ITVA910002A0 - Piastrina metallica di dissipazione del calore di un dispositivo a semiconduttore di potenza incapsulato in resina fornita di rilievi per la saldatura dei fili di massa - Google Patents

Piastrina metallica di dissipazione del calore di un dispositivo a semiconduttore di potenza incapsulato in resina fornita di rilievi per la saldatura dei fili di massa

Info

Publication number
ITVA910002A0
ITVA910002A0 IT91VA2A ITVA910002A ITVA910002A0 IT VA910002 A0 ITVA910002 A0 IT VA910002A0 IT 91VA2 A IT91VA2 A IT 91VA2A IT VA910002 A ITVA910002 A IT VA910002A IT VA910002 A0 ITVA910002 A0 IT VA910002A0
Authority
IT
Italy
Prior art keywords
soldering
releases
semiconductor device
heat dissipation
power semiconductor
Prior art date
Application number
IT91VA2A
Other languages
English (en)
Inventor
Bosca Pietro Della
Angelo Massironi
Original Assignee
Sgs Thomson Microelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Thomson Microelectronics filed Critical Sgs Thomson Microelectronics
Priority to IT91VA2 priority Critical patent/IT1250405B/it
Publication of ITVA910002A0 publication Critical patent/ITVA910002A0/it
Priority to EP19920830029 priority patent/EP0497744B1/en
Priority to DE1992613269 priority patent/DE69213269T2/de
Priority to US07/830,402 priority patent/US5229918A/en
Priority to JP04596292A priority patent/JP3178618B2/ja
Publication of ITVA910002A1 publication Critical patent/ITVA910002A1/it
Application granted granted Critical
Publication of IT1250405B publication Critical patent/IT1250405B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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    • H01L2224/732—Location after the connecting process
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IT91VA2 1991-01-31 1991-01-31 Piastrina metallica di dissipazione del calore di un dispositivo a semiconduttore di potenza incapsulato in resina fornita di rilievi per la saldatura dei fili di massa IT1250405B (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IT91VA2 IT1250405B (it) 1991-01-31 1991-01-31 Piastrina metallica di dissipazione del calore di un dispositivo a semiconduttore di potenza incapsulato in resina fornita di rilievi per la saldatura dei fili di massa
EP19920830029 EP0497744B1 (en) 1991-01-31 1992-01-24 Metal heat sink baseplate for a resin-encapsulated semiconductor device, having raised portions for welding ground connection wires thereon
DE1992613269 DE69213269T2 (de) 1991-01-31 1992-01-24 Metall-Basisplatte wie Wärmesenke für eine Plastikumhüllte Halbleiteranordnung mit erhöhten Teilen zum Löten von Erdschluss-Verbindungsdrähten
US07/830,402 US5229918A (en) 1991-01-31 1992-01-30 Metal heat sink baseplate for a semiconductor device
JP04596292A JP3178618B2 (ja) 1991-01-31 1992-01-31 接地接続ワイヤ用隆起部を有する樹脂カプセル封入された半導体デバイス用金属製放熱用ベースプレート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT91VA2 IT1250405B (it) 1991-01-31 1991-01-31 Piastrina metallica di dissipazione del calore di un dispositivo a semiconduttore di potenza incapsulato in resina fornita di rilievi per la saldatura dei fili di massa

Publications (3)

Publication Number Publication Date
ITVA910002A0 true ITVA910002A0 (it) 1991-01-31
ITVA910002A1 ITVA910002A1 (it) 1992-08-01
IT1250405B IT1250405B (it) 1995-04-07

Family

ID=11423105

Family Applications (1)

Application Number Title Priority Date Filing Date
IT91VA2 IT1250405B (it) 1991-01-31 1991-01-31 Piastrina metallica di dissipazione del calore di un dispositivo a semiconduttore di potenza incapsulato in resina fornita di rilievi per la saldatura dei fili di massa

Country Status (5)

Country Link
US (1) US5229918A (it)
EP (1) EP0497744B1 (it)
JP (1) JP3178618B2 (it)
DE (1) DE69213269T2 (it)
IT (1) IT1250405B (it)

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Publication number Priority date Publication date Assignee Title
IT1252136B (it) * 1991-11-29 1995-06-05 St Microelectronics Srl Struttura di dispositivo a semiconduttore con dissipatore metallico e corpo in plastica, con mezzi per una connessione elettrica al dissipatore di alta affidabilita'
US5328079A (en) * 1993-03-19 1994-07-12 National Semiconductor Corporation Method of and arrangement for bond wire connecting together certain integrated circuit components
EP0698922B1 (en) * 1994-08-12 2001-06-06 STMicroelectronics S.r.l. Leadframe for supporting integrated semiconductor devices
US5696405A (en) * 1995-10-13 1997-12-09 Lucent Technologies Inc. Microelectronic package with device cooling
US5825625A (en) * 1996-05-20 1998-10-20 Hewlett-Packard Company Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink
DE19625384A1 (de) * 1996-06-25 1998-01-02 Siemens Ag Zusammengesetzter Leiterrahmen
EP0817261B1 (en) * 1996-06-28 2003-04-23 STMicroelectronics S.r.l. Method for manufacturing plastic package for electronic device having a fully insulated dissipator
JP2907186B2 (ja) * 1997-05-19 1999-06-21 日本電気株式会社 半導体装置、その製造方法
FR2764114B1 (fr) * 1997-06-02 2003-04-25 Sgs Thomson Microelectronics Dispositif semi-conducteur muni d'un dissipateur thermique
US5960535A (en) * 1997-10-28 1999-10-05 Hewlett-Packard Company Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink
US6005776A (en) * 1998-01-05 1999-12-21 Intel Corporation Vertical connector based packaging solution for integrated circuits
US6476481B2 (en) 1998-05-05 2002-11-05 International Rectifier Corporation High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
EP0987747A1 (en) 1998-09-17 2000-03-22 STMicroelectronics S.r.l. Process for improving the adhesion between metal and plastic in containment structures for electronic semiconductor devices
US6748656B2 (en) * 2000-07-21 2004-06-15 Ats Automation Tooling Systems Inc. Folded-fin heatsink manufacturing method and apparatus
JP2013135022A (ja) * 2011-12-26 2013-07-08 Toyota Motor Corp 半導体装置
KR200494343Y1 (ko) * 2019-08-05 2021-09-17 민정호 기능성 안전모 및 기능성 안전모 사고방지 시스템
JP2022063589A (ja) * 2020-10-12 2022-04-22 株式会社マキタ 作業機

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4132856A (en) * 1977-11-28 1979-01-02 Burroughs Corporation Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby
JPS55113349A (en) * 1979-02-23 1980-09-01 Hitachi Ltd Semiconductor device
JPH064595Y2 (ja) * 1988-02-24 1994-02-02 日本電気株式会社 ハイブリッドｉｃ

Also Published As

Publication number Publication date
ITVA910002A1 (it) 1992-08-01
EP0497744B1 (en) 1996-09-04
DE69213269D1 (de) 1996-10-10
US5229918A (en) 1993-07-20
EP0497744A1 (en) 1992-08-05
JPH0823055A (ja) 1996-01-23
JP3178618B2 (ja) 2001-06-25
DE69213269T2 (de) 1997-01-23
IT1250405B (it) 1995-04-07

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