ITTO940006A0 - Procedimento per produrre un wafer di semiconduttore e corrispondente sistema. - Google Patents
Procedimento per produrre un wafer di semiconduttore e corrispondente sistema.Info
- Publication number
- ITTO940006A0 ITTO940006A0 ITTO940006A ITTO940006A ITTO940006A0 IT TO940006 A0 ITTO940006 A0 IT TO940006A0 IT TO940006 A ITTO940006 A IT TO940006A IT TO940006 A ITTO940006 A IT TO940006A IT TO940006 A0 ITTO940006 A0 IT TO940006A0
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- producing
- semiconductor wafer
- corresponding system
- wafer
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
- Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1111—Using solvent during delaminating [e.g., water dissolving adhesive at bonding face during delamination, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/04—Processes
- Y10T83/0448—With subsequent handling [i.e., of product]
- Y10T83/0472—By moving work support to which a tacky product is adhered
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP05002867A JP3119324B2 (ja) | 1993-01-11 | 1993-01-11 | ウェーハのスライスベースの剥離装置 |
JP286593A JP3116619B2 (ja) | 1993-01-11 | 1993-01-11 | 半導体ウェーハの製造システム |
JP286893A JP2917262B2 (ja) | 1993-01-11 | 1993-01-11 | 半導体ウェーハの洗浄・乾燥装置 |
JP286693A JP3119323B2 (ja) | 1993-01-11 | 1993-01-11 | インゴットの搬送装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
ITTO940006A0 true ITTO940006A0 (it) | 1994-01-10 |
ITTO940006A1 ITTO940006A1 (it) | 1995-07-10 |
IT1267970B1 IT1267970B1 (it) | 1997-02-20 |
Family
ID=27453733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT94TO000006 IT1267970B1 (it) | 1993-01-11 | 1994-01-10 | Procedimento per produrre un wafer di semiconduttore e corrispondente sistema. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5427644A (it) |
KR (1) | KR100197090B1 (it) |
DE (1) | DE4400221C2 (it) |
IT (1) | IT1267970B1 (it) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0183513B1 (ko) * | 1994-03-22 | 1999-04-15 | 오쯔보 히데오 | 웨이퍼 슬라이스 베이스 박리장치 |
JPH07323420A (ja) * | 1994-06-02 | 1995-12-12 | Tokyo Seimitsu Co Ltd | ウェーハ製造方法及びその装置 |
JP2642317B2 (ja) * | 1994-08-03 | 1997-08-20 | ソマール株式会社 | フィルム剥離方法及び装置 |
US6074442A (en) * | 1994-10-28 | 2000-06-13 | Shin-Etsu Handotai Co., Ltd. | Method of separating slice base mounting member from wafer and jig adapted therefor |
JP4220580B2 (ja) * | 1995-02-10 | 2009-02-04 | 三菱電機株式会社 | 半導体装置の製造装置 |
DE19519460A1 (de) * | 1995-05-26 | 1996-11-28 | Wacker Siltronic Halbleitermat | Drahtsäge und Verfahren zum Abtrennen von Scheiben von einem Werkstück |
JPH0936080A (ja) * | 1995-07-13 | 1997-02-07 | Toray Eng Co Ltd | 加工済シリコンインゴットの洗浄方法 |
US6006736A (en) * | 1995-07-12 | 1999-12-28 | Memc Electronic Materials, Inc. | Method and apparatus for washing silicon ingot with water to remove particulate matter |
US5950643A (en) * | 1995-09-06 | 1999-09-14 | Miyazaki; Takeshiro | Wafer processing system |
US5766369A (en) * | 1995-10-05 | 1998-06-16 | Texas Instruments Incorporated | Method to reduce particulates in device manufacture |
TW363903B (en) * | 1996-03-11 | 1999-07-11 | Memc Electronic Materials Spa | Apparatus for use in automatically cleaning semiconductor wafers and methods for drying a semiconductor wafer in the automatic drying machine |
EP0817246B1 (en) * | 1996-06-24 | 2005-02-02 | Interuniversitair Microelektronica Centrum Vzw | Apparatus and method for wet cleaning or etching of flat substrates |
DE69732392T8 (de) | 1996-06-24 | 2006-04-27 | Interuniversitair Microelectronica Centrum Vzw | Vorrichtung und Verfahren zur Nassreinigung oder zum Ätzen eines flachen Substrats |
EP0849772A1 (en) * | 1996-12-20 | 1998-06-24 | Interuniversitair Micro-Elektronica Centrum Vzw | Apparatus and method for wet cleaning or etching of flat substrates |
JPH11123658A (ja) * | 1997-10-21 | 1999-05-11 | Speedfam Co Ltd | ドレッサ及びドレッシング装置 |
JPH11283942A (ja) * | 1998-03-30 | 1999-10-15 | Shin Etsu Handotai Co Ltd | ウェーハの回収方法および回収設備 |
US7793668B2 (en) * | 2000-06-06 | 2010-09-14 | Nitto Denko Corporation | Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them |
US20050118414A1 (en) * | 2002-06-19 | 2005-06-02 | Nitto Denko Corporation | Cleaning sheets, transfer member having cleaning function, and method of cleaning substrate-processing apparatus with these |
JP2004223696A (ja) * | 2002-11-26 | 2004-08-12 | Musashi Seimitsu Ind Co Ltd | 研削方法及びその装置 |
WO2005109492A1 (en) * | 2004-05-07 | 2005-11-17 | Hanmi Semiconductor Co., Ltd | Sawing and handler system for manufacturing semiconductor package |
JP2008166804A (ja) * | 2006-12-29 | 2008-07-17 | Siltron Inc | 太陽電池用基板の洗浄方法 |
JP4964107B2 (ja) * | 2007-12-03 | 2012-06-27 | 東京応化工業株式会社 | 剥離装置 |
DE102008022476B3 (de) * | 2008-05-07 | 2009-12-24 | Siltronic Ag | Verfahren zur mechanischen Bearbeitung einer Scheibe |
KR20120027237A (ko) * | 2009-04-16 | 2012-03-21 | 수스 마이크로텍 리소그라피 게엠바하 | 웨이퍼 가접합 및 분리를 위한 개선된 장치 |
CN105466709B (zh) * | 2015-11-20 | 2018-03-02 | 同济大学 | 用于框架结构连续性倒塌装配式去柱装置 |
CN113695308B (zh) * | 2021-07-20 | 2023-01-13 | 山东力冠微电子装备有限公司 | 一种半导体晶圆前处理系统 |
CN114043634B (zh) * | 2021-11-12 | 2024-02-20 | 中山市海晶电子有限公司 | 一种晶圆切割装夹设备 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4390392A (en) * | 1980-09-16 | 1983-06-28 | Texas Instruments Incorporated | Method for removal of minute physical damage to silicon wafers by employing laser annealing |
US4420909B2 (en) * | 1981-11-10 | 1997-06-10 | Silicon Technology | Wafering system |
US4599558A (en) * | 1983-12-14 | 1986-07-08 | Ibm | Photovoltaic imaging for large area semiconductors |
US4897141A (en) * | 1984-12-06 | 1990-01-30 | Valtech Corporation | Method for preparing semiconductor wafers |
US4638601A (en) * | 1985-11-04 | 1987-01-27 | Silicon Technology Corporation | Automatic edge grinder |
US4852304A (en) * | 1987-10-29 | 1989-08-01 | Tokyo Seimtsu Co., Ltd. | Apparatus and method for slicing a wafer |
GB8806892D0 (en) * | 1988-03-23 | 1988-04-27 | Unilever Plc | Lactams their synthesis & use in cosmetic compositions |
US4984392A (en) * | 1988-09-29 | 1991-01-15 | Shin-Etsu Handotai Company Limited | Chamfering the notch of a semiconductor wafer |
US5024207A (en) * | 1989-10-30 | 1991-06-18 | Motorola, Inc. | Heating apparatus and method for semiconductor material slicing process |
EP0460437B1 (en) * | 1990-05-18 | 1997-09-10 | Fujitsu Limited | Method of manufacturing semiconductor substrate and method of manufacturing semiconductor device composed of the substrate |
US5189843A (en) * | 1990-08-30 | 1993-03-02 | Silicon Technology Corporation | Wafer slicing and grinding machine and a method of slicing and grinding wafers |
-
1993
- 1993-12-16 US US08/167,025 patent/US5427644A/en not_active Expired - Fee Related
-
1994
- 1994-01-05 DE DE4400221A patent/DE4400221C2/de not_active Expired - Fee Related
- 1994-01-10 KR KR1019940000301A patent/KR100197090B1/ko not_active IP Right Cessation
- 1994-01-10 IT IT94TO000006 patent/IT1267970B1/it active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
IT1267970B1 (it) | 1997-02-20 |
KR940018901A (ko) | 1994-08-19 |
DE4400221C2 (de) | 1999-03-11 |
ITTO940006A1 (it) | 1995-07-10 |
KR100197090B1 (ko) | 1999-06-15 |
US5427644A (en) | 1995-06-27 |
DE4400221A1 (de) | 1994-07-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted | ||
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19990129 |