IT1134010B - Dispositivo avente un circuito integrato a semiconduttori - Google Patents

Dispositivo avente un circuito integrato a semiconduttori

Info

Publication number
IT1134010B
IT1134010B IT25539/80A IT2553980A IT1134010B IT 1134010 B IT1134010 B IT 1134010B IT 25539/80 A IT25539/80 A IT 25539/80A IT 2553980 A IT2553980 A IT 2553980A IT 1134010 B IT1134010 B IT 1134010B
Authority
IT
Italy
Prior art keywords
integrated circuit
semiconductor integrated
semiconductor
circuit
integrated
Prior art date
Application number
IT25539/80A
Other languages
English (en)
Italian (it)
Other versions
IT8025539A0 (it
Inventor
Seki Kunio
Takeshita Ritsuji
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of IT8025539A0 publication Critical patent/IT8025539A0/it
Application granted granted Critical
Publication of IT1134010B publication Critical patent/IT1134010B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/211—Design considerations for internal polarisation
    • H10D89/311—Design considerations for internal polarisation in bipolar devices
    • H10W20/43—
    • H10W42/00—
    • H10W72/00—
    • H10W44/206—
    • H10W70/60—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5445—
    • H10W72/5449—
    • H10W72/5473—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/59—
    • H10W72/926—
    • H10W72/932—
    • H10W72/952—
    • H10W90/756—
IT25539/80A 1979-10-26 1980-10-23 Dispositivo avente un circuito integrato a semiconduttori IT1134010B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13764579A JPS5662352A (en) 1979-10-26 1979-10-26 Semiconductor integrated circuit device for acoustic amplification circuit

Publications (2)

Publication Number Publication Date
IT8025539A0 IT8025539A0 (it) 1980-10-23
IT1134010B true IT1134010B (it) 1986-07-24

Family

ID=15203472

Family Applications (1)

Application Number Title Priority Date Filing Date
IT25539/80A IT1134010B (it) 1979-10-26 1980-10-23 Dispositivo avente un circuito integrato a semiconduttori

Country Status (8)

Country Link
US (1) US4403240A (cg-RX-API-DMAC10.html)
JP (1) JPS5662352A (cg-RX-API-DMAC10.html)
DE (1) DE3039261A1 (cg-RX-API-DMAC10.html)
GB (1) GB2061617B (cg-RX-API-DMAC10.html)
HK (1) HK37785A (cg-RX-API-DMAC10.html)
IT (1) IT1134010B (cg-RX-API-DMAC10.html)
MY (1) MY8600121A (cg-RX-API-DMAC10.html)
SG (1) SG63084G (cg-RX-API-DMAC10.html)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57210661A (en) * 1981-06-19 1982-12-24 Hitachi Ltd Semiconductor integrated circuit device
JPS5870564A (ja) * 1981-10-23 1983-04-27 Hitachi Ltd 集積回路の電源供給回路
JPS58157151A (ja) * 1982-03-15 1983-09-19 Mitsubishi Electric Corp 半導体集積回路装置
JPS594050A (ja) * 1982-06-30 1984-01-10 Fujitsu Ltd 半導体装置
US4534105A (en) * 1983-08-10 1985-08-13 Rca Corporation Method for grounding a pellet support pad in an integrated circuit device
US4631572A (en) * 1983-09-27 1986-12-23 Trw Inc. Multiple path signal distribution to large scale integration chips
JPS6079754U (ja) * 1983-11-07 1985-06-03 三洋電機株式会社 半導体集積回路装置
US4751458A (en) * 1984-04-02 1988-06-14 American Telephone And Telegraph Company, At&T Bell Laboratories Test pads for integrated circuit chips
EP0204177A1 (de) * 1985-05-31 1986-12-10 Siemens Aktiengesellschaft Anschlussanordnung für einen integrierten Halbleiterschaltkreis
DE3626151C3 (de) * 1986-08-01 1995-06-14 Siemens Ag Spannungszuführungsanordnung für eine integrierte Halbleiterschaltung
JPH0249463A (ja) * 1988-05-27 1990-02-19 Matsushita Electron Corp 半導体装置
JPH0233801U (cg-RX-API-DMAC10.html) * 1988-08-22 1990-03-02
JPH03259561A (ja) * 1990-03-09 1991-11-19 Fujitsu Ltd 半導体装置
JP2917607B2 (ja) * 1991-10-02 1999-07-12 セイコーエプソン株式会社 半導体装置用リードフレーム
JP3246129B2 (ja) * 1993-10-01 2002-01-15 ソニー株式会社 半導体素子の製造方法
JP2807396B2 (ja) * 1993-05-25 1998-10-08 ローム株式会社 半導体装置
JP2520225B2 (ja) * 1994-01-26 1996-07-31 富士通株式会社 半導体集積回路装置
US5684332A (en) * 1994-05-27 1997-11-04 Advanced Semiconductor Engineering, Inc. Method of packaging a semiconductor device with minimum bonding pad pitch and packaged device therefrom
RU2133067C1 (ru) * 1996-02-20 1999-07-10 Завьялов Дмитрий Валентинович Интегральная схема
FR2769131B1 (fr) * 1997-09-29 1999-12-24 St Microelectronics Sa Dispositif semi-conducteur a deux plots de connexion de masse relies a une patte de connexion de masse et procede pour tester un tel dispositif
US6351040B1 (en) 1998-01-22 2002-02-26 Micron Technology, Inc. Method and apparatus for implementing selected functionality on an integrated circuit device
US6169331B1 (en) 1998-08-28 2001-01-02 Micron Technology, Inc. Apparatus for electrically coupling bond pads of a microelectronic device
US6373143B1 (en) 1998-09-24 2002-04-16 International Business Machines Corporation Integrated circuit having wirebond pads suitable for probing
AU2001268597A1 (en) * 2000-07-06 2002-01-21 Zeta, A Division Of Sierratech, Inc. A solid state power amplifying device
US6770982B1 (en) 2002-01-16 2004-08-03 Marvell International, Ltd. Semiconductor device power distribution system and method
US8258616B1 (en) 2002-01-16 2012-09-04 Marvell International Ltd. Semiconductor dice having a shielded area created under bond wires connecting pairs of bonding pads
US6861762B1 (en) * 2002-05-01 2005-03-01 Marvell Semiconductor Israel Ltd. Flip chip with novel power and ground arrangement

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3558992A (en) 1968-06-17 1971-01-26 Rca Corp Integrated circuit having bonding pads over unused active area components
BE756061A (fr) * 1969-09-11 1971-03-11 Philips Nv Dispositif semi-conducteur
JPS525228B2 (cg-RX-API-DMAC10.html) * 1972-09-18 1977-02-10
JPS5851426B2 (ja) * 1977-07-22 1983-11-16 株式会社日立製作所 半導体集積回路装置

Also Published As

Publication number Publication date
MY8600121A (en) 1986-12-31
JPS5662352A (en) 1981-05-28
HK37785A (en) 1985-05-24
GB2061617B (en) 1983-12-21
GB2061617A (en) 1981-05-13
DE3039261A1 (de) 1981-05-07
JPS6331105B2 (cg-RX-API-DMAC10.html) 1988-06-22
US4403240A (en) 1983-09-06
SG63084G (en) 1985-03-29
IT8025539A0 (it) 1980-10-23

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