JP1537979S - - Google Patents

Info

Publication number
JP1537979S
JP1537979S JPD2015-8835F JP2015008835F JP1537979S JP 1537979 S JP1537979 S JP 1537979S JP 2015008835 F JP2015008835 F JP 2015008835F JP 1537979 S JP1537979 S JP 1537979S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2015-8835F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2015-8835F priority Critical patent/JP1537979S/ja
Priority to US29/543,043 priority patent/USD803799S1/en
Priority to TW104305867F priority patent/TWD175795S/zh
Application granted granted Critical
Publication of JP1537979S publication Critical patent/JP1537979S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2015-8835F 2015-04-20 2015-04-20 Active JP1537979S (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2015-8835F JP1537979S (fr) 2015-04-20 2015-04-20
US29/543,043 USD803799S1 (en) 2015-04-20 2015-10-20 Lead frame
TW104305867F TWD175795S (zh) 2015-04-20 2015-10-20 導線框

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-8835F JP1537979S (fr) 2015-04-20 2015-04-20

Publications (1)

Publication Number Publication Date
JP1537979S true JP1537979S (fr) 2015-11-16

Family

ID=54549587

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2015-8835F Active JP1537979S (fr) 2015-04-20 2015-04-20

Country Status (3)

Country Link
US (1) USD803799S1 (fr)
JP (1) JP1537979S (fr)
TW (1) TWD175795S (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD892763S1 (en) * 2018-09-07 2020-08-11 Shenzhen Grandsun Electronic Co., Ltd. Earphone
JP1678672S (fr) * 2019-11-07 2021-02-08

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316821B1 (en) * 1998-09-28 2001-11-13 Cypress Semiconductor Corporation High density lead frames and methods for plastic injection molding
JP3711776B2 (ja) * 1999-02-09 2005-11-02 松下電器産業株式会社 固体電解コンデンサの製造方法およびその製造装置
US6486538B1 (en) * 1999-05-27 2002-11-26 Infineon Technologies Ag Chip carrier having ventilation channels
USD465207S1 (en) * 2001-06-08 2002-11-05 Gem Services, Inc. Leadframe matrix for a surface mount package
USD485243S1 (en) * 2002-10-22 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484103S1 (en) * 2002-11-15 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484858S1 (en) * 2002-11-15 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483336S1 (en) * 2002-11-15 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD492266S1 (en) * 2002-11-15 2004-06-29 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484104S1 (en) 2002-11-25 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483337S1 (en) * 2002-11-25 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD491900S1 (en) * 2002-12-17 2004-06-22 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485244S1 (en) * 2002-12-17 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD486802S1 (en) * 2002-12-17 2004-02-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD494939S1 (en) * 2002-12-17 2004-08-24 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505121S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487431S1 (en) * 2003-01-03 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505122S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485808S1 (en) * 2003-01-03 2004-01-27 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD488136S1 (en) * 2003-01-03 2004-04-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD513608S1 (en) * 2003-01-03 2006-01-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484859S1 (en) * 2003-02-07 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487432S1 (en) 2003-02-07 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD588080S1 (en) * 2007-09-26 2009-03-10 Gem Services, Inc. 2021-8J matrix leadframe
USD588557S1 (en) * 2007-10-02 2009-03-17 Gem Services, Inc. 4040-28J matrix leadframe
JP5634033B2 (ja) * 2008-08-29 2014-12-03 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 樹脂封止型半導体装置とその製造方法
CN102169864B (zh) * 2010-02-26 2015-06-17 飞思卡尔半导体公司 引线框架片材
JP5762078B2 (ja) * 2011-03-28 2015-08-12 新光電気工業株式会社 リードフレーム
JP5875848B2 (ja) * 2011-12-16 2016-03-02 株式会社東芝 フォトカプラの製造方法及びフォトカプラ用リードフレームシート
US8884414B2 (en) * 2013-01-09 2014-11-11 Texas Instruments Incorporated Integrated circuit module with dual leadframe
US9748164B2 (en) * 2013-03-05 2017-08-29 Nichia Corporation Semiconductor device
JP6499387B2 (ja) * 2013-03-05 2019-04-10 日亜化学工業株式会社 リードフレーム及び発光装置
US9171766B2 (en) * 2013-05-03 2015-10-27 Infineon Technologies Ag Lead frame strips with support members
JP6603982B2 (ja) * 2013-07-31 2019-11-13 日亜化学工業株式会社 リードフレーム、樹脂付きリードフレーム、樹脂パッケージ、発光装置及び樹脂パッケージの製造方法
US9263419B2 (en) * 2013-08-30 2016-02-16 Infineon Technologies Ag Lead frame strips with electrical isolation of die paddles
US9252063B2 (en) * 2014-07-07 2016-02-02 Infineon Technologies Ag Extended contact area for leadframe strip testing
US9337130B2 (en) * 2014-07-28 2016-05-10 Texas Instruments Incorporated Leadframe strip and leadframes
JP6573356B2 (ja) * 2015-01-22 2019-09-11 大口マテリアル株式会社 リードフレーム

Also Published As

Publication number Publication date
TWD175795S (zh) 2016-05-21
USD803799S1 (en) 2017-11-28

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