FR2982852B1 - Boitier de microsysteme electromecanique et son procede de realisation - Google Patents

Boitier de microsysteme electromecanique et son procede de realisation Download PDF

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Publication number
FR2982852B1
FR2982852B1 FR1261026A FR1261026A FR2982852B1 FR 2982852 B1 FR2982852 B1 FR 2982852B1 FR 1261026 A FR1261026 A FR 1261026A FR 1261026 A FR1261026 A FR 1261026A FR 2982852 B1 FR2982852 B1 FR 2982852B1
Authority
FR
France
Prior art keywords
housing
making same
electromechanical microsystem
microsystem
electromechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1261026A
Other languages
English (en)
Other versions
FR2982852A1 (fr
Inventor
Ricardo Ehrenpfordt
Mathias Bruendel
Andre Gerlach
Christina Leinenbach
Sonja Knies
Ando Feyh
Ulrike Scholz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2982852A1 publication Critical patent/FR2982852A1/fr
Application granted granted Critical
Publication of FR2982852B1 publication Critical patent/FR2982852B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00325—Processes for packaging MEMS devices for reducing stress inside of the package structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Micromachines (AREA)
FR1261026A 2011-11-22 2012-11-20 Boitier de microsysteme electromecanique et son procede de realisation Active FR2982852B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011086764.3 2011-11-22
DE102011086764A DE102011086764A1 (de) 2011-11-22 2011-11-22 MEMS-Chippackage und Verfahren zum Herstellen eines MEMS-Chippackages

Publications (2)

Publication Number Publication Date
FR2982852A1 FR2982852A1 (fr) 2013-05-24
FR2982852B1 true FR2982852B1 (fr) 2018-09-07

Family

ID=48047089

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1261026A Active FR2982852B1 (fr) 2011-11-22 2012-11-20 Boitier de microsysteme electromecanique et son procede de realisation

Country Status (5)

Country Link
US (1) US8981499B2 (fr)
CN (1) CN103130175B (fr)
DE (1) DE102011086764A1 (fr)
FR (1) FR2982852B1 (fr)
IT (1) ITMI20121896A1 (fr)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015042700A1 (fr) 2013-09-24 2015-04-02 Motion Engine Inc. Composants mems et leur procédé de fabrication sur plaquette
JP6339669B2 (ja) * 2013-07-08 2018-06-06 モーション・エンジン・インコーポレーテッド Ｍｅｍｓデバイスおよび製造する方法
EP3028007A4 (fr) 2013-08-02 2017-07-12 Motion Engine Inc. Capteur de mouvement à système microélectromécanique (mems) et procédé de fabrication
US9584889B2 (en) 2013-08-27 2017-02-28 Infineon Technologies Ag System and method for packaged MEMS device having embedding arrangement, MEMS die, and grille
EP2871152B1 (fr) 2013-11-06 2017-05-24 Sensirion AG Dispositif capteur
US9793877B2 (en) 2013-12-17 2017-10-17 Avago Technologies General Ip (Singapore) Pte. Ltd. Encapsulated bulk acoustic wave (BAW) resonator device
JP6590812B2 (ja) 2014-01-09 2019-10-16 モーション・エンジン・インコーポレーテッド 集積ｍｅｍｓシステム
WO2015154173A1 (fr) 2014-04-10 2015-10-15 Motion Engine Inc. Capteur de pression mems
WO2015184531A1 (fr) 2014-06-02 2015-12-10 Motion Engine Inc. Capteur de mouvement mems à plusieurs masses
CN105282670B (zh) * 2014-07-01 2019-02-12 日月光半导体制造股份有限公司 包含微机电系统装置的电子装置及其制造方法
US9718678B2 (en) 2014-09-25 2017-08-01 Infineon Technologies Ag Package arrangement, a package, and a method of manufacturing a package arrangement
EP3018092A1 (fr) 2014-11-10 2016-05-11 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Emballage de mems
EP3032227B1 (fr) 2014-12-08 2020-10-21 Sensirion AG Package de capteur de débit
CA3004760A1 (fr) 2014-12-09 2016-06-16 Motion Engine Inc. Magnetometre de systeme micro electromecanique (mems) 3d et procedes associes
CA3220839A1 (fr) 2015-01-15 2016-07-21 Motion Engine Inc. Dispositif mems 3d a cavite hermetique
DE102015107557A1 (de) * 2015-05-13 2016-11-17 USound GmbH Leiterplattenmodul mit durchgehender Aussparung sowie diesbezügliche Schallwandleranordnung sowie Herstellungsverfahren
US9630836B2 (en) 2015-09-30 2017-04-25 Mems Drive, Inc. Simplified MEMS device fabrication process
US9617142B1 (en) 2015-09-30 2017-04-11 Mems Drive, Inc. MEMS grid for manipulating structural parameters of MEMS devices
DE102016200261A1 (de) * 2016-01-13 2017-07-13 Robert Bosch Gmbh Mikroelektronische Bauelementanordnung und entsprechendes Herstellungsverfahren für eine mikroelektronische Bauelementanordnung
US20170283247A1 (en) * 2016-04-04 2017-10-05 Infineon Technologies Ag Semiconductor device including a mems die
US11204346B2 (en) 2016-09-21 2021-12-21 Sensirion Ag Gas sensor with filter
DE102017207887B3 (de) * 2017-05-10 2018-10-31 Infineon Technologies Ag Verfahren zur Herstellung von gehäusten MEMS-Bausteinen auf Waferebene
CN114615607B (zh) * 2022-05-09 2022-08-12 华天科技(南京)有限公司 一种mems麦克风封装结构及制造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6936918B2 (en) * 2003-12-15 2005-08-30 Analog Devices, Inc. MEMS device with conductive path through substrate
US7393758B2 (en) * 2005-11-03 2008-07-01 Maxim Integrated Products, Inc. Wafer level packaging process
DE102005055478A1 (de) 2005-11-22 2007-05-24 Robert Bosch Gmbh Mikromechanische Struktur zum Empfang und/oder zur Erzeugung von akustischen Signalen, Verfahren zur Herstellung einer mikromechanischen Struktur und Verwendung einer mikromechanischen Struktur
US7550828B2 (en) 2007-01-03 2009-06-23 Stats Chippac, Inc. Leadframe package for MEMS microphone assembly
TWI341014B (en) * 2007-05-30 2011-04-21 Ind Tech Res Inst A device structure with preformed ring and method therefor
JP2009074979A (ja) * 2007-09-21 2009-04-09 Toshiba Corp 半導体装置
US7851925B2 (en) * 2008-09-19 2010-12-14 Infineon Technologies Ag Wafer level packaged MEMS integrated circuit
CN101533832A (zh) * 2009-04-14 2009-09-16 李刚 微机电系统器件与集成电路的集成芯片及集成方法
CN102238463B (zh) * 2010-04-30 2014-09-03 比亚迪股份有限公司 一种将硅麦克风器件与集成电路单片集成的方法及芯片

Also Published As

Publication number Publication date
CN103130175B (zh) 2016-12-21
US20130126992A1 (en) 2013-05-23
ITMI20121896A1 (it) 2013-05-23
US8981499B2 (en) 2015-03-17
FR2982852A1 (fr) 2013-05-24
CN103130175A (zh) 2013-06-05
DE102011086764A1 (de) 2013-05-23

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