ITMI20121896A1 - Mems-chippackage e procedimento per fabbricare un mems-chippackage - Google Patents

Mems-chippackage e procedimento per fabbricare un mems-chippackage

Info

Publication number
ITMI20121896A1
ITMI20121896A1 IT001896A ITMI20121896A ITMI20121896A1 IT MI20121896 A1 ITMI20121896 A1 IT MI20121896A1 IT 001896 A IT001896 A IT 001896A IT MI20121896 A ITMI20121896 A IT MI20121896A IT MI20121896 A1 ITMI20121896 A1 IT MI20121896A1
Authority
IT
Italy
Prior art keywords
chippackage
mems
procedure
manufacturing
Prior art date
Application number
IT001896A
Other languages
English (en)
Inventor
Mathias Bruendel
Ricardo Ehrenpfordt
Ando Feyh
Andre Gerlach
Sonja Knies
Christina Leinenbach
Ulrike Scholz
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI20121896A1 publication Critical patent/ITMI20121896A1/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00325—Processes for packaging MEMS devices for reducing stress inside of the package structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
IT001896A 2011-11-22 2012-11-07 Mems-chippackage e procedimento per fabbricare un mems-chippackage ITMI20121896A1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102011086764A DE102011086764A1 (de) 2011-11-22 2011-11-22 MEMS-Chippackage und Verfahren zum Herstellen eines MEMS-Chippackages

Publications (1)

Publication Number Publication Date
ITMI20121896A1 true ITMI20121896A1 (it) 2013-05-23

Family

ID=48047089

Family Applications (1)

Application Number Title Priority Date Filing Date
IT001896A ITMI20121896A1 (it) 2011-11-22 2012-11-07 Mems-chippackage e procedimento per fabbricare un mems-chippackage

Country Status (5)

Country Link
US (1) US8981499B2 (it)
CN (1) CN103130175B (it)
DE (1) DE102011086764A1 (it)
FR (1) FR2982852B1 (it)
IT (1) ITMI20121896A1 (it)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015042700A1 (en) 2013-09-24 2015-04-02 Motion Engine Inc. Mems components and method of wafer-level manufacturing thereof
EP3019442A4 (en) * 2013-07-08 2017-01-25 Motion Engine Inc. Mems device and method of manufacturing
EP3028007A4 (en) 2013-08-02 2017-07-12 Motion Engine Inc. Mems motion sensor and method of manufacturing
US9584889B2 (en) 2013-08-27 2017-02-28 Infineon Technologies Ag System and method for packaged MEMS device having embedding arrangement, MEMS die, and grille
EP2871152B1 (en) * 2013-11-06 2017-05-24 Sensirion AG Sensor device
US9793877B2 (en) 2013-12-17 2017-10-17 Avago Technologies General Ip (Singapore) Pte. Ltd. Encapsulated bulk acoustic wave (BAW) resonator device
JP6590812B2 (ja) 2014-01-09 2019-10-16 モーション・エンジン・インコーポレーテッド 集積ｍｅｍｓシステム
US20170030788A1 (en) 2014-04-10 2017-02-02 Motion Engine Inc. Mems pressure sensor
US11674803B2 (en) 2014-06-02 2023-06-13 Motion Engine, Inc. Multi-mass MEMS motion sensor
CN105282670B (zh) * 2014-07-01 2019-02-12 日月光半导体制造股份有限公司 包含微机电系统装置的电子装置及其制造方法
US9718678B2 (en) 2014-09-25 2017-08-01 Infineon Technologies Ag Package arrangement, a package, and a method of manufacturing a package arrangement
EP3018092A1 (en) 2014-11-10 2016-05-11 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft MEMS package
EP3032227B1 (en) 2014-12-08 2020-10-21 Sensirion AG Flow sensor package
WO2016090467A1 (en) 2014-12-09 2016-06-16 Motion Engine Inc. 3d mems magnetometer and associated methods
US10407299B2 (en) 2015-01-15 2019-09-10 Motion Engine Inc. 3D MEMS device with hermetic cavity
DE102015107557A1 (de) 2015-05-13 2016-11-17 USound GmbH Leiterplattenmodul mit durchgehender Aussparung sowie diesbezügliche Schallwandleranordnung sowie Herstellungsverfahren
US9630836B2 (en) 2015-09-30 2017-04-25 Mems Drive, Inc. Simplified MEMS device fabrication process
US9617142B1 (en) * 2015-09-30 2017-04-11 Mems Drive, Inc. MEMS grid for manipulating structural parameters of MEMS devices
DE102016200261A1 (de) * 2016-01-13 2017-07-13 Robert Bosch Gmbh Mikroelektronische Bauelementanordnung und entsprechendes Herstellungsverfahren für eine mikroelektronische Bauelementanordnung
US20170283247A1 (en) * 2016-04-04 2017-10-05 Infineon Technologies Ag Semiconductor device including a mems die
GB2568633B (en) 2016-09-21 2022-06-29 Sensirion Ag Gas sensor
DE102017207887B3 (de) * 2017-05-10 2018-10-31 Infineon Technologies Ag Verfahren zur Herstellung von gehäusten MEMS-Bausteinen auf Waferebene
CN114615607B (zh) * 2022-05-09 2022-08-12 华天科技(南京)有限公司 一种mems麦克风封装结构及制造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6936918B2 (en) * 2003-12-15 2005-08-30 Analog Devices, Inc. MEMS device with conductive path through substrate
US7393758B2 (en) * 2005-11-03 2008-07-01 Maxim Integrated Products, Inc. Wafer level packaging process
DE102005055478A1 (de) 2005-11-22 2007-05-24 Robert Bosch Gmbh Mikromechanische Struktur zum Empfang und/oder zur Erzeugung von akustischen Signalen, Verfahren zur Herstellung einer mikromechanischen Struktur und Verwendung einer mikromechanischen Struktur
US7550828B2 (en) 2007-01-03 2009-06-23 Stats Chippac, Inc. Leadframe package for MEMS microphone assembly
TWI341014B (en) * 2007-05-30 2011-04-21 Ind Tech Res Inst A device structure with preformed ring and method therefor
JP2009074979A (ja) * 2007-09-21 2009-04-09 Toshiba Corp 半導体装置
US7851925B2 (en) * 2008-09-19 2010-12-14 Infineon Technologies Ag Wafer level packaged MEMS integrated circuit
CN101533832A (zh) * 2009-04-14 2009-09-16 李刚 微机电系统器件与集成电路的集成芯片及集成方法
CN102238463B (zh) * 2010-04-30 2014-09-03 比亚迪股份有限公司 一种将硅麦克风器件与集成电路单片集成的方法及芯片

Also Published As

Publication number Publication date
FR2982852B1 (fr) 2018-09-07
CN103130175A (zh) 2013-06-05
FR2982852A1 (fr) 2013-05-24
CN103130175B (zh) 2016-12-21
DE102011086764A1 (de) 2013-05-23
US20130126992A1 (en) 2013-05-23
US8981499B2 (en) 2015-03-17

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