IT1096068B - Perfezionamenti nell'incapsulamento di elementi microelettronici,ed elementi microelettronici cosi'incapsulati - Google Patents

Perfezionamenti nell'incapsulamento di elementi microelettronici,ed elementi microelettronici cosi'incapsulati

Info

Publication number
IT1096068B
IT1096068B IT23015/78A IT2301578A IT1096068B IT 1096068 B IT1096068 B IT 1096068B IT 23015/78 A IT23015/78 A IT 23015/78A IT 2301578 A IT2301578 A IT 2301578A IT 1096068 B IT1096068 B IT 1096068B
Authority
IT
Italy
Prior art keywords
micro
electronic elements
encapsulation
encapsulated
electronic
Prior art date
Application number
IT23015/78A
Other languages
English (en)
Other versions
IT7823015A0 (it
Original Assignee
Pierkens Richardus Henricus Jo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pierkens Richardus Henricus Jo filed Critical Pierkens Richardus Henricus Jo
Publication of IT7823015A0 publication Critical patent/IT7823015A0/it
Application granted granted Critical
Publication of IT1096068B publication Critical patent/IT1096068B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/54—Providing fillings in containers, e.g. gas fillings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
IT23015/78A 1977-05-05 1978-05-04 Perfezionamenti nell'incapsulamento di elementi microelettronici,ed elementi microelettronici cosi'incapsulati IT1096068B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NLAANVRAGE7704937,A NL189379C (nl) 1977-05-05 1977-05-05 Werkwijze voor inkapselen van micro-elektronische elementen.

Publications (2)

Publication Number Publication Date
IT7823015A0 IT7823015A0 (it) 1978-05-04
IT1096068B true IT1096068B (it) 1985-08-17

Family

ID=19828496

Family Applications (1)

Application Number Title Priority Date Filing Date
IT23015/78A IT1096068B (it) 1977-05-05 1978-05-04 Perfezionamenti nell'incapsulamento di elementi microelettronici,ed elementi microelettronici cosi'incapsulati

Country Status (9)

Country Link
US (1) US4250347A (it)
JP (1) JPS53138275A (it)
DE (1) DE2819287A1 (it)
FR (1) FR2390008B1 (it)
GB (1) GB1590158A (it)
HK (1) HK30582A (it)
IT (1) IT1096068B (it)
NL (1) NL189379C (it)
SE (1) SE438060B (it)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4332537A (en) * 1978-07-17 1982-06-01 Dusan Slepcevic Encapsulation mold with removable cavity plates
DE2930760A1 (de) * 1979-07-28 1981-02-12 Itt Ind Gmbh Deutsche Verfahren zum umhuellen von halbleiterbauelementen mittels spritzgiessens
DE2944614C2 (de) * 1979-11-05 1986-10-30 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Vergießen eines Halbleiterbauelements
US4599062A (en) * 1981-01-26 1986-07-08 Dai-Ichi Seiko Co., Ltd. Encapsulation molding apparatus
JPS57147260A (en) * 1981-03-05 1982-09-11 Matsushita Electronics Corp Manufacture of resin-sealed semiconductor device and lead frame used therefor
US4451973A (en) * 1981-04-28 1984-06-05 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
CA1195782A (en) * 1981-07-06 1985-10-22 Mikio Nishikawa Lead frame for plastic encapsulated semiconductor device
NL8203253A (nl) * 1982-08-19 1984-03-16 Arbo Handel Ontwikkeling Werkwijze en inrichting voor het met kunststof omhullen van elektronische componenten.
US4633573A (en) * 1982-10-12 1987-01-06 Aegis, Inc. Microcircuit package and sealing method
JPS5979417A (ja) * 1982-10-28 1984-05-08 Sony Corp 磁気ヘツド装置
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
JPS59188372A (ja) * 1984-03-16 1984-10-25 Matsushita Electric Ind Co Ltd プラグ形電力変換装置
JPS6150353A (ja) * 1984-08-20 1986-03-12 Oki Electric Ind Co Ltd Ｅｐｒｏｍ装置
WO1986002200A1 (en) * 1984-09-27 1986-04-10 Motorola, Inc. Lead frame having improved arrangement of supporting leads and semiconductor device employing the same
DE3604075A1 (de) * 1986-02-08 1987-08-13 Bosch Gmbh Robert Verpackung von leistungsbauelementen
FR2598258B1 (fr) * 1986-04-30 1988-10-07 Aix Les Bains Composants Procede d'encapsulation de circuits integres.
DE3623419A1 (de) * 1986-07-11 1988-01-21 Junghans Uhren Gmbh Verfahren zum bestuecken eines leiterbahnen-netzwerkes fuer den schaltungstraeger eines elektromechanischen uhrwerks und teilbestuecktes leiterbahnen-netzwerk eines uhrwerks-schaltungstraegers
JPS6331149A (ja) * 1986-07-25 1988-02-09 Fujitsu Ltd 半導体装置
US4855807A (en) * 1986-12-26 1989-08-08 Kabushiki Kaisha Toshiba Semiconductor device
KR930004237B1 (ko) * 1988-02-20 1993-05-22 도이취 아이티티 인더스트리스 게젤샤프트 미트 베쉬랭크터 하프퉁 반도체장치, 그 제조방법, 그 방법 수행장치 및 조립체설비
US4908935A (en) * 1989-03-22 1990-03-20 American Telephone And Telegraph Company, At&T Bell Laboratories Method for fabricating electronic devices
FR2659157B2 (fr) * 1989-05-26 1994-09-30 Lemaire Gerard Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede.
US5047834A (en) * 1989-06-20 1991-09-10 International Business Machines Corporation High strength low stress encapsulation of interconnected semiconductor devices
US5030796A (en) * 1989-08-11 1991-07-09 Rockwell International Corporation Reverse-engineering resistant encapsulant for microelectric device
JP2656356B2 (ja) * 1989-09-13 1997-09-24 株式会社東芝 多重モールド型半導体装置及びその製造方法
JP2748592B2 (ja) * 1989-09-18 1998-05-06 セイコーエプソン株式会社 半導体装置の製造方法および半導体封止用成形金型
JPH04330744A (ja) * 1990-09-14 1992-11-18 Mitsubishi Electric Corp 半導体装置の製造方法
JP2774906B2 (ja) * 1992-09-17 1998-07-09 三菱電機株式会社 薄形半導体装置及びその製造方法
US6613978B2 (en) 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US5880403A (en) 1994-04-01 1999-03-09 Space Electronics, Inc. Radiation shielding of three dimensional multi-chip modules
US5332944A (en) * 1993-10-06 1994-07-26 Cline David J Environmentally sealed piezoelectric switch assembly
US6720493B1 (en) 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
US6261508B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Method for making a shielding composition
US5821607A (en) * 1997-01-08 1998-10-13 Orient Semiconductor Electronics, Ltd. Frame for manufacturing encapsulated semiconductor devices
US6100598A (en) * 1997-03-06 2000-08-08 Nippon Steel Semiconductor Corporation Sealed semiconductor device with positional deviation between upper and lower molds
NL1005780C2 (nl) * 1997-04-09 1998-10-12 Fico Bv Werkwijze en afdekelement voor het omhullen van electronische componenten.
US6384487B1 (en) * 1999-12-06 2002-05-07 Micron Technology, Inc. Bow resistant plastic semiconductor package and method of fabrication
US6700210B1 (en) 1999-12-06 2004-03-02 Micron Technology, Inc. Electronic assemblies containing bow resistant semiconductor packages
JP3627846B2 (ja) * 1999-12-09 2005-03-09 矢崎総業株式会社 被覆電線端末接続部の防水処理装置
US6368899B1 (en) * 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
SG118103A1 (en) * 2001-12-12 2006-01-27 Micron Technology Inc BOC BGA package for die with I-shaped bond pad layout
US7382043B2 (en) * 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
US7191516B2 (en) * 2003-07-16 2007-03-20 Maxwell Technologies, Inc. Method for shielding integrated circuit devices

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL269613A (it) * 1960-09-27
US3251015A (en) * 1964-05-20 1966-05-10 Gen Electric Miniature magnetic core and component assemblies
FR1442194A (fr) * 1964-08-18 1966-06-10 Siemens Ag élément semi-conducteur et dispositif de fabrication
US3469684A (en) * 1967-01-26 1969-09-30 Advalloy Inc Lead frame package for semiconductor devices and method for making same
US3629668A (en) * 1969-12-19 1971-12-21 Texas Instruments Inc Semiconductor device package having improved compatibility properties
NL7114112A (it) * 1971-10-14 1973-04-17
US3868725A (en) * 1971-10-14 1975-02-25 Philips Corp Integrated circuit lead structure
US3778685A (en) * 1972-03-27 1973-12-11 Nasa Integrated circuit package with lead structure and method of preparing the same
US4066839A (en) * 1972-11-16 1978-01-03 Sgs-Ates Componenti Elettronici S.P.A. Molded body incorporating heat dissipator
US3909838A (en) * 1973-08-01 1975-09-30 Signetics Corp Encapsulated integrated circuit and method
US3838316A (en) * 1973-10-09 1974-09-24 Western Electric Co Encapsulated electrical component assembly and method of fabrication

Also Published As

Publication number Publication date
NL189379B (nl) 1992-10-16
NL7704937A (nl) 1978-11-07
SE7804900L (sv) 1978-11-06
FR2390008A1 (it) 1978-12-01
HK30582A (en) 1982-07-09
NL189379C (nl) 1993-03-16
JPS6112375B2 (it) 1986-04-08
DE2819287A1 (de) 1978-11-09
FR2390008B1 (it) 1985-03-22
SE438060B (sv) 1985-03-25
GB1590158A (en) 1981-05-28
IT7823015A0 (it) 1978-05-04
JPS53138275A (en) 1978-12-02
US4250347A (en) 1981-02-10

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