JP1534138S - - Google Patents

Info

Publication number
JP1534138S
JP1534138S JPD2014-25308F JP2014025308F JP1534138S JP 1534138 S JP1534138 S JP 1534138S JP 2014025308 F JP2014025308 F JP 2014025308F JP 1534138 S JP1534138 S JP 1534138S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2014-25308F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2014-25308F priority Critical patent/JP1534138S/ja
Priority to US29/524,898 priority patent/USD785576S1/en
Priority to TW104302466F priority patent/TWD171962S/zh
Application granted granted Critical
Publication of JP1534138S publication Critical patent/JP1534138S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2014-25308F 2014-11-13 2014-11-13 Active JP1534138S (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2014-25308F JP1534138S (ko) 2014-11-13 2014-11-13
US29/524,898 USD785576S1 (en) 2014-11-13 2015-04-24 Dummy wafer
TW104302466F TWD171962S (zh) 2014-11-13 2015-05-11 仿真晶圓之部分（三）

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2014-25308F JP1534138S (ko) 2014-11-13 2014-11-13

Publications (1)

Publication Number Publication Date
JP1534138S true JP1534138S (ko) 2015-09-28

Family

ID=54206980

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2014-25308F Active JP1534138S (ko) 2014-11-13 2014-11-13

Country Status (3)

Country Link
US (1) USD785576S1 (ko)
JP (1) JP1534138S (ko)
TW (1) TWD171962S (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD897974S1 (en) * 2018-03-29 2020-10-06 Hamamatsu Photonics K.K. Semiconductor wafer
TWD230098S (zh) 2022-01-27 2024-02-21 晶成半導體股份有限公司 新竹市科學園區力行五路5號1樓 (中華民國) 晶圓
TWD231013S (zh) 2022-01-27 2024-05-01 晶成半導體股份有限公司 新竹市科學園區力行五路5號1樓 (中華民國) 晶圓
TWD230097S (zh) 2022-01-27 2024-02-21 晶成半導體股份有限公司 新竹市科學園區力行五路5號1樓 (中華民國) 晶圓

Family Cites Families (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US198816A (en) * 1878-01-01 Improvement in carpet-linings
US415734A (en) 1889-11-26 Fire-kindler
US1769409A (en) * 1928-05-11 1930-07-01 Charles L Armstrong Vermin repellent
FR2402633A1 (fr) 1977-09-09 1979-04-06 Produits Refractaires Dalles ameliorees en fibres refractaires pour l'isolation thermique de fours et analogues
US4460634A (en) * 1979-12-29 1984-07-17 Masaaki Hasegawa Adhesive sheet and method for manufacturing the same
USD273860S (en) 1981-09-08 1984-05-15 Bolt William S Holding pallet for PC boards
USD273582S (en) 1981-09-08 1984-04-24 Bolt William S Holding pallet for PC boards
US4374906A (en) 1981-09-29 1983-02-22 United Technologies Corporation Ribbed electrode substrates
US4450212A (en) 1982-09-30 1984-05-22 Engelhard Corporation Edge seal for a porous gas distribution plate of a fuel cell
USD308247S (en) 1987-03-10 1990-05-29 Bramec Corporation Air conditioner support
US5277761A (en) * 1991-06-28 1994-01-11 The Procter & Gamble Company Cellulosic fibrous structures having at least three regions distinguished by intensive properties
USD320361S (en) 1989-06-02 1991-10-01 Tokyo Electron Limited Wafer probe plate holder
US5458938A (en) * 1993-08-03 1995-10-17 Minnesota Mining And Manufacturing Company Mounting laminate having recessed adhesive areas
US5773110A (en) * 1994-02-28 1998-06-30 Creative Minds Foundation Window painting apparatus and method
US5514439A (en) 1994-10-14 1996-05-07 Sibley; Thomas Wafer support fixtures for rapid thermal processing
JPH08316283A (ja) 1995-05-19 1996-11-29 Kobe Steel Ltd ダミーウエハー
US5766702A (en) * 1995-10-05 1998-06-16 Lin; Chii-Hsiung Laminated ornamental glass
US5662758A (en) * 1996-01-10 1997-09-02 The Procter & Gamble Company Composite material releasably sealable to a target surface when pressed thereagainst and method of making
JPH1012692A (ja) 1996-06-25 1998-01-16 Nisshinbo Ind Inc ダミーウエハ
USD417235S (en) * 1998-12-10 1999-11-30 Mark Malik Personal identification number card
USD562568S1 (en) * 2004-08-17 2008-02-26 Johnston Nik L Two-dimensional sheet material
US6340514B1 (en) * 1999-08-13 2002-01-22 Milliken & Company Cushioned rubber floor mat article comprising at least one integrated rubber protrusion and at least two layers of rubber
US6610390B1 (en) * 1999-08-13 2003-08-26 First Quality Nonwovens, Inc. Nonwoven with non-symmetrical bonding configuration
US7066800B2 (en) 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US6550092B1 (en) * 2000-04-26 2003-04-22 S. C. Johnson & Son, Inc. Cleaning sheet with particle retaining cavities
US6589631B1 (en) * 2000-10-04 2003-07-08 Milliken & Company Flashless rubber floor mat and method
EP1372950A2 (en) * 2000-11-01 2004-01-02 The Procter & Gamble Company Multi-layer substrate for a premoistened wipe capable of controlled fluid release
USD483187S1 (en) * 2002-08-09 2003-12-09 Chiu-Fu Cheng Fabric with decorative pattern
USD508180S1 (en) * 2003-08-21 2005-08-09 Better Life Technology, Llc Floor covering
DE102005004827B4 (de) 2004-02-03 2011-03-31 Disco Corp. Wafer-Unterteilungsverfahren
US7066795B2 (en) 2004-10-12 2006-06-27 Applied Materials, Inc. Polishing pad conditioner with shaped abrasive patterns and channels
USD540272S1 (en) 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
USD552565S1 (en) * 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD544452S1 (en) * 2005-09-08 2007-06-12 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
JP2007075949A (ja) 2005-09-14 2007-03-29 Ebara Corp 研磨プラテン、研磨装置
JP4913517B2 (ja) 2006-09-26 2012-04-11 株式会社ディスコ ウエーハの研削加工方法
TWD122455S1 (zh) 2006-10-10 2008-04-11 東京威力科創股份有限公司 半導體製造用腔室本體
TWI303595B (en) 2006-11-24 2008-12-01 Univ Nat Taiwan Science Tech Polishing apparatus and pad replacing method thereof
USD589473S1 (en) 2007-05-30 2009-03-31 Nitto Denko Corporation Adhesive film material for use in manufacturing semiconductors
US7632170B2 (en) 2007-06-25 2009-12-15 Novellus Systems, Inc. CMP apparatuses with polishing assemblies that provide for the passive removal of slurry
USD598380S1 (en) * 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
TWD136587S1 (zh) 2008-07-22 2010-08-21 東京威力科創股份有限公司 晶圓吸附板
USD670917S1 (en) * 2011-02-18 2012-11-20 Columbia Sportswear North America, Inc. Heat reflective lining material
USD621804S1 (en) 2009-08-07 2010-08-17 Hon Hai Precision Industry Co., Ltd. PCB for arranging LED lights
USD633673S1 (en) * 2010-02-10 2011-03-01 The Libman Company Cloth
USD633672S1 (en) * 2010-02-10 2011-03-01 The Libman Company Pad
CA138030S (en) 2010-08-17 2011-11-17 Sumitomo Electric Industries Semiconductor substrate
JP1441120S (ko) 2010-08-17 2015-05-11
CA138031S (en) 2010-08-17 2011-11-17 Sumitomo Electric Industries Semiconductor substrate
USD674759S1 (en) * 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD720310S1 (en) 2011-06-17 2014-12-30 Soraa, Inc. Triangular semiconductor die
USD684551S1 (en) 2011-07-07 2013-06-18 Phuong Van Nguyen Wafer polishing pad holder
USD676672S1 (en) * 2011-08-25 2013-02-26 Lg Hausys, Ltd. Sheet for vehicle seats
USD677062S1 (en) * 2011-08-25 2013-03-05 Lg Hausys, Ltd. Sheet for vehicle seats
USD690671S1 (en) * 2012-03-20 2013-10-01 Veeco Instruments Inc. Wafer carrier having pockets
USD686175S1 (en) * 2012-03-20 2013-07-16 Veeco Instruments Inc. Wafer carrier having pockets
USD686582S1 (en) * 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD695241S1 (en) * 2012-03-20 2013-12-10 Veeco Instruments Inc. Wafer carrier having pockets
USD699908S1 (en) * 2012-08-04 2014-02-18 Hangzhou Jeenor Cleaning Supplies Co., Ltd. Big dot pattern wiper
USD699201S1 (en) 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
USD703162S1 (en) 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
USD751999S1 (en) 2012-12-31 2016-03-22 Soraa, Inc. Array of triangular semiconductor dice
USD740035S1 (en) * 2013-04-29 2015-10-06 Vorwek & Co. Interholding Gmbh Floor covering with dot pattern
USD761745S1 (en) 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD733960S1 (en) 2014-02-18 2015-07-07 Southpac Trust International Inc. Light fixture lens with elevated strip features
USD766850S1 (en) 2014-03-28 2016-09-20 Tokyo Electron Limited Wafer holder for manufacturing semiconductor
USD720313S1 (en) 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication
USD768115S1 (en) 2015-02-05 2016-10-04 Armen E. Kazanchian Module

Also Published As

Publication number Publication date
USD785576S1 (en) 2017-05-02
TWD171962S (zh) 2015-11-21

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