ITRM20070008A1 - Sensore di immagini e relativo metodo di produzione - Google Patents

Sensore di immagini e relativo metodo di produzione

Info

Publication number
ITRM20070008A1
ITRM20070008A1 IT000008A ITRM20070008A ITRM20070008A1 IT RM20070008 A1 ITRM20070008 A1 IT RM20070008A1 IT 000008 A IT000008 A IT 000008A IT RM20070008 A ITRM20070008 A IT RM20070008A IT RM20070008 A1 ITRM20070008 A1 IT RM20070008A1
Authority
IT
Italy
Prior art keywords
image sensor
production method
related production
sensor
image
Prior art date
Application number
IT000008A
Other languages
English (en)
Inventor
Takafumi Endo
Yohei Nokami
Original Assignee
Mitsubishi Electric Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corporation filed Critical Mitsubishi Electric Corporation
Publication of ITRM20070008A1 publication Critical patent/ITRM20070008A1/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
IT000008A 2006-04-28 2007-01-08 Sensore di immagini e relativo metodo di produzione ITRM20070008A1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006125208A JP4215071B2 (ja) 2006-04-28 2006-04-28 イメージセンサ及びその製造方法

Publications (1)

Publication Number Publication Date
ITRM20070008A1 true ITRM20070008A1 (it) 2007-10-29

Family

ID=38647550

Family Applications (1)

Application Number Title Priority Date Filing Date
IT000008A ITRM20070008A1 (it) 2006-04-28 2007-01-08 Sensore di immagini e relativo metodo di produzione

Country Status (5)

Country Link
US (2) US7612425B2 (it)
JP (1) JP4215071B2 (it)
CN (1) CN101064763B (it)
DE (1) DE102007001420B4 (it)
IT (1) ITRM20070008A1 (it)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4771105B2 (ja) * 2009-03-31 2011-09-14 ブラザー工業株式会社 画像読取装置
CN102857668B (zh) * 2012-09-25 2016-07-27 威海华菱光电股份有限公司 线阵图像传感器和线阵图像读取装置
JP2015022291A (ja) * 2013-07-23 2015-02-02 ニスカ株式会社 イメージセンサーユニット及び画像読取装置
US11876108B2 (en) * 2020-11-17 2024-01-16 Semiconductor Components Industries, Llc Semiconductor packages with an array of single-photon avalanche diodes split between multiple semiconductor dice

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59127017A (ja) * 1983-01-12 1984-07-21 Olympus Optical Co Ltd 光学走査装置
JPS60191548A (ja) * 1984-03-12 1985-09-30 Hitachi Ltd イメ−ジセンサ
JPH02105773A (ja) * 1988-10-14 1990-04-18 Nippon Sheet Glass Co Ltd 画像読取り装置
JPH0344966A (ja) * 1989-07-13 1991-02-26 Sony Corp 固体撮像装置
US5412229A (en) * 1990-08-31 1995-05-02 Sumitomo Electric Industries, Ltd. Semiconductor light detecting device making use of a photodiode chip
JPH06218985A (ja) 1993-01-28 1994-08-09 Rohm Co Ltd 光学素子チップおよびこれを利用した光学的書き込みまたは読み取り装置
EP0710366A4 (en) * 1993-07-16 1997-12-03 Lightpath Tech Inc GRADIENT REFRACTION INDEX LENS ELEMENTS
JPH07115180A (ja) * 1993-10-15 1995-05-02 Canon Inc イメージセンサー及びその製造方法及び情報処理装置
JP2784138B2 (ja) * 1993-12-09 1998-08-06 三菱電機株式会社 イメージセンサ
US5617500A (en) * 1994-05-20 1997-04-01 Nikon Corporation System for detecting an optical information and scanning microscope system
JP3405620B2 (ja) * 1995-05-22 2003-05-12 松下電器産業株式会社 固体撮像装置
JPH11261857A (ja) * 1998-03-11 1999-09-24 Canon Inc 撮像装置
AUPP704098A0 (en) * 1998-11-10 1998-12-03 Bishop Innovation Pty Limited Optical sensor
JP2001188106A (ja) * 1999-12-28 2001-07-10 Sharp Corp マイクロレンズアレイおよびその製造方法
JP3693924B2 (ja) * 2001-01-18 2005-09-14 三菱電機株式会社 イメージセンサ
JP3693162B2 (ja) * 2001-03-14 2005-09-07 シャープ株式会社 固体撮像装置
CN1138228C (zh) * 2001-07-13 2004-02-11 山东华菱电子有限公司 接触式图像传感器
JP2003101724A (ja) 2001-09-25 2003-04-04 Konica Corp 画像読取装置及び画像形成装置
WO2004034477A1 (en) * 2002-10-11 2004-04-22 Smal Camera Technologies Optical system comprising a solid-state image sensor with microlenses and a non-telecentric taking lens
JP3829853B2 (ja) * 2004-03-31 2006-10-04 三菱電機株式会社 イメージセンサ
US20080264107A1 (en) * 2004-11-17 2008-10-30 Yacov Malinovich Methods and Process of Tapering Waveguides and of Forming Optimized Waveguide Structures

Also Published As

Publication number Publication date
US7858401B2 (en) 2010-12-28
JP2007300285A (ja) 2007-11-15
DE102007001420A1 (de) 2007-12-27
CN101064763A (zh) 2007-10-31
US20080166825A1 (en) 2008-07-10
US20070252225A1 (en) 2007-11-01
US7612425B2 (en) 2009-11-03
DE102007001420B4 (de) 2013-01-03
CN101064763B (zh) 2010-12-22
JP4215071B2 (ja) 2009-01-28

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