IT1401160B1 - Struttura micromeccanica e procedimento atto alla fabbricazione di una struttura micromeccanica - Google Patents
Struttura micromeccanica e procedimento atto alla fabbricazione di una struttura micromeccanicaInfo
- Publication number
- IT1401160B1 IT1401160B1 ITMI2010A001780A ITMI20101780A IT1401160B1 IT 1401160 B1 IT1401160 B1 IT 1401160B1 IT MI2010A001780 A ITMI2010A001780 A IT MI2010A001780A IT MI20101780 A ITMI20101780 A IT MI20101780A IT 1401160 B1 IT1401160 B1 IT 1401160B1
- Authority
- IT
- Italy
- Prior art keywords
- micro
- procedure
- manufacture
- micromechanical
- mechanical
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009045391A DE102009045391A1 (de) | 2009-10-06 | 2009-10-06 | Mikromechanische Struktur und Verfahren zur Herstellung einer mikromechanischen Struktur |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ITMI20101780A1 ITMI20101780A1 (it) | 2011-04-07 |
| IT1401160B1 true IT1401160B1 (it) | 2013-07-12 |
Family
ID=43705592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ITMI2010A001780A IT1401160B1 (it) | 2009-10-06 | 2010-09-29 | Struttura micromeccanica e procedimento atto alla fabbricazione di una struttura micromeccanica |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8443671B2 (it) |
| CN (1) | CN102030302B (it) |
| DE (1) | DE102009045391A1 (it) |
| IT (1) | IT1401160B1 (it) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012200740B4 (de) | 2011-10-27 | 2024-03-21 | Robert Bosch Gmbh | Mikromechanisches Bauelement und Verfahren zur Herstellung eines mikromechanischen Bauelements |
| US9003886B2 (en) * | 2012-04-27 | 2015-04-14 | Freescale Semiconductor, Inc. | Microelectromechanical systems devices and methods for the fabrication thereof |
| JP5880877B2 (ja) * | 2012-05-15 | 2016-03-09 | 株式会社デンソー | センサ装置 |
| JP5772873B2 (ja) | 2012-06-13 | 2015-09-02 | 株式会社デンソー | 静電容量式物理量センサ |
| US20150301075A1 (en) * | 2012-10-16 | 2015-10-22 | Hitachi Automotive Systems, Ltd. | Inertial Sensor |
| US9079763B2 (en) * | 2013-04-22 | 2015-07-14 | Freescale Semiconductor, Inc. | MEMS device with stress isolation and method of fabrication |
| DE102013222676B4 (de) | 2013-11-07 | 2022-07-07 | Robert Bosch Gmbh | Elektrodenanordnung für ein mikromechanisches Bauelement |
| DE102014202819A1 (de) * | 2014-02-17 | 2015-08-20 | Robert Bosch Gmbh | Mikromechanische Struktur für einen Beschleunigungssensor |
| GB2523320A (en) * | 2014-02-19 | 2015-08-26 | Atlantic Inertial Systems Ltd | Accelerometers |
| WO2016020716A1 (en) * | 2014-08-04 | 2016-02-11 | Ba-Tis Faez | 3-dof mems piston-tube electrostatic microactuator |
| CN105731353A (zh) * | 2014-12-12 | 2016-07-06 | 立锜科技股份有限公司 | 微机电装置 |
| DE102015207637A1 (de) * | 2015-04-27 | 2016-10-27 | Robert Bosch Gmbh | Mikromechanische Struktur für einen Beschleunigungssensor |
| JP6575187B2 (ja) * | 2015-07-10 | 2019-09-18 | セイコーエプソン株式会社 | 物理量センサー、物理量センサー装置、電子機器および移動体 |
| US10352960B1 (en) * | 2015-10-30 | 2019-07-16 | Garmin International, Inc. | Free mass MEMS accelerometer |
| DE102015222532A1 (de) | 2015-11-16 | 2017-05-18 | Robert Bosch Gmbh | Mikromechanische Struktur für einen Beschleunigungssensor |
| DE102017204753A1 (de) | 2017-03-22 | 2018-09-27 | Robert Bosch Gmbh | Mikromechanisches Bauelement |
| GB2565295A (en) * | 2017-08-07 | 2019-02-13 | Atlantic Inertial Systems Ltd | Accelerometer |
| JP7056099B2 (ja) * | 2017-11-28 | 2022-04-19 | セイコーエプソン株式会社 | 物理量センサー、物理量センサーデバイス、複合センサーデバイス、慣性計測装置、移動体測位装置、携帯型電子機器、電子機器および移動体 |
| DE102019200839A1 (de) | 2019-01-24 | 2020-07-30 | Robert Bosch Gmbh | Mikromechanischer Inertialsensor |
| DE102019217505A1 (de) | 2019-11-05 | 2021-05-06 | Robert Bosch Gmbh | Inertialsensor mit einem eine Haupterstreckungsebene aufweisendem Substrat und einer über eine Federanordnung mit dem Substrat verbundenen seismischen Masse |
| DE102020209934A1 (de) | 2020-08-06 | 2022-02-10 | Robert Bosch Gesellschaft mit beschränkter Haftung | Herstellungsverfahren für ein mikromechanisches Bauelement, entsprechendes mikromechanisches Bauelement und entsprechende Anordnung |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5639542A (en) * | 1995-06-07 | 1997-06-17 | Analog Devices, Inc. | Sub-ground plane for micromachined device |
| DE19639946B4 (de) | 1996-09-27 | 2006-09-21 | Robert Bosch Gmbh | Mikromechanisches Bauelement |
| DE19719770A1 (de) | 1997-05-10 | 1998-11-12 | Asea Brown Boveri | Turbomaschine |
| JP4214572B2 (ja) * | 1998-09-04 | 2009-01-28 | 株式会社デンソー | 半導体力学量センサの製造方法 |
| CN2424450Y (zh) * | 2000-06-02 | 2001-03-21 | 中国科学院上海冶金研究所 | 微机械梳状电容式加速度传感器 |
| CN1139815C (zh) * | 2002-01-29 | 2004-02-25 | 清华大学 | 梳齿式体硅加工微机械加速度计 |
| ATE352041T1 (de) | 2002-07-19 | 2007-02-15 | Analog Devices Inc | Verringerung des offsets eines beschleunigungsaufnehmers |
| DE102006033636B4 (de) | 2006-07-20 | 2022-08-11 | Robert Bosch Gmbh | Beschleunigungssensor |
-
2009
- 2009-10-06 DE DE102009045391A patent/DE102009045391A1/de active Pending
-
2010
- 2010-09-29 IT ITMI2010A001780A patent/IT1401160B1/it active
- 2010-10-01 US US12/924,641 patent/US8443671B2/en active Active
- 2010-10-08 CN CN201010510986.9A patent/CN102030302B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20110083506A1 (en) | 2011-04-14 |
| DE102009045391A1 (de) | 2011-04-07 |
| CN102030302A (zh) | 2011-04-27 |
| CN102030302B (zh) | 2015-08-26 |
| ITMI20101780A1 (it) | 2011-04-07 |
| US8443671B2 (en) | 2013-05-21 |
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