IT202200008900A1 - Dispositivo a semiconduttore e corrispondenti procedimenti - Google Patents
Dispositivo a semiconduttore e corrispondenti procedimenti Download PDFInfo
- Publication number
- IT202200008900A1 IT202200008900A1 IT102022000008900A IT202200008900A IT202200008900A1 IT 202200008900 A1 IT202200008900 A1 IT 202200008900A1 IT 102022000008900 A IT102022000008900 A IT 102022000008900A IT 202200008900 A IT202200008900 A IT 202200008900A IT 202200008900 A1 IT202200008900 A1 IT 202200008900A1
- Authority
- IT
- Italy
- Prior art keywords
- semiconductor device
- corresponding processes
- processes
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT102022000008900A IT202200008900A1 (it) | 2022-05-03 | 2022-05-03 | Dispositivo a semiconduttore e corrispondenti procedimenti |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT102022000008900A IT202200008900A1 (it) | 2022-05-03 | 2022-05-03 | Dispositivo a semiconduttore e corrispondenti procedimenti |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT202200008900A1 true IT202200008900A1 (it) | 2023-11-03 |
Family
ID=82308640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT102022000008900A IT202200008900A1 (it) | 2022-05-03 | 2022-05-03 | Dispositivo a semiconduttore e corrispondenti procedimenti |
Country Status (1)
| Country | Link |
|---|---|
| IT (1) | IT202200008900A1 (it) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8017447B1 (en) * | 2010-08-03 | 2011-09-13 | Linear Technology Corporation | Laser process for side plating of terminals |
| US20200227343A1 (en) * | 2019-01-11 | 2020-07-16 | Chang Wah Technology Co., Ltd. | Semiconductor device package |
-
2022
- 2022-05-03 IT IT102022000008900A patent/IT202200008900A1/it unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8017447B1 (en) * | 2010-08-03 | 2011-09-13 | Linear Technology Corporation | Laser process for side plating of terminals |
| US20200227343A1 (en) * | 2019-01-11 | 2020-07-16 | Chang Wah Technology Co., Ltd. | Semiconductor device package |
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