IT1062029B - Dispositivo e procedimento di incapsulamento e montaggio di moduli elettronici - Google Patents

Dispositivo e procedimento di incapsulamento e montaggio di moduli elettronici

Info

Publication number
IT1062029B
IT1062029B IT49680/76A IT4968076A IT1062029B IT 1062029 B IT1062029 B IT 1062029B IT 49680/76 A IT49680/76 A IT 49680/76A IT 4968076 A IT4968076 A IT 4968076A IT 1062029 B IT1062029 B IT 1062029B
Authority
IT
Italy
Prior art keywords
circuit device
package
encapsulation
procedure
assembly
Prior art date
Application number
IT49680/76A
Other languages
English (en)
Inventor
J Harper
G Blankenship
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/581,604 external-priority patent/US3986334A/en
Priority claimed from US05/581,605 external-priority patent/US4012723A/en
Priority claimed from US05/581,603 external-priority patent/US3986335A/en
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of IT1062029B publication Critical patent/IT1062029B/it

Links

Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Clocks (AREA)
  • Light Receiving Elements (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Electromechanical Clocks (AREA)
IT49680/76A 1975-05-29 1976-05-26 Dispositivo e procedimento di incapsulamento e montaggio di moduli elettronici IT1062029B (it)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US58162075A 1975-05-29 1975-05-29
US05/581,604 US3986334A (en) 1975-05-29 1975-05-29 Electronic watch and its method of fabrication
US05/581,605 US4012723A (en) 1975-05-29 1975-05-29 Magnetic bubble memory packaging arrangement and its method of fabrication
US05/581,603 US3986335A (en) 1975-05-29 1975-05-29 Electronic watch module and its method of fabrication

Publications (1)

Publication Number Publication Date
IT1062029B true IT1062029B (it) 1983-06-25

Family

ID=27504954

Family Applications (1)

Application Number Title Priority Date Filing Date
IT49680/76A IT1062029B (it) 1975-05-29 1976-05-26 Dispositivo e procedimento di incapsulamento e montaggio di moduli elettronici

Country Status (7)

Country Link
JP (1) JPS51145370A (it)
BR (1) BR7603423A (it)
CA (1) CA1058312A (it)
DE (1) DE2623715A1 (it)
FR (1) FR2356339A1 (it)
GB (1) GB1555364A (it)
IT (1) IT1062029B (it)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227555A (en) * 1975-08-27 1977-03-01 Seiko Instr & Electronics Electronic timekeeper
US4064552A (en) * 1976-02-03 1977-12-20 Angelucci Thomas L Multilayer flexible printed circuit tape
US4348751A (en) * 1977-06-20 1982-09-07 Hitachi, Ltd. Electronic device and method of fabricating the same
JPS5424673A (en) * 1977-07-27 1979-02-24 Seiko Epson Corp Electronic wristwatch
CH623452B (fr) * 1977-12-14 Fontainemelon Horlogerie Procede de fabrication d'un module de piece d'horlogerie electronique et module de piece d'horlogerie obtenu par la mise en oeuvre de ce procede.
JPS56122972U (it) * 1980-02-19 1981-09-18
EP0105841A1 (fr) * 1982-10-05 1984-04-18 Ebauches Electroniques S.A. Bande de travail destinée à la fabrication de supports de composants pour montre
US5124782A (en) * 1990-01-26 1992-06-23 Sgs-Thomson Microelectronics, Inc. Integrated circuit package with molded cell
GB9615164D0 (en) * 1996-07-19 1996-09-04 Delta Schoeller Ltd Electrical circuit

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3611061A (en) * 1971-07-07 1971-10-05 Motorola Inc Multiple lead integrated circuit device and frame member for the fabrication thereof
US3784725A (en) * 1972-07-24 1974-01-08 Solitron Devices Electronic hybrid package

Also Published As

Publication number Publication date
FR2356339B1 (it) 1983-03-04
FR2356339A1 (fr) 1978-01-20
DE2623715A1 (de) 1977-01-20
GB1555364A (en) 1979-11-07
CA1058312A (en) 1979-07-10
JPS51145370A (en) 1976-12-14
BR7603423A (pt) 1976-12-21

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