IT1177055B - Costruzione di laminato rivestito di metallo - Google Patents

Costruzione di laminato rivestito di metallo

Info

Publication number
IT1177055B
IT1177055B IT23337/84A IT2333784A IT1177055B IT 1177055 B IT1177055 B IT 1177055B IT 23337/84 A IT23337/84 A IT 23337/84A IT 2333784 A IT2333784 A IT 2333784A IT 1177055 B IT1177055 B IT 1177055B
Authority
IT
Italy
Prior art keywords
construction
metal coated
coated laminate
laminate
metal
Prior art date
Application number
IT23337/84A
Other languages
English (en)
Other versions
IT8423337A0 (it
Inventor
Robert William Green
Jr Delton Andrews Grey
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of IT8423337A0 publication Critical patent/IT8423337A0/it
Application granted granted Critical
Publication of IT1177055B publication Critical patent/IT1177055B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/08—Reinforcements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/16—Tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/20—Zinc
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
IT23337/84A 1983-11-07 1984-10-26 Costruzione di laminato rivestito di metallo IT1177055B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/549,031 US4499152A (en) 1982-08-09 1983-11-07 Metal-clad laminate construction

Publications (2)

Publication Number Publication Date
IT8423337A0 IT8423337A0 (it) 1984-10-26
IT1177055B true IT1177055B (it) 1987-08-26

Family

ID=24191379

Family Applications (1)

Application Number Title Priority Date Filing Date
IT23337/84A IT1177055B (it) 1983-11-07 1984-10-26 Costruzione di laminato rivestito di metallo

Country Status (6)

Country Link
US (1) US4499152A (it)
JP (1) JPS60137640A (it)
DE (1) DE3440241A1 (it)
FR (1) FR2554389B1 (it)
GB (1) GB2149346B (it)
IT (1) IT1177055B (it)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60171277A (ja) * 1984-02-17 1985-09-04 株式会社東芝 金属−セラミツクス接合体
JPS6121983A (ja) * 1984-07-07 1986-01-30 工業技術院長 非酸化物系セラミックス―金属複合材料の製造方法
JPS62127746A (ja) * 1985-11-28 1987-06-10 Ricoh Co Ltd 電子写真感光体用電極
DE3620601A1 (de) * 1986-06-19 1987-12-23 Akzo Gmbh Verfahren zur herstellung von polyimid-metall-laminaten
DE3811686A1 (de) * 1987-04-09 1988-10-27 Fuji Photo Film Co Ltd Photographischer traeger
CA1298740C (en) * 1987-06-30 1992-04-14 William John Parr Conductive metallization of substrates without developing agents
US4997674A (en) * 1987-06-30 1991-03-05 Akzo America Inc. Conductive metallization of substrates via developing agents
FR2619984B1 (fr) * 1987-08-24 1996-03-01 Aerospatiale Procede de realisation de circuits imprimes presentant des surfaces complexes a priori non developpables
EP0310010B1 (en) * 1987-10-01 1994-01-12 Mcgean-Rohco, Inc. Multilayer printed circuit board formation
US5190795A (en) * 1989-09-14 1993-03-02 Minnesota Mining And Manufacturing Company Method for improving adhesion to metal
US5073456A (en) * 1989-12-05 1991-12-17 E. I. Du Pont De Nemours And Company Multilayer printed circuit board formation
US5153986A (en) * 1991-07-17 1992-10-13 International Business Machines Method for fabricating metal core layers for a multi-layer circuit board
US5210941A (en) * 1991-07-19 1993-05-18 Poly Circuits, Inc. Method for making circuit board having a metal support
DE4233021A1 (de) * 1992-10-01 1994-04-07 Huels Chemische Werke Ag Organosilanpolykondensate
US5385787A (en) * 1993-02-03 1995-01-31 Amp-Akzo Corporation Organosilane adhesion promotion in manufacture of additive printed wiring board
IL111497A (en) 1993-12-08 2001-01-28 Rohco Inc Mcgean Seelan preparations are useful as adhesives
US5928790A (en) * 1996-04-23 1999-07-27 Mcgean-Rohco, Inc. Multilayer circuit boards and processes of making the same
US5885436A (en) * 1997-08-06 1999-03-23 Gould Electronics Inc. Adhesion enhancement for metal foil
US6086743A (en) * 1997-08-06 2000-07-11 Gould Electronics, Inc. Adhesion enhancement for metal foil
ES2367838T3 (es) * 1998-09-10 2011-11-10 JX Nippon Mining & Metals Corp. Laminado que comprende una hoja de cobre tratada y procedimiento para su fabricación.
IT1305116B1 (it) 1998-09-14 2001-04-10 Zincocelere Spa Componente per circuito stampato multistrato, metodo per la suafabbricazione e relativo circuito stampato multiuso.
US6391220B1 (en) 1999-08-18 2002-05-21 Fujitsu Limited, Inc. Methods for fabricating flexible circuit structures
US6569543B2 (en) * 2001-02-15 2003-05-27 Olin Corporation Copper foil with low profile bond enahncement
EP1434897A1 (de) * 2001-10-08 2004-07-07 Aixtron AG Verfahren und vorrichtung zum abscheiden einer vielzahl von schichten auf einem substrat
JP4259024B2 (ja) * 2002-02-07 2009-04-30 富士通株式会社 多層配線基板の製造方法およびこれにより製造される多層配線基板
US7132158B2 (en) * 2003-10-22 2006-11-07 Olin Corporation Support layer for thin copper foil
DE102004025767A1 (de) 2004-05-26 2005-12-22 Degussa Ag Stabile Lösungen von N-substituierten Aminopolysiloxanen, deren Herstellung und Verwendung
EP2244542B1 (en) 2009-04-24 2013-03-27 Atotech Deutschland GmbH Multilayer printed circuit board manufacture
CH703032A2 (de) * 2010-04-25 2011-10-31 Johan Laubscher Kochgeschirr mit einem deformationsfreien Boden und Verfahren zu seiner Herstellung.
WO2013023101A1 (en) * 2011-08-10 2013-02-14 Cac, Inc. Multiple layer z-axis interconnect apparatus and method of use
EP2603064A1 (en) 2011-12-08 2013-06-12 Atotech Deutschland GmbH Multilayer printed circuit board manufacture
US8945990B2 (en) * 2012-04-24 2015-02-03 Infineon Technologies Ag Chip package and method of forming the same
KR20180060687A (ko) * 2016-11-29 2018-06-07 삼성전기주식회사 인쇄회로기판 제조방법
EP3473633B8 (de) 2017-10-18 2019-12-18 Evonik Operations GmbH Eine farblose, 3-(n-vinylbenzyl-2-aminoethyl)aminopropyltrimethoxysilanhydrochlorid und methanol enthaltenden zusammensetzung, ein verfahren zu deren herstellung und deren verwendung
DE102018208691A1 (de) 2018-01-31 2019-08-01 Evonik Degussa Gmbh Spezielle Zusammensetzung organofunktioneller Alkoxysilane und deren Verwendung
EP3611236B1 (de) 2018-08-17 2020-09-30 Evonik Operations GmbH Eine wässrige, lagerstabile zusammensetzung, die n-benzyl-substituierte n-(2-aminoethyl)-3-aminopropylsiloxan-hydrochloride enthält, verfahren zu deren herstellung und deren verwendung
EP3708569A1 (de) 2019-03-11 2020-09-16 Evonik Operations GmbH Ein voc freies, wässriges und lagerstabiles n-vinylbenzylaminalkyl-funktionelles siloxanol und verfahren zu dessen herstellung
CN110484877A (zh) * 2019-10-09 2019-11-22 安徽鸿海新材料股份有限公司 一种陶瓷基覆铜板的制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3984598A (en) * 1974-02-08 1976-10-05 Universal Oil Products Company Metal-clad laminates
JPS5853079B2 (ja) * 1976-03-15 1983-11-26 三井アナコンダ銅箔株式会社 銅箔の防錆方法
DE2636095B2 (de) * 1976-08-11 1979-02-01 Uop Inc., Des Plaines, Ill. (V.St.A.) Verfahren zur Herstellung metallisierter Laminate
DE2754248C2 (de) * 1977-12-06 1982-07-01 Califoil Inc., San Diego, Calif. Verbundwerkstoff für die Herstellung von gedruckten Schaltungen
JPS5954027B2 (ja) * 1980-08-14 1984-12-27 新神戸電機株式会社 印刷配線板用積層板
US4357395A (en) * 1980-08-22 1982-11-02 General Electric Company Transfer lamination of vapor deposited foils, method and product
US4383003A (en) * 1980-09-22 1983-05-10 General Electric Company Transfer lamination of copper thin sheets and films, method and product
GB2091634B (en) * 1981-01-22 1984-12-05 Gen Electric Transfer lamination of vapour deposited copper thin sheets and films
US4364731A (en) * 1981-01-29 1982-12-21 Board Of Regents, The University Of Texas System Methods for producing adhesive bonds between substrate and polymer employing an intermediate oxide layer
FR2554046B1 (fr) * 1983-10-28 1986-05-09 Gen Electric Stratifie recouvert de metal et procede de fabrication
GB2148182B (en) * 1983-11-03 1987-02-11 Gen Electric Metal-clad laminate construction

Also Published As

Publication number Publication date
GB2149346A (en) 1985-06-12
DE3440241A1 (de) 1985-05-15
GB2149346B (en) 1987-10-28
FR2554389A1 (fr) 1985-05-10
GB8422832D0 (en) 1984-10-17
US4499152A (en) 1985-02-12
JPH0530620B2 (it) 1993-05-10
JPS60137640A (ja) 1985-07-22
IT8423337A0 (it) 1984-10-26
FR2554389B1 (fr) 1989-06-30

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19951026