FI20095988A0 - Mikromekaaninen resonaattori ja menetelmä sen valmistamiseksi - Google Patents
Mikromekaaninen resonaattori ja menetelmä sen valmistamiseksiInfo
- Publication number
- FI20095988A0 FI20095988A0 FI20095988A FI20095988A FI20095988A0 FI 20095988 A0 FI20095988 A0 FI 20095988A0 FI 20095988 A FI20095988 A FI 20095988A FI 20095988 A FI20095988 A FI 20095988A FI 20095988 A0 FI20095988 A0 FI 20095988A0
- Authority
- FI
- Finland
- Prior art keywords
- manufacture
- micromechanical resonator
- micromechanical
- resonator
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02259—Driving or detection means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0081—Thermal properties
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/0072—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks
- H03H3/0076—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks for obtaining desired frequency or temperature coefficients
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02338—Suspension means
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02433—Means for compensation or elimination of undesired effects
- H03H9/02448—Means for compensation or elimination of undesired effects of temperature influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2436—Disk resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2447—Beam resonators
- H03H9/2452—Free-free beam resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2447—Beam resonators
- H03H9/2463—Clamped-clamped beam resonators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0271—Resonators; ultrasonic resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/027—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the microelectro-mechanical [MEMS] type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
- H03H2003/0407—Temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02488—Vibration modes
- H03H2009/02496—Horizontal, i.e. parallel to the substrate plane
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02488—Vibration modes
- H03H2009/02496—Horizontal, i.e. parallel to the substrate plane
- H03H2009/02503—Breath-like, e.g. Lam? mode, wine-glass mode
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02488—Vibration modes
- H03H2009/02511—Vertical, i.e. perpendicular to the substrate plane
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H2009/241—Bulk-mode MEMS resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H2009/2442—Square resonators
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20095988A FI20095988A0 (fi) | 2009-09-28 | 2009-09-28 | Mikromekaaninen resonaattori ja menetelmä sen valmistamiseksi |
EP10821619.3A EP2484008B1 (en) | 2009-09-28 | 2010-09-27 | A micromechanical resonator |
PCT/FI2010/050744 WO2011042597A1 (en) | 2009-09-28 | 2010-09-27 | A micromechanical resonator |
US13/497,805 US20120229226A1 (en) | 2009-09-28 | 2010-09-27 | Micromechanical Resonator |
CN201080043268.3A CN102577118B (zh) | 2009-09-28 | 2010-09-27 | 微机械谐振器 |
JP2012530301A JP5704614B2 (ja) | 2009-09-28 | 2010-09-27 | マイクロメカニカル共振器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20095988A FI20095988A0 (fi) | 2009-09-28 | 2009-09-28 | Mikromekaaninen resonaattori ja menetelmä sen valmistamiseksi |
Publications (1)
Publication Number | Publication Date |
---|---|
FI20095988A0 true FI20095988A0 (fi) | 2009-09-28 |
Family
ID=41136448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20095988A FI20095988A0 (fi) | 2009-09-28 | 2009-09-28 | Mikromekaaninen resonaattori ja menetelmä sen valmistamiseksi |
Country Status (6)
Country | Link |
---|---|
US (1) | US20120229226A1 (fi) |
EP (1) | EP2484008B1 (fi) |
JP (1) | JP5704614B2 (fi) |
CN (1) | CN102577118B (fi) |
FI (1) | FI20095988A0 (fi) |
WO (1) | WO2011042597A1 (fi) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070205969A1 (en) | 2005-02-23 | 2007-09-06 | Pixtronix, Incorporated | Direct-view MEMS display devices and methods for generating images thereon |
US9229222B2 (en) | 2005-02-23 | 2016-01-05 | Pixtronix, Inc. | Alignment methods in fluid-filled MEMS displays |
US9082353B2 (en) | 2010-01-05 | 2015-07-14 | Pixtronix, Inc. | Circuits for controlling display apparatus |
US8482496B2 (en) | 2006-01-06 | 2013-07-09 | Pixtronix, Inc. | Circuits for controlling MEMS display apparatus on a transparent substrate |
US7999994B2 (en) | 2005-02-23 | 2011-08-16 | Pixtronix, Inc. | Display apparatus and methods for manufacture thereof |
US9261694B2 (en) | 2005-02-23 | 2016-02-16 | Pixtronix, Inc. | Display apparatus and methods for manufacture thereof |
US8310442B2 (en) | 2005-02-23 | 2012-11-13 | Pixtronix, Inc. | Circuits for controlling display apparatus |
US9158106B2 (en) | 2005-02-23 | 2015-10-13 | Pixtronix, Inc. | Display methods and apparatus |
US8159428B2 (en) | 2005-02-23 | 2012-04-17 | Pixtronix, Inc. | Display methods and apparatus |
US8519945B2 (en) | 2006-01-06 | 2013-08-27 | Pixtronix, Inc. | Circuits for controlling display apparatus |
US8526096B2 (en) | 2006-02-23 | 2013-09-03 | Pixtronix, Inc. | Mechanical light modulators with stressed beams |
US9176318B2 (en) | 2007-05-18 | 2015-11-03 | Pixtronix, Inc. | Methods for manufacturing fluid-filled MEMS displays |
US8169679B2 (en) | 2008-10-27 | 2012-05-01 | Pixtronix, Inc. | MEMS anchors |
JP2013519122A (ja) | 2010-02-02 | 2013-05-23 | ピクストロニックス・インコーポレーテッド | ディスプレイ装置を制御するための回路 |
FI123933B (fi) * | 2011-05-13 | 2013-12-31 | Teknologian Tutkimuskeskus Vtt | Mikromekaaninen laite ja menetelmä sen suunnittelemiseksi |
US9695036B1 (en) | 2012-02-02 | 2017-07-04 | Sitime Corporation | Temperature insensitive resonant elements and oscillators and methods of designing and manufacturing same |
US9134552B2 (en) | 2013-03-13 | 2015-09-15 | Pixtronix, Inc. | Display apparatus with narrow gap electrostatic actuators |
TWI538396B (zh) * | 2013-05-20 | 2016-06-11 | 國立清華大學 | 微機電共振器之主動式溫度補償方法及其共振器 |
US9705470B1 (en) | 2014-02-09 | 2017-07-11 | Sitime Corporation | Temperature-engineered MEMS resonator |
US9712128B2 (en) | 2014-02-09 | 2017-07-18 | Sitime Corporation | Microelectromechanical resonator |
TWI569571B (zh) * | 2015-05-12 | 2017-02-01 | 國立清華大學 | 超低功率熱致動振盪器及其驅動電路 |
EP3311486B1 (en) * | 2015-06-19 | 2020-12-02 | SiTime Corporation | Microelectromechanical resonator |
FI127940B (fi) * | 2016-07-01 | 2019-05-31 | Teknologian Tutkimuskeskus Vtt Oy | Mikromekaaninen resonaattori ja menetelmä mikromekaanisen resonaattorin trimmaamiseksi |
US10676349B1 (en) | 2016-08-12 | 2020-06-09 | Sitime Corporation | MEMS resonator |
CN107659283B (zh) * | 2017-09-21 | 2019-09-24 | 华中科技大学 | 一种基于soi-mems的温控隔振平台加工方法 |
JP7001983B2 (ja) * | 2018-05-02 | 2022-02-07 | 株式会社村田製作所 | 共振子及び共振装置 |
US11637540B2 (en) | 2019-10-30 | 2023-04-25 | X-Celeprint Limited | Non-linear tethers for suspended devices |
FI20205711A1 (fi) * | 2020-07-03 | 2022-01-04 | Kyocera Tikitin Oy | Mems-resonaattori ja valmistusmenetelmä |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58153412A (ja) * | 1982-03-08 | 1983-09-12 | Nec Corp | 圧電薄膜複合振動子 |
JPH08186467A (ja) * | 1994-12-29 | 1996-07-16 | Murata Mfg Co Ltd | 拡がり振動型圧電振動子およびその製造方法 |
DE19641284C1 (de) * | 1996-10-07 | 1998-05-20 | Inst Mikro Und Informationstec | Drehratensensor mit entkoppelten orthogonalen Primär- und Sekundärschwingungen |
US6557419B1 (en) * | 1996-12-31 | 2003-05-06 | Honeywell International Inc. | Zero TCF thin film resonator |
IL149397A0 (en) * | 1999-11-02 | 2002-11-10 | Ebauchesfabrik Eta Ag | Time base comprising an integrated micromechanical ring resonator |
JP3589211B2 (ja) * | 2001-09-19 | 2004-11-17 | 株式会社大真空 | 圧電振動デバイス |
US6987432B2 (en) * | 2003-04-16 | 2006-01-17 | Robert Bosch Gmbh | Temperature compensation for silicon MEMS resonator |
US7068125B2 (en) * | 2004-03-04 | 2006-06-27 | Robert Bosch Gmbh | Temperature controlled MEMS resonator and method for controlling resonator frequency |
US7205867B2 (en) * | 2005-05-19 | 2007-04-17 | Robert Bosch Gmbh | Microelectromechanical resonator structure, and method of designing, operating and using same |
WO2007072409A2 (en) * | 2005-12-23 | 2007-06-28 | Nxp B.V. | A mems resonator, a method of manufacturing thereof, and a mems oscillator |
JP4760384B2 (ja) * | 2006-01-10 | 2011-08-31 | セイコーエプソン株式会社 | Mems振動子 |
US7824098B2 (en) * | 2006-06-02 | 2010-11-02 | The Board Of Trustees Of The Leland Stanford Junior University | Composite mechanical transducers and approaches therefor |
CH700716B1 (fr) * | 2006-10-09 | 2010-10-15 | Suisse Electronique Microtech | Résonateur en silicium de type diapason. |
JPWO2008093514A1 (ja) * | 2007-02-02 | 2010-05-20 | 株式会社村田製作所 | 圧電薄膜共振子 |
JP2008219237A (ja) * | 2007-03-01 | 2008-09-18 | Seiko Epson Corp | バルク音響振動子 |
US7591201B1 (en) * | 2007-03-09 | 2009-09-22 | Silicon Clocks, Inc. | MEMS structure having a compensated resonating member |
US7639104B1 (en) * | 2007-03-09 | 2009-12-29 | Silicon Clocks, Inc. | Method for temperature compensation in MEMS resonators with isolated regions of distinct material |
JP5122888B2 (ja) * | 2007-08-27 | 2013-01-16 | セイコーインスツル株式会社 | 発振子、発振子の製造方法、及び発振器 |
EP2179455A2 (en) * | 2007-09-19 | 2010-04-28 | Georgia Tech Research Corporation | Single-resonator dual-frequency lateral-extension mode piezoelectric oscillators, and operating methods thereof |
JP2009111623A (ja) * | 2007-10-29 | 2009-05-21 | Murata Mfg Co Ltd | 圧電振動装置 |
US8234774B2 (en) * | 2007-12-21 | 2012-08-07 | Sitime Corporation | Method for fabricating a microelectromechanical system (MEMS) resonator |
JP5128296B2 (ja) * | 2008-01-21 | 2013-01-23 | セイコーインスツル株式会社 | 静電振動子および発振器 |
US7889030B2 (en) * | 2008-08-07 | 2011-02-15 | Infineon Technologies Ag | Passive temperature compensation of silicon MEMS devices |
-
2009
- 2009-09-28 FI FI20095988A patent/FI20095988A0/fi not_active Application Discontinuation
-
2010
- 2010-09-27 JP JP2012530301A patent/JP5704614B2/ja active Active
- 2010-09-27 EP EP10821619.3A patent/EP2484008B1/en active Active
- 2010-09-27 US US13/497,805 patent/US20120229226A1/en not_active Abandoned
- 2010-09-27 CN CN201080043268.3A patent/CN102577118B/zh active Active
- 2010-09-27 WO PCT/FI2010/050744 patent/WO2011042597A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN102577118B (zh) | 2016-03-16 |
EP2484008A1 (en) | 2012-08-08 |
US20120229226A1 (en) | 2012-09-13 |
JP5704614B2 (ja) | 2015-04-22 |
EP2484008B1 (en) | 2016-08-10 |
EP2484008A4 (en) | 2014-06-18 |
JP2013506334A (ja) | 2013-02-21 |
WO2011042597A1 (en) | 2011-04-14 |
CN102577118A (zh) | 2012-07-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD | Application lapsed |