IT8522325A0 - Procedimento e relativa apparecchiatura per realizzare contatti metallo-semiconduttore di tipo ohmico. - Google Patents
Procedimento e relativa apparecchiatura per realizzare contatti metallo-semiconduttore di tipo ohmico.Info
- Publication number
- IT8522325A0 IT8522325A0 IT8522325A IT2232585A IT8522325A0 IT 8522325 A0 IT8522325 A0 IT 8522325A0 IT 8522325 A IT8522325 A IT 8522325A IT 2232585 A IT2232585 A IT 2232585A IT 8522325 A0 IT8522325 A0 IT 8522325A0
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- type metal
- related equipment
- making ohmic
- semiconductor contacts
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT22325/85A IT1185964B (it) | 1985-10-01 | 1985-10-01 | Procedimento e relativa apparecchiatura per realizzare contatti metallo-semiconduttore di tipo ohmico |
GB8620131A GB2181297B (en) | 1985-10-01 | 1986-08-19 | Process and relative apparatus for making ohmic type contacts between metal and semiconductor |
NL8602453A NL8602453A (nl) | 1985-10-01 | 1986-09-29 | Werkwijze en inrichting voor het maken van kontakten van het ohmse type tussen metaal en halfgeleider. |
JP61234265A JPS6286716A (ja) | 1985-10-01 | 1986-09-30 | 金属と半導体の間にオ−ム型接続を形成するための方法及びその装置 |
FR8613608A FR2588120A1 (fr) | 1985-10-01 | 1986-09-30 | Procede et appareil correspondant pour etablir des contacts de type ohmique entre un metal et un semi-conducteur |
DE19863633472 DE3633472A1 (de) | 1985-10-01 | 1986-10-01 | Verfahren und vorrichtung zur herstellung ohmscher kontakte zwischen metallen und halbleitern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT22325/85A IT1185964B (it) | 1985-10-01 | 1985-10-01 | Procedimento e relativa apparecchiatura per realizzare contatti metallo-semiconduttore di tipo ohmico |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8522325A0 true IT8522325A0 (it) | 1985-10-01 |
IT1185964B IT1185964B (it) | 1987-11-18 |
Family
ID=11194694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT22325/85A IT1185964B (it) | 1985-10-01 | 1985-10-01 | Procedimento e relativa apparecchiatura per realizzare contatti metallo-semiconduttore di tipo ohmico |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS6286716A (it) |
DE (1) | DE3633472A1 (it) |
FR (1) | FR2588120A1 (it) |
GB (1) | GB2181297B (it) |
IT (1) | IT1185964B (it) |
NL (1) | NL8602453A (it) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5043299B1 (en) * | 1989-12-01 | 1997-02-25 | Applied Materials Inc | Process for selective deposition of tungsten on semiconductor wafer |
EP0448763A1 (de) * | 1990-03-30 | 1991-10-02 | Siemens Aktiengesellschaft | Verfahren und Vorrichtung zur Herstellung von leitenden Schichten oder Strukturen für höchstintegrierte Schaltungen |
US5478780A (en) * | 1990-03-30 | 1995-12-26 | Siemens Aktiengesellschaft | Method and apparatus for producing conductive layers or structures for VLSI circuits |
EP0452888B1 (en) * | 1990-04-16 | 1996-08-21 | Applied Materials, Inc. | Process for forming a layer of titanium silicide on a semiconductor wafer |
DE4339465C2 (de) * | 1993-11-19 | 1997-05-28 | Gold Star Electronics | Verfahren zur Behandlung der Oberfläche eines einer Trockenätzung ausgesetzten Siliciumsubstrats |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1177382A (en) * | 1966-02-24 | 1970-01-14 | Rca Corp Formerly Known As Rad | Method of Making Ohmic Contact to a Semiconductor Body |
BE758321A (fr) * | 1969-11-03 | 1971-04-01 | Rca Corp | Procede de metallisation de dispositifs a semi-conducteurs |
CA965189A (en) * | 1972-01-03 | 1975-03-25 | Signetics Corporation | Semiconductor structure using platinel silicide as a schottky barrier diode and method |
US4056642A (en) * | 1976-05-14 | 1977-11-01 | Data General Corporation | Method of fabricating metal-semiconductor interfaces |
US4107835A (en) * | 1977-02-11 | 1978-08-22 | Bell Telephone Laboratories, Incorporated | Fabrication of semiconductive devices |
DE3103615A1 (de) * | 1981-02-03 | 1982-09-09 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur erzeugung von extremen feinstrukturen |
JPS57157525A (en) * | 1981-03-23 | 1982-09-29 | Fujitsu Ltd | Surface treating method |
JPS6077429A (ja) * | 1983-10-04 | 1985-05-02 | Asahi Glass Co Ltd | ドライエツチング方法 |
US4693777A (en) * | 1984-11-30 | 1987-09-15 | Kabushiki Kaisha Toshiba | Apparatus for producing semiconductor devices |
US4824518A (en) * | 1985-03-29 | 1989-04-25 | Sharp Kabushiki Kaisha | Method for the production of semiconductor devices |
US4605479A (en) * | 1985-06-24 | 1986-08-12 | Rca Corporation | In-situ cleaned ohmic contacts |
-
1985
- 1985-10-01 IT IT22325/85A patent/IT1185964B/it active
-
1986
- 1986-08-19 GB GB8620131A patent/GB2181297B/en not_active Expired
- 1986-09-29 NL NL8602453A patent/NL8602453A/nl not_active Application Discontinuation
- 1986-09-30 FR FR8613608A patent/FR2588120A1/fr not_active Withdrawn
- 1986-09-30 JP JP61234265A patent/JPS6286716A/ja active Pending
- 1986-10-01 DE DE19863633472 patent/DE3633472A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
DE3633472A1 (de) | 1987-04-02 |
JPS6286716A (ja) | 1987-04-21 |
IT1185964B (it) | 1987-11-18 |
GB2181297A (en) | 1987-04-15 |
NL8602453A (nl) | 1987-05-04 |
GB8620131D0 (en) | 1986-10-01 |
FR2588120A1 (fr) | 1987-04-03 |
GB2181297B (en) | 1989-06-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19971030 |