IT1029419B - Rpocedimento per fissare un elemnto conduttor ad un dispositivo a semiconduttore e prodotto ottenuto - Google Patents

Rpocedimento per fissare un elemnto conduttor ad un dispositivo a semiconduttore e prodotto ottenuto

Info

Publication number
IT1029419B
IT1029419B IT47943/75A IT4794375A IT1029419B IT 1029419 B IT1029419 B IT 1029419B IT 47943/75 A IT47943/75 A IT 47943/75A IT 4794375 A IT4794375 A IT 4794375A IT 1029419 B IT1029419 B IT 1029419B
Authority
IT
Italy
Prior art keywords
procedure
fixing
product obtained
conductor element
contact member
Prior art date
Application number
IT47943/75A
Other languages
English (en)
Italian (it)
Original Assignee
Gen Instrument Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23840939&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=IT1029419(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Gen Instrument Corp filed Critical Gen Instrument Corp
Application granted granted Critical
Publication of IT1029419B publication Critical patent/IT1029419B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/302—Cu as the principal constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H10W70/24—Conductive package substrates serving as an interconnection, e.g. metal plates characterised by materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Ceramic Products (AREA)
  • Wire Bonding (AREA)
IT47943/75A 1974-04-24 1975-01-31 Rpocedimento per fissare un elemnto conduttor ad un dispositivo a semiconduttore e prodotto ottenuto IT1029419B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/463,678 US3930306A (en) 1974-04-24 1974-04-24 Process for attaching a lead member to a semiconductor device

Publications (1)

Publication Number Publication Date
IT1029419B true IT1029419B (it) 1979-03-10

Family

ID=23840939

Family Applications (1)

Application Number Title Priority Date Filing Date
IT47943/75A IT1029419B (it) 1974-04-24 1975-01-31 Rpocedimento per fissare un elemnto conduttor ad un dispositivo a semiconduttore e prodotto ottenuto

Country Status (8)

Country Link
US (1) US3930306A (enExample)
JP (1) JPS50147285A (enExample)
CA (1) CA1008566A (enExample)
DE (1) DE2518305C2 (enExample)
FR (1) FR2321193A1 (enExample)
GB (1) GB1465010A (enExample)
HK (1) HK87679A (enExample)
IT (1) IT1029419B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2514922C2 (de) * 1975-04-05 1983-01-27 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Gegen thermische Wechselbelastung beständiges Halbleiterbauelement
US4059837A (en) * 1975-04-07 1977-11-22 Hitachi, Ltd. Glass-moulded type semiconductor device
JPS54107455A (en) * 1978-02-10 1979-08-23 Hitachi Ltd Self-melting brazing material
FR2549292B1 (fr) * 1983-07-12 1986-10-10 Silicium Semiconducteur Ssc Procede de montage de diode
US4757610A (en) * 1986-02-21 1988-07-19 American Precision Industries, Inc. Surface mount network and method of making
US5008735A (en) * 1989-12-07 1991-04-16 General Instrument Corporation Packaged diode for high temperature operation
US6642078B2 (en) * 2000-08-28 2003-11-04 Transpo Electronics, Inc. Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators
US7216796B2 (en) * 2004-05-10 2007-05-15 General Electric, Company Crevice corrosion-resistant liquid-cooled armature bar clip-to-strand connection and related method
US7414226B2 (en) * 2004-11-19 2008-08-19 General Electric Company Movable heating method and system having fixed heating source for brazing stator bars
US7219827B2 (en) * 2004-11-19 2007-05-22 General Electric Company Braze end isolation layer for generator armature winding bar and method for applying the isolation layer
CN105149813A (zh) * 2015-09-30 2015-12-16 杭州华光焊接新材料股份有限公司 一种含微量铟的低银铜磷钎料
CN107170727A (zh) * 2017-06-02 2017-09-15 朝阳无线电元件有限责任公司 一种i类冶金键合二极管设计与制造技术
CN108581269A (zh) * 2018-05-02 2018-09-28 重庆金荣金属有限公司 一种铜基中温复合焊料

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3321828A (en) * 1962-01-02 1967-05-30 Gen Electric Aluminum brazing
DE1207769B (de) * 1962-02-13 1965-12-23 Telefunken Patent Ternaeres Hartlot auf Silber-Kupfer-Basis
DE1439160A1 (de) * 1962-07-26 1969-10-23 Siemens Ag Elektrisch steuerbare Halbleiteranordnung bzw. Halbleiterstromtor
DE1614653C3 (de) * 1967-11-15 1979-06-21 Semikron Gesellschaft Fuer Gleichrichterbau Und Elektronik Mbh, 8500 Nuernberg Halbleiteranordnung hoher Strombelastbarkeit
US3844029A (en) * 1972-02-02 1974-10-29 Trw Inc High power double-slug diode package

Also Published As

Publication number Publication date
HK87679A (en) 1980-01-04
AU7968175A (en) 1976-10-07
FR2321193A1 (fr) 1977-03-11
DE2518305C2 (de) 1984-10-18
GB1465010A (en) 1977-02-16
FR2321193B1 (enExample) 1980-05-09
CA1008566A (en) 1977-04-12
US3930306A (en) 1976-01-06
DE2518305A1 (de) 1975-11-06
JPS50147285A (enExample) 1975-11-26

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19931231