IT963694B - Modulo a tenuta ermetica per unita elementare di circuito integrato e confezione per una molteplicita di tali modul - Google Patents

Modulo a tenuta ermetica per unita elementare di circuito integrato e confezione per una molteplicita di tali modul

Info

Publication number
IT963694B
IT963694B IT27835/72A IT2783572A IT963694B IT 963694 B IT963694 B IT 963694B IT 27835/72 A IT27835/72 A IT 27835/72A IT 2783572 A IT2783572 A IT 2783572A IT 963694 B IT963694 B IT 963694B
Authority
IT
Italy
Prior art keywords
packaging
modules
module
integrated circuit
hermetic seal
Prior art date
Application number
IT27835/72A
Other languages
English (en)
Original Assignee
Singer Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Singer Co filed Critical Singer Co
Application granted granted Critical
Publication of IT963694B publication Critical patent/IT963694B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/18—Construction of rack or frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IT27835/72A 1971-08-20 1972-08-03 Modulo a tenuta ermetica per unita elementare di circuito integrato e confezione per una molteplicita di tali modul IT963694B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17336771A 1971-08-20 1971-08-20

Publications (1)

Publication Number Publication Date
IT963694B true IT963694B (it) 1974-01-21

Family

ID=22631689

Family Applications (1)

Application Number Title Priority Date Filing Date
IT27835/72A IT963694B (it) 1971-08-20 1972-08-03 Modulo a tenuta ermetica per unita elementare di circuito integrato e confezione per una molteplicita di tali modul

Country Status (9)

Country Link
US (1) US3706010A (it)
JP (2) JPS4831456A (it)
CA (1) CA951024A (it)
DE (1) DE2240822A1 (it)
FR (1) FR2150303B1 (it)
GB (1) GB1366000A (it)
IL (1) IL39630A (it)
IT (1) IT963694B (it)
SE (1) SE384427B (it)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2337694C2 (de) 1973-07-25 1984-10-25 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichteranordnung hoher Strombelastbarkeit
US3999105A (en) * 1974-04-19 1976-12-21 International Business Machines Corporation Liquid encapsulated integrated circuit package
US4006388A (en) * 1975-03-03 1977-02-01 Hughes Aircraft Company Thermally controlled electronic system package
JPS5276946U (it) * 1975-12-05 1977-06-08
JPS5271625A (en) * 1975-12-10 1977-06-15 Semikron Gleichrichterbau Semiconductor rectifier device
US4326214A (en) * 1976-11-01 1982-04-20 National Semiconductor Corporation Thermal shock resistant package having an ultraviolet light transmitting window for a semiconductor chip
JPS5591145A (en) * 1978-12-28 1980-07-10 Narumi China Corp Production of ceramic package
US4254446A (en) * 1979-08-30 1981-03-03 Peoples Ric L Modular, hybrid integrated circuit assembly
US4484215A (en) * 1981-05-18 1984-11-20 Burroughs Corporation Flexible mounting support for wafer scale integrated circuits
US4503483A (en) * 1982-05-03 1985-03-05 Hughes Aircraft Company Heat pipe cooling module for high power circuit boards
JPS58158705U (ja) * 1983-03-12 1983-10-22 株式会社神崎高級工機製作所 農用トラクタにおける前輪位置変更装置
US4499523A (en) * 1983-03-30 1985-02-12 International Business Machines Corporation Electronic component assembly with a printed circuit board unit and cover
US4549407A (en) * 1984-04-06 1985-10-29 International Business Machines Corporation Evaporative cooling
US4683489A (en) * 1984-08-08 1987-07-28 Siemens Aktiengesellschaft Common housing for two semi-conductor bodies
US4682268A (en) * 1985-02-07 1987-07-21 Nec Corporation Mounting structure for electronic circuit modules
FR2579060B1 (fr) * 1985-03-18 1987-04-17 Socapex Carte de circuit imprime a echangeur thermique et procede de fabrication d'une telle carte
US4774630A (en) * 1985-09-30 1988-09-27 Microelectronics Center Of North Carolina Apparatus for mounting a semiconductor chip and making electrical connections thereto
DE3536963A1 (de) * 1985-10-17 1987-04-23 Diehl Gmbh & Co Baugruppenanordnung
US4805420A (en) * 1987-06-22 1989-02-21 Ncr Corporation Cryogenic vessel for cooling electronic components
DE3818428C2 (de) * 1987-11-27 1993-11-04 Asea Brown Boveri Kuehldose zum abfuehren der verlustwaerme von halbleiterelementen
US5099254A (en) * 1990-03-22 1992-03-24 Raytheon Company Modular transmitter and antenna array system
US5210440A (en) * 1991-06-03 1993-05-11 Vlsi Technology, Inc. Semiconductor chip cooling apparatus
DE4244721A1 (de) * 1992-05-25 1994-04-21 Mannesmann Ag Elektrische Maschine mit fluidgekühlten Halbleiterelementen
DE4327895A1 (de) * 1993-08-19 1995-02-23 Abb Management Ag Stromrichtermodul
US6188575B1 (en) 1998-06-30 2001-02-13 Intersil Corporation Heat exchanging chassis and method
US8289039B2 (en) * 2009-03-11 2012-10-16 Teradyne, Inc. Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3495132A (en) * 1967-08-03 1970-02-10 Itt Packaging and actuating system for printed circuit boards and electrical connector assemblies

Also Published As

Publication number Publication date
JPS4831456A (it) 1973-04-25
DE2240822A1 (de) 1973-03-15
SE384427B (sv) 1976-05-03
IL39630A0 (en) 1972-08-30
US3706010A (en) 1972-12-12
IL39630A (en) 1975-08-31
FR2150303A1 (it) 1973-04-06
CA951024A (en) 1974-07-09
JPS544361U (it) 1979-01-12
GB1366000A (en) 1974-09-04
FR2150303B1 (it) 1976-08-13

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