IT1400786B1 - Procedimento di fabbricazione per un componente micromeccanico e componente micromeccanico - Google Patents

Procedimento di fabbricazione per un componente micromeccanico e componente micromeccanico

Info

Publication number
IT1400786B1
IT1400786B1 ITMI2010A001755A ITMI20101755A IT1400786B1 IT 1400786 B1 IT1400786 B1 IT 1400786B1 IT MI2010A001755 A ITMI2010A001755 A IT MI2010A001755A IT MI20101755 A ITMI20101755 A IT MI20101755A IT 1400786 B1 IT1400786 B1 IT 1400786B1
Authority
IT
Italy
Prior art keywords
micromechanical component
manufacturing procedure
micromechanical
component
procedure
Prior art date
Application number
ITMI2010A001755A
Other languages
English (en)
Inventor
Frieder Haag
Paul Farber
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI20101755A1 publication Critical patent/ITMI20101755A1/it
Application granted granted Critical
Publication of IT1400786B1 publication Critical patent/IT1400786B1/it

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00238—Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0109—Bridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/07—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0136—Growing or depositing of a covering layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0785—Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates
    • B81C2203/0792—Forming interconnections between the electronic processing unit and the micromechanical structure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
ITMI2010A001755A 2009-10-07 2010-09-28 Procedimento di fabbricazione per un componente micromeccanico e componente micromeccanico IT1400786B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009045428.4A DE102009045428B4 (de) 2009-10-07 2009-10-07 Herstellungsverfahren für ein mikromechanisches Bauteil und mikromechanisches Bauteil

Publications (2)

Publication Number Publication Date
ITMI20101755A1 ITMI20101755A1 (it) 2011-04-08
IT1400786B1 true IT1400786B1 (it) 2013-07-02

Family

ID=43734430

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI2010A001755A IT1400786B1 (it) 2009-10-07 2010-09-28 Procedimento di fabbricazione per un componente micromeccanico e componente micromeccanico

Country Status (4)

Country Link
US (1) US8621929B2 (it)
CN (1) CN102030307B (it)
DE (1) DE102009045428B4 (it)
IT (1) IT1400786B1 (it)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8247253B2 (en) 2009-08-11 2012-08-21 Pixart Imaging Inc. MEMS package structure and method for fabricating the same
TWI396242B (zh) 2009-08-11 2013-05-11 Pixart Imaging Inc 微電子裝置、微電子裝置的製造方法、微機電封裝結構及其封裝方法
DE102009045158A1 (de) * 2009-09-30 2011-04-07 Robert Bosch Gmbh Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung
DE102013216901A1 (de) * 2013-08-26 2015-02-26 Robert Bosch Gmbh Mikromechanisches Bauelement und Verfahren zur Herstellung eines mikromechanischen Bauelements
US10120134B2 (en) * 2015-02-20 2018-11-06 Si-Ware Systems Micro-optical bench device with highly/selectively-controlled optical surfaces
DE102018200371A1 (de) * 2018-01-11 2019-07-11 Robert Bosch Gmbh Interposersubstrat, MEMS-Vorrichtung sowie entsprechendes Herstellungsverfahren
DE102018209500B4 (de) * 2018-06-14 2020-10-08 Robert Bosch Gmbh Mikromechanischer z-Inertialsensor
DE102018210810B3 (de) * 2018-06-29 2019-08-08 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikromechanisches bauteil und verfahren zur herstellung
DE102020214925A1 (de) * 2020-11-27 2022-06-02 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Polysilizium-SOI-Substrats mit einer Kavität

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5060039A (en) * 1988-01-13 1991-10-22 The Charles Stark Draper Laboratory, Inc. Permanent magnet force rebalance micro accelerometer
DE69124377T2 (de) * 1991-03-30 1997-06-12 Kazuhiro Okada Beschleunigungssensor mit Selbsttest
US6747784B2 (en) 2000-03-20 2004-06-08 Np Photonics, Inc. Compliant mechanism and method of forming same
JP2006294866A (ja) * 2005-04-11 2006-10-26 Toshiba Corp 半導体装置
KR100695153B1 (ko) * 2005-06-15 2007-03-14 삼성전자주식회사 수직 콤전극을 구비한 액츄에이터
JP2007101531A (ja) * 2005-09-06 2007-04-19 Seiko Instruments Inc 力学量センサ
JP5098254B2 (ja) * 2006-08-29 2012-12-12 富士通株式会社 マイクロ揺動素子
US7640805B2 (en) 2006-12-18 2010-01-05 Akustica, Inc. Proof-mass with supporting structure on integrated circuit-MEMS platform
DE102007046017B4 (de) 2007-09-26 2021-07-01 Robert Bosch Gmbh Sensorelement

Also Published As

Publication number Publication date
ITMI20101755A1 (it) 2011-04-08
CN102030307B (zh) 2015-05-20
DE102009045428A1 (de) 2011-04-14
CN102030307A (zh) 2011-04-27
US20110079081A1 (en) 2011-04-07
DE102009045428B4 (de) 2019-06-19
US8621929B2 (en) 2014-01-07

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