ITMI20071995A1 - Componente micromeccanico con circuito monoliticamente imtegrato e procedimento atto alla fabbricazione di un componente - Google Patents
Componente micromeccanico con circuito monoliticamente imtegrato e procedimento atto alla fabbricazione di un componenteInfo
- Publication number
- ITMI20071995A1 ITMI20071995A1 IT001995A ITMI20071995A ITMI20071995A1 IT MI20071995 A1 ITMI20071995 A1 IT MI20071995A1 IT 001995 A IT001995 A IT 001995A IT MI20071995 A ITMI20071995 A IT MI20071995A IT MI20071995 A1 ITMI20071995 A1 IT MI20071995A1
- Authority
- IT
- Italy
- Prior art keywords
- component
- imtegrated
- monolithically
- procedure
- manufacture
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
- B81C1/00246—Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
- B81C2203/0707—Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure
- B81C2203/0757—Topology for facilitating the monolithic integration
- B81C2203/0778—Topology for facilitating the monolithic integration not provided for in B81C2203/0764 - B81C2203/0771
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006049256 | 2006-10-19 | ||
DE102006052630A DE102006052630A1 (de) | 2006-10-19 | 2006-11-08 | Mikromechanisches Bauelement mit monolithisch integrierter Schaltung und Verfahren zur Herstellung eines Bauelements |
Publications (1)
Publication Number | Publication Date |
---|---|
ITMI20071995A1 true ITMI20071995A1 (it) | 2008-04-20 |
Family
ID=39198515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT001995A ITMI20071995A1 (it) | 2006-10-19 | 2007-10-16 | Componente micromeccanico con circuito monoliticamente imtegrato e procedimento atto alla fabbricazione di un componente |
Country Status (4)
Country | Link |
---|---|
US (1) | US20080093690A1 (it) |
JP (1) | JP5812558B2 (it) |
DE (1) | DE102006052630A1 (it) |
IT (1) | ITMI20071995A1 (it) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7943525B2 (en) * | 2008-12-19 | 2011-05-17 | Freescale Semiconductor, Inc. | Method of producing microelectromechanical device with isolated microstructures |
KR102097378B1 (ko) * | 2013-07-04 | 2020-04-06 | 도레이 카부시키가이샤 | 불순물 확산 조성물 및 반도체 소자의 제조 방법 |
US11145752B2 (en) | 2019-09-17 | 2021-10-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Residue removal in metal gate cutting process |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5220189A (en) * | 1983-07-06 | 1993-06-15 | Honeywell Inc. | Micromechanical thermoelectric sensor element |
US5235187A (en) * | 1991-05-14 | 1993-08-10 | Cornell Research Foundation | Methods of fabricating integrated, aligned tunneling tip pairs |
DE4241045C1 (de) * | 1992-12-05 | 1994-05-26 | Bosch Gmbh Robert | Verfahren zum anisotropen Ätzen von Silicium |
JP3896158B2 (ja) * | 1993-02-04 | 2007-03-22 | コーネル・リサーチ・ファウンデーション・インコーポレイテッド | マイクロ構造及びその製造のためのシングルマスク、単結晶プロセス |
DE4418207C1 (de) * | 1994-05-25 | 1995-06-22 | Siemens Ag | Thermischer Sensor/Aktuator in Halbleitermaterial |
JP3761918B2 (ja) * | 1994-09-13 | 2006-03-29 | 株式会社東芝 | 半導体装置の製造方法 |
US6316796B1 (en) * | 1995-05-24 | 2001-11-13 | Lucas Novasensor | Single crystal silicon sensor with high aspect ratio and curvilinear structures |
DE19706682C2 (de) * | 1997-02-20 | 1999-01-14 | Bosch Gmbh Robert | Anisotropes fluorbasiertes Plasmaätzverfahren für Silizium |
US6683358B1 (en) * | 1997-11-11 | 2004-01-27 | Asahi Kasei Kabushiki Kaisha | Silicon integrated accelerometer |
JP2002510139A (ja) * | 1998-01-15 | 2002-04-02 | コーネル・リサーチ・ファンデーション・インコーポレイテッド | ミクロ加工デバイスのトレンチアイソレーション |
US6020272A (en) * | 1998-10-08 | 2000-02-01 | Sandia Corporation | Method for forming suspended micromechanical structures |
DE10006035A1 (de) * | 2000-02-10 | 2001-08-16 | Bosch Gmbh Robert | Verfahren zur Herstellung eines mikromechanischen Bauelements sowie ein nach dem Verfahren hergestelltes Bauelement |
FI113704B (fi) * | 2001-03-21 | 2004-05-31 | Vti Technologies Oy | Menetelmä piianturin valmistamiseksi sekä piianturi |
US6657259B2 (en) * | 2001-12-04 | 2003-12-02 | International Business Machines Corporation | Multiple-plane FinFET CMOS |
US6762116B1 (en) * | 2002-06-12 | 2004-07-13 | Zyvex Corporation | System and method for fabricating microcomponent parts on a substrate having pre-fabricated electronic circuitry thereon |
JP2005039652A (ja) * | 2003-07-17 | 2005-02-10 | Hosiden Corp | 音響検出機構 |
DE102004043356A1 (de) * | 2004-09-08 | 2006-03-09 | Robert Bosch Gmbh | Sensorelement mit getrenchter Kaverne |
DE102004061796A1 (de) * | 2004-12-22 | 2006-07-13 | Robert Bosch Gmbh | Mikromechanisches kapazitives Sensorelement |
DE102005004877A1 (de) * | 2005-02-03 | 2006-08-10 | Robert Bosch Gmbh | Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren |
JP4724488B2 (ja) * | 2005-02-25 | 2011-07-13 | 日立オートモティブシステムズ株式会社 | 集積化マイクロエレクトロメカニカルシステム |
DE102006022378A1 (de) * | 2006-05-12 | 2007-11-22 | Robert Bosch Gmbh | Verfahren zur Herstellung eines mikromechanischen Bauelements und mikromechanisches Bauelement |
-
2006
- 2006-11-08 DE DE102006052630A patent/DE102006052630A1/de not_active Withdrawn
-
2007
- 2007-10-10 US US11/974,011 patent/US20080093690A1/en not_active Abandoned
- 2007-10-16 IT IT001995A patent/ITMI20071995A1/it unknown
- 2007-10-19 JP JP2007273048A patent/JP5812558B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2008100347A (ja) | 2008-05-01 |
JP5812558B2 (ja) | 2015-11-17 |
US20080093690A1 (en) | 2008-04-24 |
DE102006052630A1 (de) | 2008-04-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SE0700501L (sv) | Mikromekaniskt kombielement och motsvarande framställningsförfarande | |
IT1391790B1 (it) | Procedimento atto alla fabbricazione di un componente micromeccanico comprendente un mezzo volumetricamente elastico e componente micromeccanico | |
ITMI20070119A1 (it) | Componente micromeccanica e relativo procedimento di fabbricazione | |
NO20091286L (no) | Krystallfabrikasjon | |
TWI350384B (en) | Optical film and manufacturing method of the same | |
DK2048941T3 (da) | Fremgangsmåde til opdræt af rovmider | |
NO20076596L (no) | Fremgangsmate for dynamisk oppdatering av en indeks og en sokemotor som implementerer samme | |
BRPI0811680A2 (pt) | "adesivo estrutural de um componente e método" | |
ATE523175T1 (de) | Ophthalmischer injektor | |
FR2901817B1 (fr) | Pont temporaire | |
FI20065348A (fi) | Spektrometri ja inferferometrinen menetelmä | |
BRPI0812708A2 (pt) | Artigo de óptica com propriedades anti-reflexo e proceso de fabricação de um artigo de óptica com propriedades anti-reflexo | |
BRPI0716371A2 (pt) | componente elÁstico de fralda | |
DK2077287T3 (da) | Fremgangsmåde til fremstilling af blødt polyurethanskum | |
ITMI20070061A1 (it) | Processo di fabbricazione di un dispositivo ottico integrato e dispositivo realizzato mediante il processo | |
EP2199835A4 (en) | OPTICAL COMPONENT AND METHOD FOR PRODUCING THE OPTICAL COMPONENT | |
DE602006001461D1 (de) | Optischer parametrischer Verstärker | |
DE602007009053D1 (de) | Beschichtungen auf der basis von fluorchemischen sowie lecithin-zusätzen | |
FI20065464A0 (fi) | Monitoiminen passiivinen taajuussekoitin | |
DE602006005328D1 (de) | Differentialgehäuse | |
ES2600252T8 (es) | Dispositivo y procedimiento de producción y/o de confinamiento de un plasma | |
DK2033487T3 (da) | Høreapparat med et forlænget element | |
IT1392287B1 (it) | Componente micromeccanico e procedimento atto alla fabbricazione di un componente micromeccanico. | |
DE602007014276D1 (de) | Diskreter Stressisolator | |
DE602007011008D1 (de) | Optische Verbindungsteile und optische Verbindungsstruktur |