IT202200008891A1 - Procedimento per fabbricare dispositivi a semiconduttore e dispositivo a semiconduttore corrispondente - Google Patents

Procedimento per fabbricare dispositivi a semiconduttore e dispositivo a semiconduttore corrispondente Download PDF

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Publication number
IT202200008891A1
IT202200008891A1 IT102022000008891A IT202200008891A IT202200008891A1 IT 202200008891 A1 IT202200008891 A1 IT 202200008891A1 IT 102022000008891 A IT102022000008891 A IT 102022000008891A IT 202200008891 A IT202200008891 A IT 202200008891A IT 202200008891 A1 IT202200008891 A1 IT 202200008891A1
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IT
Italy
Prior art keywords
semiconductor device
semiconductor devices
manufacturing
manufacturing semiconductor
devices
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Application number
IT102022000008891A
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English (en)
Inventor
Marco Rovitto
Dario Vitello
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St Microelectronics Srl
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Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to IT102022000008891A priority Critical patent/IT202200008891A1/it
Priority to US18/140,290 priority patent/US20230360928A1/en
Publication of IT202200008891A1 publication Critical patent/IT202200008891A1/it

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    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
IT102022000008891A 2022-05-03 2022-05-03 Procedimento per fabbricare dispositivi a semiconduttore e dispositivo a semiconduttore corrispondente IT202200008891A1 (it)

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IT102022000008891A IT202200008891A1 (it) 2022-05-03 2022-05-03 Procedimento per fabbricare dispositivi a semiconduttore e dispositivo a semiconduttore corrispondente
US18/140,290 US20230360928A1 (en) 2022-05-03 2023-04-27 Method for manufacturing semiconductor devices and corresponding semiconductor device

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Citations (11)

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US20120153509A1 (en) * 2010-12-16 2012-06-21 Shinko Electric Industries Co., Ltd. Semiconductor package and manufacturing method therefor
KR20180002913A (ko) * 2016-05-27 2018-01-09 주식회사 네패스 반도체 패키지 및 그 제조방법
US20180342453A1 (en) 2017-05-23 2018-11-29 Stmicroelectronics S.R.L. Method of manufacturing semiconductor devices and corresponding product
US20190115287A1 (en) 2017-10-12 2019-04-18 Stmicroelectronics S.R.L. Method of manufacturing semiconductor devices, corresponding device and circuit
US20200203264A1 (en) 2018-12-24 2020-06-25 Stmicroelectronics S.R.L. Method of manufacturing semiconductor devices and corresponding semiconductor device
US20200321274A1 (en) 2019-04-05 2020-10-08 Stmicroelectronics S.R.L. Method of manufacturing leadframes for semiconductor devices, corresponding leadframe and semicondctor device
US20210050299A1 (en) 2019-08-16 2021-02-18 Stmicroelectronics S.R.L. Method of manufacturing semiconductor devices and corresponding semiconductor device
US20210050226A1 (en) 2019-08-16 2021-02-18 Stmicroelectronics S.R.L. Method of manufacturing semiconductor devices and corresponding semiconductor device
US20210183748A1 (en) 2019-12-17 2021-06-17 Stmicroelectronics S.R.L. Method of manufacturing semiconductor devices and corresponding semiconductor device
US20210305203A1 (en) 2019-01-22 2021-09-30 Stmicroelectronics S.R.L. Semiconductor device and corresponding method of manufacture
US20220319963A1 (en) * 2021-03-31 2022-10-06 Stmicroelectronics Pte Ltd Semiconductor device package with conductive vias and method of manufacturing

Patent Citations (11)

* Cited by examiner, † Cited by third party
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