IT202100018458A1 - Pressa di sinterizzazione - Google Patents

Pressa di sinterizzazione Download PDF

Info

Publication number
IT202100018458A1
IT202100018458A1 IT102021000018458A IT202100018458A IT202100018458A1 IT 202100018458 A1 IT202100018458 A1 IT 202100018458A1 IT 102021000018458 A IT102021000018458 A IT 102021000018458A IT 202100018458 A IT202100018458 A IT 202100018458A IT 202100018458 A1 IT202100018458 A1 IT 202100018458A1
Authority
IT
Italy
Prior art keywords
press according
load cells
plate
plane
press
Prior art date
Application number
IT102021000018458A
Other languages
English (en)
Italian (it)
Inventor
Nicola Schivalocchi
Original Assignee
Amx Automatrix S R L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amx Automatrix S R L filed Critical Amx Automatrix S R L
Priority to IT102021000018458A priority Critical patent/IT202100018458A1/it
Priority to MX2024000677A priority patent/MX2024000677A/es
Priority to US18/577,814 priority patent/US20240339343A1/en
Priority to CN202180100562.1A priority patent/CN117715746A/zh
Priority to JP2024501755A priority patent/JP7849072B2/ja
Priority to EP21844065.9A priority patent/EP4370320A1/en
Priority to PCT/IB2021/062386 priority patent/WO2023285876A1/en
Priority to CA3224468A priority patent/CA3224468A1/en
Priority to TW111105249A priority patent/TW202302332A/zh
Publication of IT202100018458A1 publication Critical patent/IT202100018458A1/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/007—Means for maintaining the press table, the press platen or the press ram against tilting or deflection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/0094—Press load monitoring means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
    • B30B15/026—Mounting of dies, platens or press rams
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/30—Mounting, exchanging or centering
    • B29C33/308—Adjustable moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Silicon Compounds (AREA)
  • Presses And Accessory Devices Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
IT102021000018458A 2021-07-13 2021-07-13 Pressa di sinterizzazione IT202100018458A1 (it)

Priority Applications (9)

Application Number Priority Date Filing Date Title
IT102021000018458A IT202100018458A1 (it) 2021-07-13 2021-07-13 Pressa di sinterizzazione
MX2024000677A MX2024000677A (es) 2021-07-13 2021-12-28 Prensa de sinterizacion.
US18/577,814 US20240339343A1 (en) 2021-07-13 2021-12-28 Sintering press
CN202180100562.1A CN117715746A (zh) 2021-07-13 2021-12-28 烧结压制结构
JP2024501755A JP7849072B2 (ja) 2021-07-13 2021-12-28 焼結プレス機
EP21844065.9A EP4370320A1 (en) 2021-07-13 2021-12-28 Sintering press
PCT/IB2021/062386 WO2023285876A1 (en) 2021-07-13 2021-12-28 Sintering press
CA3224468A CA3224468A1 (en) 2021-07-13 2021-12-28 Sintering press
TW111105249A TW202302332A (zh) 2021-07-13 2022-02-14 燒結機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT102021000018458A IT202100018458A1 (it) 2021-07-13 2021-07-13 Pressa di sinterizzazione

Publications (1)

Publication Number Publication Date
IT202100018458A1 true IT202100018458A1 (it) 2023-01-13

Family

ID=78086672

Family Applications (1)

Application Number Title Priority Date Filing Date
IT102021000018458A IT202100018458A1 (it) 2021-07-13 2021-07-13 Pressa di sinterizzazione

Country Status (9)

Country Link
US (1) US20240339343A1 (https=)
EP (1) EP4370320A1 (https=)
JP (1) JP7849072B2 (https=)
CN (1) CN117715746A (https=)
CA (1) CA3224468A1 (https=)
IT (1) IT202100018458A1 (https=)
MX (1) MX2024000677A (https=)
TW (1) TW202302332A (https=)
WO (1) WO2023285876A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4076780A (en) * 1977-01-27 1978-02-28 General Motors Corporation Programmable velocity and force control method for compression molding
US6471501B1 (en) * 1998-03-20 2002-10-29 Fujitsu Limited Mold for fabricating semiconductor devices
US20160082624A1 (en) * 2014-09-18 2016-03-24 Jian Xiong SU Molding press and a platen for a molding press
IT201800020272A1 (it) * 2018-12-20 2020-06-20 Amx Automatrix S R L Pressa di sinterizzazione per sinterizzare componenti elettronici su un substrato

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5977592B2 (ja) 2012-06-20 2016-08-24 東京応化工業株式会社 貼付装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4076780A (en) * 1977-01-27 1978-02-28 General Motors Corporation Programmable velocity and force control method for compression molding
US6471501B1 (en) * 1998-03-20 2002-10-29 Fujitsu Limited Mold for fabricating semiconductor devices
US20160082624A1 (en) * 2014-09-18 2016-03-24 Jian Xiong SU Molding press and a platen for a molding press
IT201800020272A1 (it) * 2018-12-20 2020-06-20 Amx Automatrix S R L Pressa di sinterizzazione per sinterizzare componenti elettronici su un substrato

Also Published As

Publication number Publication date
EP4370320A1 (en) 2024-05-22
WO2023285876A1 (en) 2023-01-19
CN117715746A (zh) 2024-03-15
JP7849072B2 (ja) 2026-04-21
TW202302332A (zh) 2023-01-16
MX2024000677A (es) 2024-07-22
CA3224468A1 (en) 2023-01-19
JP2024529344A (ja) 2024-08-06
US20240339343A1 (en) 2024-10-10

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