-19 2018-04-17 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2017-23165F JP1603175S (enrdf_load_stackoverflow) 2017-10-19 2017-10-19

Publications (1)

Publication Number Publication Date
JP1603175S true JP1603175S (enrdf_load_stackoverflow) 2018-05-07

Family

ID=62066955

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2017-23165F Active JP1603175S (enrdf_load_stackoverflow) 2017-10-19 2017-10-19

Country Status (2)

Country Link
US (1) USD856947S1 (enrdf_load_stackoverflow)
JP (1) JP1603175S (enrdf_load_stackoverflow)

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Publication number Priority date Publication date Assignee Title
JP1593817S (enrdf_load_stackoverflow) * 2017-03-28 2017-12-25
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
JP1682283S (enrdf_load_stackoverflow) * 2020-07-31 2021-03-29
JP1680788S (enrdf_load_stackoverflow) * 2020-07-31 2021-03-08
JP1699856S (ja) * 2020-12-15 2021-11-15 半導体素子
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
JP1711418S (ja) * 2021-10-13 2022-03-31 半導体素子
JP1727399S (ja) * 2022-01-28 2022-10-14 半導体素子
US12224218B2 (en) 2022-02-11 2025-02-11 Wolfspeed, Inc. Semiconductor packages with increased power handling
JP1725616S (ja) * 2022-02-25 2022-09-26 半導体モジュール
USD1042375S1 (en) * 2022-05-12 2024-09-17 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1037187S1 (en) * 2022-05-12 2024-07-30 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1056862S1 (en) * 2022-08-24 2025-01-07 Wolfspeed, Inc. Semiconductor package

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US3602846A (en) * 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
US3825876A (en) * 1971-08-12 1974-07-23 Augat Inc Electrical component mounting
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US3846734A (en) * 1973-02-06 1974-11-05 Amp Inc Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
USD259559S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
JPS60239043A (ja) * 1984-05-14 1985-11-27 Oki Electric Ind Co Ltd 半導体装置用パツケ−ジの製造方法
JP3420057B2 (ja) * 1998-04-28 2003-06-23 株式会社東芝 樹脂封止型半導体装置
KR100369393B1 (ko) * 2001-03-27 2003-02-05 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지와 그 제조 방법
JP2003077939A (ja) * 2001-09-05 2003-03-14 Mitsubishi Electric Corp 半導体装置およびその製造方法
USD473199S1 (en) * 2001-11-30 2003-04-15 Kabushiki Kaisha Toshiba Portion of semiconductor device
USD480371S1 (en) * 2001-11-30 2003-10-07 Kabushiki Kaisha Toshiba Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD521952S1 (en) * 2004-02-23 2006-05-30 Kabushiki Kaisha Toshiba Semiconductor device
USD508682S1 (en) * 2004-02-23 2005-08-23 Kabushiki Kaisha Toshiba Semiconductor device
USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD539761S1 (en) * 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
USD674760S1 (en) * 2011-04-01 2013-01-22 Fuji Electric Co., Ltd. Semiconductor device
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
JP1577498S (enrdf_load_stackoverflow) * 2016-09-30 2017-05-29
JP1584883S (enrdf_load_stackoverflow) * 2017-01-31 2017-08-28
JP1584651S (enrdf_load_stackoverflow) * 2017-01-31 2017-08-28

Also Published As

Publication number Publication date
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