JP1651167S - - Google Patents
Info
- Publication number
- JP1651167S JP1651167S JPD2019-9164F JP2019009164F JP1651167S JP 1651167 S JP1651167 S JP 1651167S JP 2019009164 F JP2019009164 F JP 2019009164F JP 1651167 S JP1651167 S JP 1651167S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2019-9164F JP1651167S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2019-04-24 | 2019-04-24 | |
| US29/709,589 USD913230S1 (en) | 2019-04-24 | 2019-10-15 | Heater for heating semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2019-9164F JP1651167S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2019-04-24 | 2019-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1651167S true JP1651167S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2020-01-27 |
Family
ID=69182931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2019-9164F Active JP1651167S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2019-04-24 | 2019-04-24 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD913230S1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
| JP (1) | JP1651167S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1705954S (ja) * | 2021-05-31 | 2022-01-25 | コイル |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD402156S (en) * | 1996-02-02 | 1998-12-08 | Ako-Werke Gmbh & Co. Kg | Radiant stove heating element |
| USD410438S (en) * | 1997-01-31 | 1999-06-01 | Tokyo Electron Limited | Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
| JP3477062B2 (ja) * | 1997-12-26 | 2003-12-10 | 京セラ株式会社 | ウエハ加熱装置 |
| USD423028S (en) * | 1998-08-26 | 2000-04-18 | Matsushita Electric Industrial Co., Ltd. | Coil |
| TWI281833B (en) * | 2004-10-28 | 2007-05-21 | Kyocera Corp | Heater, wafer heating apparatus and method for manufacturing heater |
| JP2010080909A (ja) * | 2008-08-26 | 2010-04-08 | Nuflare Technology Inc | ヒータ、半導体製造装置および半導体製造方法 |
| USD693301S1 (en) * | 2010-03-12 | 2013-11-12 | Fluke Corporation | Rogowski coil |
| JP1541874S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 2015-03-16 | 2016-01-18 | ||
| USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
-
2019
- 2019-04-24 JP JPD2019-9164F patent/JP1651167S/ja active Active
- 2019-10-15 US US29/709,589 patent/USD913230S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD913230S1 (en) | 2021-03-16 |