IT1318257B1 - Lead-frame per dispositivi a semiconduttore. - Google Patents

Lead-frame per dispositivi a semiconduttore.

Info

Publication number
IT1318257B1
IT1318257B1 IT2000MI001719A ITMI20001719A IT1318257B1 IT 1318257 B1 IT1318257 B1 IT 1318257B1 IT 2000MI001719 A IT2000MI001719 A IT 2000MI001719A IT MI20001719 A ITMI20001719 A IT MI20001719A IT 1318257 B1 IT1318257 B1 IT 1318257B1
Authority
IT
Italy
Prior art keywords
lead
frame
semiconductor devices
semiconductor
devices
Prior art date
Application number
IT2000MI001719A
Other languages
English (en)
Inventor
Andrea Giovanni Cigada
Phui Phoong Chuang
Original Assignee
St Microelectronics Srl
St Microelectronics Sdn
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl, St Microelectronics Sdn filed Critical St Microelectronics Srl
Priority to IT2000MI001719A priority Critical patent/IT1318257B1/it
Publication of ITMI20001719A0 publication Critical patent/ITMI20001719A0/it
Priority to US09/917,406 priority patent/US7075172B2/en
Publication of ITMI20001719A1 publication Critical patent/ITMI20001719A1/it
Application granted granted Critical
Publication of IT1318257B1 publication Critical patent/IT1318257B1/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
IT2000MI001719A 2000-07-27 2000-07-27 Lead-frame per dispositivi a semiconduttore. IT1318257B1 (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IT2000MI001719A IT1318257B1 (it) 2000-07-27 2000-07-27 Lead-frame per dispositivi a semiconduttore.
US09/917,406 US7075172B2 (en) 2000-07-27 2001-07-26 Lead-frame for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT2000MI001719A IT1318257B1 (it) 2000-07-27 2000-07-27 Lead-frame per dispositivi a semiconduttore.

Publications (3)

Publication Number Publication Date
ITMI20001719A0 ITMI20001719A0 (it) 2000-07-27
ITMI20001719A1 ITMI20001719A1 (it) 2002-01-27
IT1318257B1 true IT1318257B1 (it) 2003-07-28

Family

ID=11445576

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2000MI001719A IT1318257B1 (it) 2000-07-27 2000-07-27 Lead-frame per dispositivi a semiconduttore.

Country Status (2)

Country Link
US (1) US7075172B2 (it)
IT (1) IT1318257B1 (it)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6969918B1 (en) * 2001-08-30 2005-11-29 Micron Technology, Inc. System for fabricating semiconductor components using mold cavities having runners configured to minimize venting
US20040113240A1 (en) * 2002-10-11 2004-06-17 Wolfgang Hauser An electronic component with a leadframe
KR100555495B1 (ko) * 2003-02-08 2006-03-03 삼성전자주식회사 칩 어레이 몰딩용 몰드 다이, 그것을 포함하는 몰딩 장치및 칩 어레이 몰딩 방법
US20060284286A1 (en) * 2005-06-20 2006-12-21 Texas Instrument Inc. Flashless molding of integrated circuit devices
US7939382B2 (en) * 2007-06-28 2011-05-10 Sandisk Corporation Method of fabricating a semiconductor package having through holes for molding back side of package
US7952179B2 (en) * 2007-06-28 2011-05-31 Sandisk Corporation Semiconductor package having through holes for molding back side of package
US8370777B2 (en) * 2009-06-16 2013-02-05 Lsi Corporation Method of generating a leadframe IC package model, a leadframe modeler and an IC design system
US8946901B2 (en) * 2013-01-22 2015-02-03 Invensas Corporation Microelectronic package and method of manufacture thereof

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4777520A (en) * 1986-03-27 1988-10-11 Oki Electric Industry Co. Ltd. Heat-resistant plastic semiconductor device
JPH01192154A (ja) * 1988-01-28 1989-08-02 Nippon Motoroola Kk リードフレーム
US5275546A (en) * 1991-12-30 1994-01-04 Fierkens Richard H J Plastic encapsulation apparatus for an integrated circuit lead frame and method therefor
JP2781689B2 (ja) * 1992-01-22 1998-07-30 九州日本電気株式会社 半導体装置の製造方法
JPH0730037A (ja) * 1993-05-11 1995-01-31 Sumitomo Metal Mining Co Ltd リードフレーム
TW344109B (en) * 1994-02-10 1998-11-01 Hitachi Ltd Methods of making semiconductor devices
US5665296A (en) * 1994-03-24 1997-09-09 Intel Corporation Molding technique for molding plastic packages
JP2586831B2 (ja) * 1994-09-22 1997-03-05 日本電気株式会社 樹脂封止用金型および半導体装置の製造方法
KR20040045045A (ko) * 1996-12-26 2004-05-31 가부시키가이샤 히타치세이사쿠쇼 반도체장치
US6001672A (en) * 1997-02-25 1999-12-14 Micron Technology, Inc. Method for transfer molding encapsulation of a semiconductor die with attached heat sink
KR100241175B1 (ko) * 1997-12-16 2000-02-01 윤종용 돌출부가 형성된 컬-블록을 갖는 트랜스퍼 몰딩 장치
US6008074A (en) * 1998-10-01 1999-12-28 Micron Technology, Inc. Method of forming a synchronous-link dynamic random access memory edge-mounted device
KR200309906Y1 (ko) * 1999-06-30 2003-04-14 앰코 테크놀로지 코리아 주식회사 반도체 패키지 제조용 리드프레임
US6319450B1 (en) * 1999-07-12 2001-11-20 Agere Systems Guardian Corp. Encapsulated circuit using vented mold
US6312976B1 (en) * 1999-11-22 2001-11-06 Advanced Semiconductor Engineering, Inc. Method for manufacturing leadless semiconductor chip package
US6523254B1 (en) * 2000-04-19 2003-02-25 Micron Technology, Inc. Method for gate blocking x-outs during a molding process
US6589820B1 (en) * 2000-06-16 2003-07-08 Micron Technology, Inc. Method and apparatus for packaging a microelectronic die

Also Published As

Publication number Publication date
ITMI20001719A1 (it) 2002-01-27
US7075172B2 (en) 2006-07-11
US20020033523A1 (en) 2002-03-21
ITMI20001719A0 (it) 2000-07-27

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