JP1541874S - - Google Patents

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Publication number
JP1541874S
JP1541874S JPD2015-5626F JP2015005626F JP1541874S JP 1541874 S JP1541874 S JP 1541874S JP 2015005626 F JP2015005626 F JP 2015005626F JP 1541874 S JP1541874 S JP 1541874S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2015-5626F
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Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2015-5626F priority Critical patent/JP1541874S/ja
Priority to US29/539,509 priority patent/USD797690S1/en
Application granted granted Critical
Publication of JP1541874S publication Critical patent/JP1541874S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2015-5626F 2015-03-16 2015-03-16 Active JP1541874S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2015-5626F JP1541874S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2015-03-16 2015-03-16
US29/539,509 USD797690S1 (en) 2015-03-16 2015-09-15 Heater for semiconductor manufacturing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-5626F JP1541874S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2015-03-16 2015-03-16

Publications (1)

Publication Number Publication Date
JP1541874S true JP1541874S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2016-01-18

Family

ID=55133697

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2015-5626F Active JP1541874S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2015-03-16 2015-03-16

Country Status (2)

Country Link
US (1) USD797690S1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP1541874S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1094324S1 (en) 2023-12-01 2025-09-23 Nuflare Technology, Inc. Semiconductor wafer heater

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JP1581406S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2016-10-14 2017-07-18
USD832229S1 (en) * 2017-05-26 2018-10-30 TinyPCB, Inc. Modular circuit board
USD839222S1 (en) * 2017-05-30 2019-01-29 TinyPCB, Inc. Modular circuit board
USD839223S1 (en) * 2017-05-30 2019-01-29 TinyPCB, Inc. Modular circuit board
USD841606S1 (en) * 2017-05-30 2019-02-26 TinyPCB, Inc. Modular circuit board
USD842260S1 (en) * 2017-05-30 2019-03-05 TinyPCB, Inc. Modular circuit board
USD839221S1 (en) * 2017-05-30 2019-01-29 TinyPCB, Inc. Modular circuit board
USD841605S1 (en) * 2017-05-30 2019-02-26 TinyPCB, Inc. Modular circuit board
USD887358S1 (en) * 2018-12-06 2020-06-16 Lofelt Gmbh Motor membrane
JP1651167S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2019-04-24 2020-01-27
JP1646292S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2019-04-24 2019-11-25
JP1651618S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2019-07-11 2020-01-27
JP1651619S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2019-07-11 2020-01-27
JP1651623S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2019-07-18 2020-01-27
USD936187S1 (en) * 2020-02-12 2021-11-16 Applied Materials, Inc. Gas distribution assembly lid
JP1684469S (ja) * 2020-09-24 2021-05-10 基板処理装置用天井ヒータ
USD1071103S1 (en) 2022-04-11 2025-04-15 Applied Materials, Inc. Gas distribution plate
USD1037778S1 (en) 2022-07-19 2024-08-06 Applied Materials, Inc. Gas distribution plate
USD1085029S1 (en) 2022-07-19 2025-07-22 Applied Materials, Inc. Gas distribution plate

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USD313072S (en) * 1988-02-10 1990-12-18 Redring Electric Limited Electric heater element for use in a radiant heater for a glass ceramic hob
GB8924936D0 (en) * 1989-11-04 1989-12-28 Ceramaspeed Ltd Radiant electric heaters
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US6037574A (en) * 1997-11-06 2000-03-14 Watlow Electric Manufacturing Quartz substrate heater
JP3477062B2 (ja) * 1997-12-26 2003-12-10 京セラ株式会社 ウエハ加熱装置
US6433317B1 (en) * 2000-04-07 2002-08-13 Watlow Polymer Technologies Molded assembly with heating element captured therein
US6753507B2 (en) * 2001-04-27 2004-06-22 Kyocera Corporation Wafer heating apparatus
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JP2003317906A (ja) * 2002-04-24 2003-11-07 Sumitomo Electric Ind Ltd セラミックスヒータ
WO2006060134A2 (en) * 2004-11-15 2006-06-08 Cree, Inc. Restricted radiated heating assembly for high temperature processing
KR100811389B1 (ko) * 2006-03-24 2008-03-07 가부시키가이샤 뉴플레어 테크놀로지 반도체 제조 장치와 히터
TWD125598S1 (zh) * 2006-09-28 2008-10-21 東京威力科創股份有限公司 半導體製造用加熱器
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JP2010080909A (ja) * 2008-08-26 2010-04-08 Nuflare Technology Inc ヒータ、半導体製造装置および半導体製造方法
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1094324S1 (en) 2023-12-01 2025-09-23 Nuflare Technology, Inc. Semiconductor wafer heater

Also Published As

Publication number Publication date
USD797690S1 (en) 2017-09-19

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