DE602007014276D1 - Diskreter Stressisolator - Google Patents
Diskreter StressisolatorInfo
- Publication number
- DE602007014276D1 DE602007014276D1 DE602007014276T DE602007014276T DE602007014276D1 DE 602007014276 D1 DE602007014276 D1 DE 602007014276D1 DE 602007014276 T DE602007014276 T DE 602007014276T DE 602007014276 T DE602007014276 T DE 602007014276T DE 602007014276 D1 DE602007014276 D1 DE 602007014276D1
- Authority
- DE
- Germany
- Prior art keywords
- stress isolator
- discrete stress
- discrete
- isolator
- stress
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
- B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/07—Interconnects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73257—Bump and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/326,916 US8129801B2 (en) | 2006-01-06 | 2006-01-06 | Discrete stress isolator attachment structures for MEMS sensor packages |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602007014276D1 true DE602007014276D1 (de) | 2011-06-16 |
Family
ID=37866158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602007014276T Active DE602007014276D1 (de) | 2006-01-06 | 2007-01-08 | Diskreter Stressisolator |
Country Status (4)
Country | Link |
---|---|
US (1) | US8129801B2 (de) |
EP (1) | EP1806315B1 (de) |
JP (1) | JP5048344B2 (de) |
DE (1) | DE602007014276D1 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7830003B2 (en) * | 2007-12-27 | 2010-11-09 | Honeywell International, Inc. | Mechanical isolation for MEMS devices |
US8096182B2 (en) * | 2008-05-29 | 2012-01-17 | Freescale Semiconductor, Inc. | Capacitive sensor with stress relief that compensates for package stress |
US8499629B2 (en) | 2008-10-10 | 2013-08-06 | Honeywell International Inc. | Mounting system for torsional suspension of a MEMS device |
JP5426906B2 (ja) * | 2009-03-10 | 2014-02-26 | パナソニック株式会社 | 加速度センサ |
US8138007B2 (en) | 2009-08-26 | 2012-03-20 | Freescale Semiconductor, Inc. | MEMS device with stress isolation and method of fabrication |
US9686864B2 (en) | 2012-07-31 | 2017-06-20 | Hewlett-Packard Development Company, L.P. | Device including interposer between semiconductor and substrate |
US9663348B1 (en) | 2015-11-09 | 2017-05-30 | Nxp Usa, Inc. | MEMS device with isolation sub-frame structure |
EP3243793B1 (de) | 2016-05-10 | 2018-11-07 | ams AG | Sensorbaugruppe und anordnung und verfahren zur herstellung einer sensorbaugruppe |
EP3301072B1 (de) | 2016-09-30 | 2024-02-21 | Sciosense B.V. | Halbleiterbauelement und verfahren zur herstellung des halbleiterbauelements |
US11312619B1 (en) | 2018-10-04 | 2022-04-26 | EngeniusMicro, LLC | Methods of manufacture of microisolators and devices for mechanical isolation or mechanical damping of microfabricated inertial sensors |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4945765A (en) * | 1988-08-31 | 1990-08-07 | Kearfott Guidance & Navigation Corp. | Silicon micromachined accelerometer |
US5177579A (en) * | 1989-04-07 | 1993-01-05 | Ic Sensors, Inc. | Semiconductor transducer or actuator utilizing corrugated supports |
US5006487A (en) * | 1989-07-27 | 1991-04-09 | Honeywell Inc. | Method of making an electrostatic silicon accelerometer |
DE4107658A1 (de) * | 1991-03-09 | 1992-09-17 | Bosch Gmbh Robert | Montageverfahren fuer mikromechanische sensoren |
JPH06291334A (ja) * | 1993-04-05 | 1994-10-18 | Japan Aviation Electron Ind Ltd | 加速度センサ |
WO1996016435A2 (en) * | 1994-11-23 | 1996-05-30 | Philips Electronics N.V. | Semiconductor device provided with a microcomponent having a fixed and a movable electrode |
JP3555388B2 (ja) * | 1997-06-30 | 2004-08-18 | 株式会社デンソー | 半導体ヨーレートセンサ |
DE19800574B4 (de) * | 1998-01-09 | 2013-11-14 | Robert Bosch Gmbh | Mikromechanisches Bauelement |
US6167761B1 (en) * | 1998-03-31 | 2001-01-02 | Hitachi, Ltd. And Hitachi Car Engineering Co., Ltd. | Capacitance type pressure sensor with capacitive elements actuated by a diaphragm |
US6105427A (en) * | 1998-07-31 | 2000-08-22 | Litton Systems, Inc. | Micro-mechanical semiconductor accelerometer |
US20010001550A1 (en) * | 1998-11-12 | 2001-05-24 | Janusz Bryzek | Integral stress isolation apparatus and technique for semiconductor devices |
US6249073B1 (en) * | 1999-01-14 | 2001-06-19 | The Regents Of The University Of Michigan | Device including a micromechanical resonator having an operating frequency and method of extending same |
US6424074B2 (en) * | 1999-01-14 | 2002-07-23 | The Regents Of The University Of Michigan | Method and apparatus for upconverting and filtering an information signal utilizing a vibrating micromechanical device |
US6577040B2 (en) * | 1999-01-14 | 2003-06-10 | The Regents Of The University Of Michigan | Method and apparatus for generating a signal having at least one desired output frequency utilizing a bank of vibrating micromechanical devices |
US6566786B2 (en) * | 1999-01-14 | 2003-05-20 | The Regents Of The University Of Michigan | Method and apparatus for selecting at least one desired channel utilizing a bank of vibrating micromechanical apparatus |
US6600252B2 (en) * | 1999-01-14 | 2003-07-29 | The Regents Of The University Of Michigan | Method and subsystem for processing signals utilizing a plurality of vibrating micromechanical devices |
US6713938B2 (en) * | 1999-01-14 | 2004-03-30 | The Regents Of The University Of Michigan | Method and apparatus for filtering signals utilizing a vibrating micromechanical resonator |
US6593831B2 (en) * | 1999-01-14 | 2003-07-15 | The Regents Of The University Of Michigan | Method and apparatus for filtering signals in a subsystem including a power amplifier utilizing a bank of vibrating micromechanical apparatus |
US6257059B1 (en) * | 1999-09-24 | 2001-07-10 | The Charles Stark Draper Laboratory, Inc. | Microfabricated tuning fork gyroscope and associated three-axis inertial measurement system to sense out-of-plane rotation |
DE19961578A1 (de) * | 1999-12-21 | 2001-06-28 | Bosch Gmbh Robert | Sensor mit zumindest einer mikromechanischen Struktur und Verfahren zur Herstellung |
JP2001227902A (ja) * | 2000-02-16 | 2001-08-24 | Mitsubishi Electric Corp | 半導体装置 |
US6628177B2 (en) * | 2000-08-24 | 2003-09-30 | The Regents Of The University Of Michigan | Micromechanical resonator device and micromechanical device utilizing same |
US6569754B2 (en) * | 2000-08-24 | 2003-05-27 | The Regents Of The University Of Michigan | Method for making a module including a microplatform |
US6739190B2 (en) * | 2000-08-24 | 2004-05-25 | The Regents Of The University Of Michigan | Micromechanical resonator device |
JP2002098709A (ja) * | 2000-09-26 | 2002-04-05 | Matsushita Electric Works Ltd | 半導体加速度センサ |
US7381630B2 (en) * | 2001-01-02 | 2008-06-03 | The Charles Stark Draper Laboratory, Inc. | Method for integrating MEMS device and interposer |
JP2004518290A (ja) * | 2001-01-24 | 2004-06-17 | ザ リージェンツ オブ ザ ユニバーシティ オブ ミシガン | 高qのマイクロメカニカルデバイス及びその同調方法 |
US6509620B2 (en) * | 2001-05-31 | 2003-01-21 | Hewlett-Packard Company | Flexure coupling block for motion sensor |
EP1394555B1 (de) * | 2002-08-30 | 2012-04-25 | STMicroelectronics S.r.l. | Grenzbeschleunigungsaufnehmer |
US6768196B2 (en) * | 2002-09-04 | 2004-07-27 | Analog Devices, Inc. | Packaged microchip with isolation |
JP4342174B2 (ja) * | 2002-12-27 | 2009-10-14 | 新光電気工業株式会社 | 電子デバイス及びその製造方法 |
JP4238724B2 (ja) * | 2003-03-27 | 2009-03-18 | 株式会社デンソー | 半導体装置 |
JP2004309188A (ja) * | 2003-04-02 | 2004-11-04 | Matsushita Electric Works Ltd | 半導体加速度センサ |
US6930368B2 (en) * | 2003-07-31 | 2005-08-16 | Hewlett-Packard Development Company, L.P. | MEMS having a three-wafer structure |
US6910379B2 (en) * | 2003-10-29 | 2005-06-28 | Honeywell International, Inc. | Out-of-plane compensation suspension for an accelerometer |
DE602005021754D1 (de) * | 2004-02-27 | 2010-07-22 | Atlantic Inertial Systems Ltd | Beschleunigungsmesser |
WO2005086532A2 (en) * | 2004-03-01 | 2005-09-15 | Tessera, Inc. | Packaged acoustic and electromagnetic transducer chips |
JP4847686B2 (ja) * | 2004-05-26 | 2011-12-28 | パナソニック電工株式会社 | 半導体加速度センサ |
JP2005337876A (ja) * | 2004-05-26 | 2005-12-08 | Matsushita Electric Works Ltd | 半導体装置、およびその製造方法 |
-
2006
- 2006-01-06 US US11/326,916 patent/US8129801B2/en active Active
-
2007
- 2007-01-08 DE DE602007014276T patent/DE602007014276D1/de active Active
- 2007-01-08 EP EP07100213A patent/EP1806315B1/de active Active
- 2007-01-09 JP JP2007001509A patent/JP5048344B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1806315A3 (de) | 2009-06-03 |
JP5048344B2 (ja) | 2012-10-17 |
EP1806315B1 (de) | 2011-05-04 |
US8129801B2 (en) | 2012-03-06 |
US20070170525A1 (en) | 2007-07-26 |
EP1806315A2 (de) | 2007-07-11 |
JP2007218902A (ja) | 2007-08-30 |
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